AMD XCV200E-6BG352C

Overview

XCV200E-6BG352C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 306,393 system gates and 5,292 logic cells in a 352-ball BGA package. It delivers 130 MHz internal performance (four LUT levels), supports PCI 3.3 V/33–66 MHz compliance, and integrates eight digital Delay-Locked Loops (DLLs) for clock management - used in high-speed communication interface design and embedded signal processing.

For engineers reviewing the XCV200E-6BG352C datasheet, pinout, applications, or equivalent options, key selection considerations include its 260-user-I/O count in BG352 packaging, 1.8 V core voltage with 3.3 V I/O tolerance, LVDS/LVPECL differential signaling up to 622 Mb/s, and true dual-port block RAM capability for memory-intensive FPGA implementations.

Technical Context

The XCV200E-6BG352C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, set/reset, and polarity control.

Its IOBs support 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL, with banked VCCO/VREF constraints. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication - enabling precise timing control across high-speed source-synchronous interfaces.

Key Specifications

Pinout & Package

Package: 352-ball Ball Grid Array (BG352), 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200E-6BG352C, the -7 speed grade improves timing margin for high-frequency control loops, while the FG456 variant trades package size for I/O scalability and thermal headroom - neither offers pin compatibility, but both share identical bitstream architecture and toolchain support.

Availability

XCV200E-6BG352C is available at Aetrix Electronics and suitable for high-reliability industrial control, telecom infrastructure, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XCV200E-6BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for adaptive computing.

The Virtex-E family was engineered for high-performance, low-power reconfigurable logic in communications and computing - delivering 30% speed gain over prior Virtex devices using a 0.18 μm process and optimized CLB routing.

FAQ

What is the maximum differential I/O pair count supported by XCV200E-6BG352C?

XCV200E-6BG352C supports up to 119 differential I/O pairs in the BG352 package, enabling 238 pins for LVDS, BLVDS, or LVPECL signaling. This count is fixed per device/package combination and confirmed in Table 3 of DS022-1 (v2.3). The actual usable count depends on I/O banking constraints and VCCO/VREF allocation across the eight banks.

Does XCV200E-6BG352C support 5 V-tolerant I/Os?

XCV200E-6BG352C does not natively support 5 V-tolerant I/Os. Its I/O pins are rated for 3.3 V operation and tolerate 5 V only when an external 100 Ω series resistor is used per pin. PCI 5 V signaling is explicitly unsupported. For true 5 V tolerance, external level-shifting circuitry is required.

Can XCV200E-6BG352C be configured via JTAG in-system?

Yes, XCV200E-6BG352C supports IEEE 1149.1 JTAG boundary scan for in-system configuration, debugging, and verification. The TCK, TMS, TDI, and TDO pins are dedicated and functional across all operating conditions. JTAG mode allows bitstream loading without requiring external PROM or microcontroller intervention.

What clock frequencies can the DLLs in XCV200E-6BG352C generate?

The eight DLLs in XCV200E-6BG352C support input frequencies up to 300+ MHz (LVPECL/LVDS) and provide 4× frequency multiplication, duty-cycle correction, and zero-delay clock forwarding. Output frequencies depend on input clock and multiplication factor - e.g., a 100 MHz LVDS input yields 400 MHz internally synchronized outputs for DDR applications.

Is XCV200E-6BG352C pin-compatible with other Virtex-E devices in BG352 packaging?

XCV200E-6BG352C is pin-compatible with XCV100E-6BG352C and XCV300E-6BG352C in the same BG352 package, per DS022-1 Section "Virtex-E Device/Package Combinations". However, I/O bank assignments and VCCO/VREF pin allocations differ across densities - requiring careful review of Module 4 pinout tables before migration.