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AMD XCV200E-6FG256I

Part No.:
XCV200E-6FG256I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BGA
Datasheet:
AetrixXCV200E-6FG256I.pdf
Description:
IC FPGA 176 I/O 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,064

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Product details

Overview

XCV200E-6FG256I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 306,393 system gates and 63,504 logic cells in a 28 × 42 CLB array. It features eight digital Delay-Locked Loops (DLLs), up to 176 user I/O pins in FG256 package, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications and industrial control systems.

For engineers reviewing the XCV200E-6FG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (130 MHz internal performance), 1.8 V core voltage, dual-port block RAM (114,688 bits), differential I/O capability, and industrial temperature range (–40°C to +100°C).

Technical Context

The XCV200E-6FG256I implements a regular FPGA architecture with configurable logic blocks (CLBs) containing four logic cells each, two dedicated carry chains per CLB for arithmetic acceleration, and integrated 4-input LUTs that double as 16×1-bit synchronous RAM. Its IOBs support independent input/output flip-flops with programmable clock enables and dual synchronous/asynchronous set/reset.

Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR applications, and frequency multiplication up to 4×. The device uses banked I/O with VCCO-supplied input buffers for LVTTL/LVCMOS/PCI standards and supports mixed-voltage signaling within banks constrained by shared VCCO and single-VREF rules.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 306,393 - defines total logic capacity for gate-equivalent synthesis targeting.
Logic Cells 63,504 - actual programmable elements including LUTs, flip-flops, and carry logic.
CLB Array 28 × 42 - determines maximum routable logic density and placement flexibility.
User I/O Pins 176 - number of configurable single-ended I/Os in FG256 package; supports up to 83 differential pairs.
Block RAM Bits 114,688 - distributed across 28 × 4096-bit true dual-port memory blocks for independent read/write ports.
DLL Count 8 - enables multiple clock domains, jitter reduction, and precise phase alignment for high-speed interfaces.
Core Voltage (VCCINT) 1.8 V - reduces dynamic power vs. 2.5 V Virtex family; requires dedicated low-noise regulation.
Speed Grade -6 - guarantees worst-case register-to-register delay ≤ 4.3 ns and 130 MHz internal performance (4-LUT levels).

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG256) with 256 balls, 1.0 mm pitch, and 176 user I/O pins arranged across 8 I/O banks (Bank 0–7). Thermal pad on underside; no exposed die attach pad.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Dedicated low-skew clock inputs routed to all DLLs and CLBs; require external termination for LVPECL/LVDS.
VCCINT Core Power Supply 1.8 V supply for CLBs, RAM, and DLLs; must be filtered separately from I/O supplies.
VCCO_0–VCCO_7 I/O Bank Power Independent 1.5–3.3 V supplies per bank; define output voltage and input buffer reference for each bank.
VREF_0–VREF_7 Input Threshold Reference External voltage source for SSTL/HSTL/GTL standards; one per bank, internally tied across all VREF pins in bank.
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test interface for configuration, debugging, and in-system verification.
PROGRAM_B Configuration Reset Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence.

Key Features

Feature Design Value
SelectI/O+™ Technology Supports 20 I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI) with per-bank VCCO/VREF control - enables mixed-signal board integration without level shifters.
SelectRAM+™ Memory Hierarchy 114,688 bits of true dual-port block RAM + 75,264 bits distributed RAM - allows simultaneous read/write access for FIFOs, frame buffers, and protocol engines.
SelectLink™ DDR Interface Hardened DDR link path between CLBs and block RAM - delivers 200 MHz ZBT SRAM and 200 Mb/s DDR SDRAM interface timing compliance.
Digital DLL Clock Management Eight DLLs with 4× multiplication, duty-cycle correction, and LVPECL/LVDS clock deskewing - eliminates external clock synthesizers in high-speed serial designs.
Flexible Logic Architecture Dedicated carry chains, F5/F6 multiplexers, and 4-LUTs with RAM/shift-register modes - accelerates arithmetic, wide-logic, and data capture functions without LUT resource penalty.

Applications

High-Speed Communications Industrial Motion Control

Use Scenario: Line-card processing in telecom base stations requiring multi-gigabit SerDes aggregation and packet classification.

IC Role / Device Role / Timing Role: Configurable protocol engine implementing HDLC, GFP, and Ethernet MAC offload with deterministic latency via DLL-synchronized clocks.

Use Value: 622 Mb/s LVDS I/O and 8 DLLs enable direct interfacing to framer ICs and jitter-tolerant timing recovery without external PLLs.

Use Scenario: Real-time servo loop execution in CNC machines with synchronized analog I/O, encoder feedback, and PWM generation.

IC Role / Device Role / Timing Role: Deterministic logic fabric executing PID control at 200 kHz with sub-microsecond interrupt response using dedicated carry chains and fast registers.

Use Value: 130 MHz internal performance and dual-port block RAM allow concurrent motion trajectory calculation and I/O buffering with zero bus contention.

