AMD XCV200E-6FG256I
- Part No.:
- XCV200E-6FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XCV200E-6FG256I.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,064
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Product details
Overview
XCV200E-6FG256I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 306,393 system gates and 63,504 logic cells in a 28 × 42 CLB array. It features eight digital Delay-Locked Loops (DLLs), up to 176 user I/O pins in FG256 package, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications and industrial control systems.
For engineers reviewing the XCV200E-6FG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (130 MHz internal performance), 1.8 V core voltage, dual-port block RAM (114,688 bits), differential I/O capability, and industrial temperature range (–40°C to +100°C).
Technical Context
The XCV200E-6FG256I implements a regular FPGA architecture with configurable logic blocks (CLBs) containing four logic cells each, two dedicated carry chains per CLB for arithmetic acceleration, and integrated 4-input LUTs that double as 16×1-bit synchronous RAM. Its IOBs support independent input/output flip-flops with programmable clock enables and dual synchronous/asynchronous set/reset.
Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR applications, and frequency multiplication up to 4×. The device uses banked I/O with VCCO-supplied input buffers for LVTTL/LVCMOS/PCI standards and supports mixed-voltage signaling within banks constrained by shared VCCO and single-VREF rules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 306,393 - defines total logic capacity for gate-equivalent synthesis targeting. |
| Logic Cells | 63,504 - actual programmable elements including LUTs, flip-flops, and carry logic. |
| CLB Array | 28 × 42 - determines maximum routable logic density and placement flexibility. |
| User I/O Pins | 176 - number of configurable single-ended I/Os in FG256 package; supports up to 83 differential pairs. |
| Block RAM Bits | 114,688 - distributed across 28 × 4096-bit true dual-port memory blocks for independent read/write ports. |
| DLL Count | 8 - enables multiple clock domains, jitter reduction, and precise phase alignment for high-speed interfaces. |
| Core Voltage (VCCINT) | 1.8 V - reduces dynamic power vs. 2.5 V Virtex family; requires dedicated low-noise regulation. |
| Speed Grade | -6 - guarantees worst-case register-to-register delay ≤ 4.3 ns and 130 MHz internal performance (4-LUT levels). |
Pinout & Package
Package: Fine Pitch Ball Grid Array (FG256) with 256 balls, 1.0 mm pitch, and 176 user I/O pins arranged across 8 I/O banks (Bank 0–7). Thermal pad on underside; no exposed die attach pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew clock inputs routed to all DLLs and CLBs; require external termination for LVPECL/LVDS. |
| VCCINT | Core Power Supply | 1.8 V supply for CLBs, RAM, and DLLs; must be filtered separately from I/O supplies. |
| VCCO_0–VCCO_7 | I/O Bank Power | Independent 1.5–3.3 V supplies per bank; define output voltage and input buffer reference for each bank. |
| VREF_0–VREF_7 | Input Threshold Reference | External voltage source for SSTL/HSTL/GTL standards; one per bank, internally tied across all VREF pins in bank. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for configuration, debugging, and in-system verification. |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI) with per-bank VCCO/VREF control - enables mixed-signal board integration without level shifters. |
| SelectRAM+™ Memory Hierarchy | 114,688 bits of true dual-port block RAM + 75,264 bits distributed RAM - allows simultaneous read/write access for FIFOs, frame buffers, and protocol engines. |
| SelectLink™ DDR Interface | Hardened DDR link path between CLBs and block RAM - delivers 200 MHz ZBT SRAM and 200 Mb/s DDR SDRAM interface timing compliance. |
| Digital DLL Clock Management | Eight DLLs with 4× multiplication, duty-cycle correction, and LVPECL/LVDS clock deskewing - eliminates external clock synthesizers in high-speed serial designs. |
| Flexible Logic Architecture | Dedicated carry chains, F5/F6 multiplexers, and 4-LUTs with RAM/shift-register modes - accelerates arithmetic, wide-logic, and data capture functions without LUT resource penalty. |
Applications
| High-Speed Communications | Industrial Motion Control |
|---|---|
Use Scenario: Line-card processing in telecom base stations requiring multi-gigabit SerDes aggregation and packet classification. IC Role / Device Role / Timing Role: Configurable protocol engine implementing HDLC, GFP, and Ethernet MAC offload with deterministic latency via DLL-synchronized clocks. Use Value: 622 Mb/s LVDS I/O and 8 DLLs enable direct interfacing to framer ICs and jitter-tolerant timing recovery without external PLLs. |
Use Scenario: Real-time servo loop execution in CNC machines with synchronized analog I/O, encoder feedback, and PWM generation. IC Role / Device Role / Timing Role: Deterministic logic fabric executing PID control at 200 kHz with sub-microsecond interrupt response using dedicated carry chains and fast registers. Use Value: 130 MHz internal performance and dual-port block RAM allow concurrent motion trajectory calculation and I/O buffering with zero bus contention. |
| Medical Imaging Data Acquisition | Test & Measurement Instrumentation |
Use Scenario: High-fidelity ultrasound beamforming where channel data must be time-aligned, filtered, and summed before ADC digitization. IC Role / Device Role / Timing Role: Time-critical signal processor implementing FIR filters and delay compensation using LUT-based arithmetic and distributed RAM lookup tables. Use Value: 4-LUTs with embedded 16-bit shift registers capture burst-mode echo data at >100 MSPS while maintaining sample-accurate phase alignment. |
