AMD XCV200-6BG352C

Overview

XCV200-6BG352C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block RAM and LUTs configurable as 16-bit RAM/shift register), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV200-6BG352C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility (LVTTL, HSTL, SSTL), and migration guidance from smaller Virtex devices.

Technical Context

The XCV200-6BG352C implements a hierarchical routing architecture with General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB reuse across logic revisions. Its CLBs contain two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and dual-port synchronous storage elements.

Each IOB supports independent input/output flip-flops with programmable polarity, synchronous/asynchronous set/reset, and optional input delay to eliminate pad-to-pad hold time. Eight I/O banks enforce voltage domain separation: VCCO must be uniform per bank (3.3 V, 2.5 V, or 1.5 V), and VREF-when required-is shared across all pins in a bank.

Key Specifications

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 25 mm × 25 mm, 1.27 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-6BG352C, XCV200-6FG456C offers identical logic resources in a thermally superior package, while XCV300-6BG432C provides 36% more logic cells and 14% more I/O in a mechanically compatible but larger footprint - both serve as validated migration paths within the Virtex family.

Availability

XCV200-6BG352C is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed data acquisition systems, industrial motion control units, and legacy protocol gateway designs requiring stable component supply over extended production lifecycles.

Supply support for XCV200-6BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and design tools now integral to adaptive computing platforms.

The Virtex family was engineered for high-performance, high-density system integration - targeting applications demanding 200 MHz synchronous operation, mixed-voltage I/O interfacing, and hardware-reconfigurable logic in telecommunications infrastructure, test equipment, and industrial automation.

FAQ

Is XCV200-6BG352C still in production or considered obsolete?

XCV200-6BG352C is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). However, Aetrix Electronics maintains legacy inventory and offers traceable, tested units for ongoing maintenance and long-lifecycle industrial programs. No new silicon fabrication occurs, but existing stock is fully functional and conforms to original specifications.

What configuration modes does XCV200-6BG352C support?

XCV200-6BG352C supports four configuration modes: Master Serial (drives external PROM), Slave Serial (accepts bitstream from microcontroller), SelectMAP (8-bit parallel interface), and JTAG (boundary-scan programming/debugging). Mode selection is controlled by M0–M2 pins at power-up, and all modes load the same SRAM-based configuration memory.

Can XCV200-6BG352C interface directly with 5 V TTL logic?

XCV200-6BG352C supports 5 V-tolerant inputs for LVTTL and PCI 5 V standards only - output drivers are not 5 V tolerant. When interfacing with 5 V systems, external level shifters or series resistors are required for outputs, while inputs may connect directly if VCCO = 3.3 V and the I/O standard is explicitly listed as 5 V tolerant in Table 1 of DS003-2.

How many clock regions does XCV200-6BG352C have, and how are they distributed?

XCV200-6BG352C has four dedicated global clock input pins (GCLK0–GCLK3), each feeding an independent low-skew clock network. These distribute to all CLBs and IOBs, with 24 secondary local clock nets available for regional timing control. The architecture does not define discrete "clock regions" - instead, clock routing is hierarchical and software-determined during place-and-route.

Does XCV200-6BG352C include built-in analog functionality such as ADC or temperature sensing?

XCV200-6BG352C includes a die-temperature sensor diode for thermal monitoring, but no integrated ADC, DAC, or analog front-end circuitry. Analog signal acquisition requires external converters; the FPGA processes digital data streams via its 284 I/Os and logic fabric. Sensor diode output must be read using external bias circuitry and measurement equipment.