AMD XCV200-6PQ240C

Overview

XCV200-6PQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 236,666 system gates, 5,292 logic cells, and 284 maximum user I/O pins in a 240-pin Plastic Quad Flat Pack (PQFP) package. It features four delay-locked loops (DLLs), hierarchical memory (including 57,344 bits of block RAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV200-6PQ240C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility (LVTTL, HSTL, SSTL), and migration guidance from PQ240-package Virtex family members.

Technical Context

The XCV200-6PQ240C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and dual-port synchronous storage elements.

Each IOB supports independent input/output flip-flops with programmable set/reset polarity, weak-keeper circuits, and selectable drive strength (up to 24 mA source / 48 mA sink). I/O banks enforce voltage domain isolation: VCCO must be uniform per bank (e.g., 3.3 V for LVTTL/PCI, 1.5 V for HSTL Class IV), and VREF is required for standards like SSTL2/SSTL3 but incompatible with 5 V-tolerant modes.

Key Specifications

Pinout & Package

Package: 240-pin Plastic Quad Flat Pack (PQFP), 0.5 mm pitch, 32.5 mm × 32.5 mm body size, JEDEC MO-118 compliant. Thermal pad not present; no exposed die attach pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV200-6PQ240C, XCV200-6HQ240C offers superior thermal reliability in sealed environments, while XCV300-6PQ240C provides scalable logic capacity within identical board layout - both preserve pin-compatible migration paths without requiring schematic or layout changes.

Availability

XCV200-6PQ240C is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed data acquisition systems, and legacy ASIC replacement programs requiring stable component supply over extended production lifecycles.

Supply support for XCV200-6PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGA architecture and developed the Virtex family to deliver ASIC-class performance with field-upgradable flexibility.

The Virtex family was designed for high-bandwidth, compute-intensive applications including wired/wireless infrastructure, defense electronics, and scientific instrumentation - emphasizing clock management, memory hierarchy, and multi-standard I/O.

FAQ

What is the maximum operating frequency supported by the XCV200-6PQ240C?

The XCV200-6PQ240C is rated for 200 MHz system clock performance under worst-case timing conditions, as confirmed by its -6 speed grade. This includes synchronous I/O operations compliant with 66-MHz PCI specifications. Internal logic paths achieve sub-5 ns propagation delays for critical functions like register-to-register transfers and pipelined multipliers, validated in Xilinx DS003-1 Table 2.

Does the XCV200-6PQ240C support hot-swap functionality in Compact PCI systems?

Yes, the XCV200-6PQ240C supports hot-swappable operation in Compact PCI systems. Its architecture includes dedicated circuitry for safe insertion/removal, and the PROGRAM_B pin enables controlled reconfiguration upon card insertion. This capability is explicitly documented in the DS003-1 feature list and validated against PICMG 2.1 specifications for Compact PCI hot-swap compliance.

How many block RAMs does the XCV200-6PQ240C contain, and what are their configurations?

The XCV200-6PQ240C contains 14 block SelectRAM units, totaling 57,344 bits of dedicated memory. Each block is a fully synchronous dual-ported 4096-bit RAM with independent read/write controls per port and programmable aspect ratios (e.g., 16×256, 8×512, 4×1024). These blocks support true dual-port operation with no read/write collision, enabling concurrent CPU and DMA access as detailed in DS003-2 Table 3 and Figure 6.

Can the XCV200-6PQ240C interface directly with DDR SDRAM?

Yes, the XCV200-6PQ240C can interface directly with DDR SDRAM using its SelectIO™ I/O standards. It supports SSTL2 Class I/II (1.25 V) and SSTL3 Class I/II (1.5 V) signaling with precise timing control via DLLs. The device's 284-user I/O count and bank-isolated VCCO/VREF allow dedicated DDR data/address/control groups with matched trace lengths - confirmed in DS003-2 Table 1 and I/O Banking section.

Is the XCV200-6PQ240C still in active production or considered obsolete?

The XCV200-6PQ240C is classified as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with end-of-life status confirmed in XCN10016. However, Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle management support, including last-time buy coordination and cross-reference guidance to functionally compatible Virtex-II or Spartan-6 alternatives where redesign is feasible.