Use Scenario: Modular PXI chassis controller synchronizing multiple digitizers and arbitrary waveform generators with nanosecond-level trigger distribution. IC Role / Device Role / Timing Role: Precision timing hub generating phase-locked clocks, calibrated delays, and deterministic trigger sequences using eight independent DLLs. Use Value: Zero-delay LVPECL clock conversion and 50% duty-cycle synthesis ensure <100 ps jitter accumulation across 16-channel parallel acquisition. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV200E-7FG256I | Higher speed grade (-7): 3.8 ns adder delay vs. 4.3 ns; same logic density, I/O count, and package. | Suitable for designs requiring >130 MHz internal clocking or tighter setup/hold margins on LVDS interfaces. | Select XCV200E-7FG256I only if timing closure fails at -6 grade; no PCB change required but may increase power consumption. |
| XCV200E-6PQ240C | Different package (PQ240, 240-pin PQFP) and commercial temp range (0°C to +85°C); 158 user I/O vs. 176. | Preferred for cost-sensitive, lower-I/O-count applications where thermal management permits PQFP packaging. | Choose XCV200E-6PQ240C for prototyping or non-industrial environments; requires PCB redesign due to different footprint and thermal profile. |
Compared with XCV200E-6FG256I, the -7 variant offers higher timing margin without architectural change, while the PQ240 variant trades I/O count and temperature rating for lower assembly cost and simpler thermal design - neither is pin-compatible, but both share identical bitstream compatibility and toolchain support.
Availability
XCV200E-6FG256I is available at Aetrix Electronics and suitable for high-reliability industrial control, medical imaging subsystems, and telecom infrastructure requiring stable component supply across extended product lifecycles.
Supply support for XCV200E-6FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for high-performance digital system design.
The Virtex-E family was engineered for high-speed, high-density logic implementation in communications and computing systems - delivering improved speed/power efficiency over Virtex through 0.18 μm process and optimized routing architecture.
FAQ
What is the maximum differential I/O pair count supported by XCV200E-6FG256I?
XCV200E-6FG256I supports up to 83 differential I/O pairs. This is derived from Table 3 in DS022-1, which lists 83 for XCV200E in FG256 package. Each pair consumes two user I/O pins, and the total user I/O count of 176 allows exactly 83 pairs with two pins remaining for single-ended use or power/ground.
Does XCV200E-6FG256I support 5 V tolerant I/O?
XCV200E-6FG256I does not support native 5 V tolerant I/O. Its I/O pins are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin, as stated in DS022-1 Module 1. PCI 5 V operation is explicitly unsupported.
Is XCV200E-6FG256I pin-compatible with earlier Virtex family devices?
XCV200E-6FG256I is not pin-compatible with original Virtex devices. While same-package Virtex-E and Virtex devices are *nearly* pin-compatible, DS022-1 states "with some minor exceptions" and directs users to the pinout section for details - confirming no guaranteed drop-in replacement exists.
What clock frequencies can XCV200E-6FG256I achieve with its DLLs?
XCV200E-6FG256I DLLs support LVPECL and LVDS clock inputs for >300 MHz clocks, and provide 4× frequency multiplication. With -6 speed grade, synchronous system performance reaches 240 MHz including I/O, and internal logic operates at up to 130 MHz (four LUT levels).
How much block RAM is integrated into XCV200E-6FG256I?
XCV200E-6FG256I integrates 114,688 bits of block RAM, organized as 28 × 4096-bit true dual-port memory blocks. This is confirmed in Table 4 of DS022-2 (v2.8), which lists "XCV200E: 114,688" under Block SelectRAM Bits.
XCV200E-6FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 114688
- Number of I/O:
- 176
- Number of Gates:
- 306393
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XCV200E-6FG256I FAQ
1.How can I place an order for XCV200E-6FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV200E-6FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV200E-6FG256I reliable?
The price and inventory of XCV200E-6FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200E-6FG256I is usually 5 days.
3.What payment methods are accepted for XCV200E-6FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200E-6FG256I transactions.
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4.How is shipping managed for XCV200E-6FG256I?
XCV200E-6FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV200E-6FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV200E-6FG256I?
For technical support, including XCV200E-6FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200E-6FG256I requirements.
6.How does Aetrix verify that XCV200E-6FG256I is sourced from the original manufacturer or authorized distributors?
All XCV200E-6FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200E-6FG256I meets industry standards.
7.What is the process for return or replacement of XCV200E-6FG256I?
All XCV200E-6FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XCV200E-6FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV200E-6FG256I part is unused and in its original packaging.
Return procedure for XCV200E-6FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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