AMD XCV200E-6FG256C

Overview

XCV200E-6FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 306,393 system gates and 63,504 logic cells in a 28 × 42 CLB array. It delivers up to 240 MHz synchronous system performance, supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops (DLLs) for clock management. It is used in high-speed communication interface design, protocol bridging, and embedded reconfigurable computing systems.

For engineers reviewing the XCV200E-6FG256C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration options, and package-specific routing limitations - all confirmed against DS022-1 (v2.3) and DS022-2 (v2.8) production specifications.

Technical Context

The XCV200E-6FG256C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and peripheral VersaRing™ routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 I/O standards including LVTTL, LVCMOS2, SSTL3, HSTL, PCI33_3, LVDS, and LVPECL, with banked VCCO (1.5–3.3 V) and VREF (0.75–1.5 V) domains. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication - each DLL operates independently with mirrored clock outputs.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG256) with 256 balls, 1.0 mm pitch, and 176 user I/O pins distributed across 8 I/O banks (Bank 0–7). Banks are split per edge (e.g., top-left Bank 0, top-right Bank 1), each requiring uniform VCCO and at most one VREF voltage.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV200E-6FG256C, the -7 variant improves timing margin without changing footprint, while the FG456 variant expands I/O scalability at the cost of mechanical compatibility - neither is pin-compatible replacement due to distinct ball maps and thermal profiles.

Availability

XCV200E-6FG256C is available at Aetrix Electronics and suitable for high-speed serial bridging, PCI protocol translation, DDR memory control, and reconfigurable DSP applications requiring stable component supply throughout extended product lifecycles.

Supply support for XCV200E-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered SRAM-based FPGA architectures and established industry standards for HDL synthesis and place-and-route toolchains.

The Virtex-E family was designed for high-performance reconfigurable computing in communications infrastructure, where deterministic timing, mixed-signal I/O flexibility, and on-chip memory bandwidth were critical - targeting systems requiring >200 MHz clock rates and >600 Mb/s serial throughput.

FAQ

What is the maximum differential I/O pair count supported by XCV200E-6FG256C?

XCV200E-6FG256C supports up to 119 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This count is fixed for the XCV200E device regardless of package; however, only 176 total user I/O pins are available in the FG256 package, limiting practical differential pair deployment to configurations that fit within physical pin constraints and I/O banking rules.

Does XCV200E-6FG256C support PCI-X or only conventional PCI?

XCV200E-6FG256C supports only conventional PCI (33/66 MHz, 32/64-bit, 3.3 V), as explicitly stated in the "PCI compliant" feature list of DS022-1. It does not implement PCI-X signaling protocols, clocking schemes, or arbitration logic - those require later Virtex-II or dedicated PCI-X controller IP cores not natively embedded in the XCV200E-6FG256C architecture.

Can XCV200E-6FG256C operate with VCCINT = 2.5 V for backward compatibility with Virtex designs?

No. XCV200E-6FG256C requires VCCINT = 1.8 V ± 0.1 V, as specified in DS022-1 Section "Virtex-E Compared to Virtex Devices". Applying 2.5 V violates absolute maximum ratings and will damage the device. The 1.8 V core is fundamental to its 0.18 μm process and lower power operation - no voltage scaling mode or compatibility setting exists.

Is the die-temperature sensor diode in XCV200E-6FG256C calibrated for absolute temperature measurement?

The die-temperature sensor diode in XCV200E-6FG256C provides relative thermal monitoring only. DS022-2 (v2.8) states it is "for thermal monitoring" but does not specify factory calibration or accuracy. Users must perform system-level characterization using external reference sensors to derive usable °C values - no built-in ADC or lookup table is provided.

Are the eight DLLs in XCV200E-6FG256C mutually independent in terms of input clock sources?

Yes. Each of the eight DLLs in XCV200E-6FG256C accepts an independent clock input from dedicated global clock pins (GCLK0–GCLK3 plus secondary routing paths), and can be configured separately for multiplication, phase shift, and duty-cycle correction. DS022-2 confirms "each individual DLL is slightly improved with easier clock mirroring", confirming full functional independence.