Medical Imaging Data Acquisition Test & Measurement Instrumentation

Use Scenario: High-fidelity ultrasound beamforming where channel data must be time-aligned, filtered, and summed before ADC digitization.

IC Role / Device Role / Timing Role: Time-critical signal processor implementing FIR filters and delay compensation using LUT-based arithmetic and distributed RAM lookup tables.

Use Value: 4-LUTs with embedded 16-bit shift registers capture burst-mode echo data at >100 MSPS while maintaining sample-accurate phase alignment.

Use Scenario: Modular PXI chassis controller synchronizing multiple digitizers and arbitrary waveform generators with nanosecond-level trigger distribution.

IC Role / Device Role / Timing Role: Precision timing hub generating phase-locked clocks, calibrated delays, and deterministic trigger sequences using eight independent DLLs.

Use Value: Zero-delay LVPECL clock conversion and 50% duty-cycle synthesis ensure <100 ps jitter accumulation across 16-channel parallel acquisition.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV200E-7FG256I Higher speed grade (-7): 3.8 ns adder delay vs. 4.3 ns; same logic density, I/O count, and package. Suitable for designs requiring >130 MHz internal clocking or tighter setup/hold margins on LVDS interfaces. Select XCV200E-7FG256I only if timing closure fails at -6 grade; no PCB change required but may increase power consumption.
XCV200E-6PQ240C Different package (PQ240, 240-pin PQFP) and commercial temp range (0°C to +85°C); 158 user I/O vs. 176. Preferred for cost-sensitive, lower-I/O-count applications where thermal management permits PQFP packaging. Choose XCV200E-6PQ240C for prototyping or non-industrial environments; requires PCB redesign due to different footprint and thermal profile.

Compared with XCV200E-6FG256I, the -7 variant offers higher timing margin without architectural change, while the PQ240 variant trades I/O count and temperature rating for lower assembly cost and simpler thermal design - neither is pin-compatible, but both share identical bitstream compatibility and toolchain support.

Availability

XCV200E-6FG256I is available at Aetrix Electronics and suitable for high-reliability industrial control, medical imaging subsystems, and telecom infrastructure requiring stable component supply across extended product lifecycles.

Supply support for XCV200E-6FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and EDA tools for high-performance digital system design.

The Virtex-E family was engineered for high-speed, high-density logic implementation in communications and computing systems - delivering improved speed/power efficiency over Virtex through 0.18 μm process and optimized routing architecture.

FAQ

What is the maximum differential I/O pair count supported by XCV200E-6FG256I?

XCV200E-6FG256I supports up to 83 differential I/O pairs. This is derived from Table 3 in DS022-1, which lists 83 for XCV200E in FG256 package. Each pair consumes two user I/O pins, and the total user I/O count of 176 allows exactly 83 pairs with two pins remaining for single-ended use or power/ground.

Does XCV200E-6FG256I support 5 V tolerant I/O?

XCV200E-6FG256I does not support native 5 V tolerant I/O. Its I/O pins are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin, as stated in DS022-1 Module 1. PCI 5 V operation is explicitly unsupported.

Is XCV200E-6FG256I pin-compatible with earlier Virtex family devices?

XCV200E-6FG256I is not pin-compatible with original Virtex devices. While same-package Virtex-E and Virtex devices are *nearly* pin-compatible, DS022-1 states "with some minor exceptions" and directs users to the pinout section for details - confirming no guaranteed drop-in replacement exists.

What clock frequencies can XCV200E-6FG256I achieve with its DLLs?

XCV200E-6FG256I DLLs support LVPECL and LVDS clock inputs for >300 MHz clocks, and provide 4× frequency multiplication. With -6 speed grade, synchronous system performance reaches 240 MHz including I/O, and internal logic operates at up to 130 MHz (four LUT levels).

How much block RAM is integrated into XCV200E-6FG256I?

XCV200E-6FG256I integrates 114,688 bits of block RAM, organized as 28 × 4096-bit true dual-port memory blocks. This is confirmed in Table 4 of DS022-2 (v2.8), which lists "XCV200E: 114,688" under Block SelectRAM Bits.

XCV200E-6FG256I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
114688
Number of I/O:
176
Number of Gates:
306393
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FBGA (17x17)

XCV200E-6FG256I FAQ

1.How can I place an order for XCV200E-6FG256I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV200E-6FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV200E-6FG256I reliable?

The price and inventory of XCV200E-6FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200E-6FG256I is usually 5 days.

3.What payment methods are accepted for XCV200E-6FG256I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200E-6FG256I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV200E-6FG256I?

XCV200E-6FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV200E-6FG256I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV200E-6FG256I?

For technical support, including XCV200E-6FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200E-6FG256I requirements.

6.How does Aetrix verify that XCV200E-6FG256I is sourced from the original manufacturer or authorized distributors?

All XCV200E-6FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200E-6FG256I meets industry standards.

7.What is the process for return or replacement of XCV200E-6FG256I?

All XCV200E-6FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XCV200E-6FG256I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV200E-6FG256I part is unused and in its original packaging.

Return procedure for XCV200E-6FG256I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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