AMD XCV200-6FG456C

Overview

XCV200-6FG456C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells in a 28×42 CLB array, and 284 user I/O pins in a 456-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block SelectRAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV200-6FG456C datasheet, pinout, applications, or equivalent options, key selection considerations include its -6 speed grade (200 MHz system performance), 2.5 V core voltage, 0.22 μm 5-layer metal CMOS process, IEEE 1149.1 boundary-scan support, and multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, HSTL Class IV, and SSTL2.

Technical Context

The XCV200-6FG456C implements a hierarchical routing architecture with a General Routing Matrix (GRM), VersaBlock-local interconnect, and VersaRing I/O ring to optimize place-and-route efficiency. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and dual-port 4k-bit block RAMs organized in two vertical columns.

Each IOB supports programmable input/output standards via independent VCCO and optional VREF per I/O bank, with three storage elements per IOB (configurable as DFFs or latches), synchronous/asynchronous set/reset, and weak-keeper circuitry. The device uses SRAM-based configuration with four programming modes (JTAG, master/slave serial, SelectMAP™) and includes a die-temperature sensor diode.

Key Specifications

Pinout & Package

Package: 456-ball Fine-pitch Ball Grid Array (FG456), RoHS-compliant, 27 mm × 27 mm body, 1.0 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV200-6FG456C, XCV200-6BG352C trades I/O count and thermal performance for compactness, while XCV300-6FG456C delivers higher logic density in identical packaging-enabling seamless migration paths without PCB redesign but requiring updated timing closure and power delivery planning.

Availability

XCV200-6FG456C is available at Aetrix Electronics and suitable for industrial control systems, telecom infrastructure equipment, and high-speed test instrumentation requiring stable component supply throughout extended product lifecycles.

Supply support for XCV200-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and EDA tools for high-performance digital system design.

The Virtex family was designed as Xilinx's flagship high-density, high-performance FPGA platform targeting demanding applications such as wired/wireless infrastructure, military/aerospace systems, and scientific computing-emphasizing silicon efficiency, clock management, and I/O flexibility.

FAQ

Is XCV200-6FG456C still in production or supported?

XCV200-6FG456C is marked obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). However, Aetrix Electronics maintains legacy inventory with full traceability and offers engineering support, including pin-compatible migration guidance and obsolescence mitigation planning for existing designs using XCV200-6FG456C.

What are the critical power supply requirements for XCV200-6FG456C?

XCV200-6FG456C requires a tightly regulated 2.5 V ±3% core supply (VCCINT) with low-noise decoupling, plus eight independent I/O bank supplies (VCCO) ranging from 1.5 V to 3.3 V depending on interface standard. Each VCCO bank must be isolated; mixing incompatible standards (e.g., HSTL Class I and SSTL3) within one bank violates I/O banking rules and risks functional failure of XCV200-6FG456C.

Does XCV200-6FG456C support JTAG boundary scan for PCB testing?

Yes, XCV200-6FG456C fully complies with IEEE 1149.1 boundary-scan architecture. Its TCK, TMS, TDI, and TDO pins enable in-system programming, logic verification, and interconnect testing without physical probe access. This capability is factory-tested and documented in DS003-4 (Pinout Tables), making XCV200-6FG456C suitable for high-reliability manufacturing environments.

Can XCV200-6FG456C interface directly with DDR SDRAM?

XCV200-6FG456C supports SSTL2 Class I/II I/O standards required for DDR SDRAM interfaces, with up to 200 MHz clock rates using DLL-synchronized outputs. However, it lacks built-in DDR controller hard IP; successful implementation requires careful timing closure of DQS strobes, write leveling, and on-die termination modeling - all validated in Xilinx Application Note XAPP130 for XCV200-6FG456C.

What configuration modes does XCV200-6FG456C support?

XCV200-6FG456C supports four configuration modes: Master Serial (loads bitstream from external PROM), Slave Serial (bitstream driven by external controller), SelectMAP™ (8-bit parallel interface), and JTAG (boundary-scan programming). All modes use SRAM-based configuration, enabling unlimited reprogramming - a core architectural feature of XCV200-6FG456C that distinguishes it from one-time-programmable alternatives.