AMD XCV200-6FG256C

Overview

XCV200-6FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) delivering 236,666 system gates in a 28×42 CLB array with 5,292 logic cells. It supports up to 284 user I/O pins in a 256-ball fine-pitch BGA (FG256) package, features four delay-locked loops (DLLs), and achieves system performance up to 200 MHz - validated for 66-MHz PCI compliance and Compact PCI hot-swap operation.

For engineers reviewing the XCV200-6FG256C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, SelectIO™ interface compatibility, block RAM configuration options, and real-world timing behavior for high-speed synchronous design validation.

Technical Context

The XCV200-6FG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift registers.

I/O functionality is organized into eight independent banks, each supporting mixed voltage standards (e.g., LVTTL, SSTL3, HSTL Class IV) under shared VCCO and single-VREF constraints. Each IOB includes three storage elements with independent clock enable, synchronous/asynchronous set/reset, and programmable polarity on all control signals.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG256) with 256 solder balls, 1.0 mm pitch, body size 27 mm × 27 mm, RoHS-compliant lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200-6FG256C, XCV200-6BG256C offers identical logic performance but demands mechanical redesign, whereas XCV300-6FG456C delivers scalable headroom in compatible packaging - making it the preferred upgrade for I/O- or memory-constrained implementations.

Availability

XCV200-6FG256C is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed data acquisition systems, telecom line card interfaces, and legacy system emulation requiring stable component supply throughout extended product lifecycles.

Supply support for XCV200-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design toolchains widely adopted in aerospace, communications, and industrial automation.

The Virtex family - including XCV200-6FG256C - was engineered for high-performance, high-density logic replacement in systems demanding 200 MHz synchronous operation, multi-standard I/O, and deterministic clock management without ASIC-level NRE costs.

FAQ

What is the maximum operating frequency supported by the XCV200-6FG256C?

The XCV200-6FG256C is rated for system performance up to 200 MHz, validated under worst-case timing conditions at commercial temperature range (0°C to +85°C). This includes register-to-register paths, I/O setup/hold, and internal routing delays - confirmed in Table 2 of DS003-1 (v4.0) for functions like pipelined multipliers and address decoders.

Does the XCV200-6FG256C support JTAG boundary scan testing?

Yes, the XCV200-6FG256C integrates full IEEE 1149.1-compliant boundary scan logic across all user I/O pins and internal logic resources. The TCK, TMS, TDI, and TDO pins provide standard access for in-system programming, fault isolation, and interconnect verification without physical probe contact.

How many block RAMs does the XCV200-6FG256C contain, and what are their configurations?

The XCV200-6FG256C contains 14 block SelectRAM units, each providing 4,096 bits of synchronous dual-ported memory. As shown in Table 4 of DS003-2 (v4.0), each block supports configurable port widths (1–16 bits) and depths (256–4096), enabling flexible bus-width conversion and independent read/write addressing per port.

Can the XCV200-6FG256C be used in hot-swap applications?

Yes, the XCV200-6FG256C supports Compact PCI hot-swap operation through IOB-level clamping diodes, weak-keeper circuits, and controlled power-up sequencing. Its I/O structure meets PCI Hot-Plug Specification requirements for voltage ramp control, current limiting, and bus isolation during card insertion or removal.

What I/O standards are supported by the XCV200-6FG256C's SelectIO™ interface?

The XCV200-6FG256C supports 16 I/O standards including LVTTL (5 V tolerant), SSTL3 Class I/II, HSTL Class IV, GTL+, and PCI 3.3 V - as documented in Table 1 of DS003-2 (v4.0). Each I/O bank allows mixing only standards sharing the same VCCO and VREF, enforced by physical pin grouping and internal voltage routing.