AMD XCV200E-6FG456C

Overview

XCV200E-6FG456C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 63,504 logic cells, and 284 user I/O pins in a 456-ball Fine-Pitch Ball Grid Array (FG456) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 114,688 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI-compliant 3.3 V interfaces for high-speed communication subsystems in telecom infrastructure.

For engineers reviewing the XCV200E-6FG456C datasheet, pinout, applications, or equivalent options, this device delivers verified 240 MHz synchronous system performance, 130 MHz internal logic speed (four LUT levels), and differential I/O bandwidth exceeding 100 Gb/s - critical for source-synchronous data transmission, DDR memory interfacing, and multi-standard I/O bank partitioning.

Technical Context

The XCV200E-6FG456C implements a regular array architecture with configurable logic blocks (CLBs) containing four logic cells each, dual-slice organization, dedicated carry chains for arithmetic, and F5/F6 multiplexers enabling up to 19-input logic functions. Its IOBs support independent input/output flip-flops with programmable clock enables, synchronous/asynchronous set/reset, and matched delay elements eliminating pad-to-pad hold time.

Eight fully digital DLLs provide zero-delay clock conversion from LVPECL/LVDS inputs to any I/O standard, 50% duty-cycle synthesis for DDR applications, and 4× frequency multiplication. I/O banking enforces VCCO/VREF voltage grouping across eight banks, with LVTTL/LVCMOS2/PCI buffers powered by VCCO (not VCCINT), and strict compatibility rules per bank (e.g., 3.3 V banks support PCI, LVTTL, SSTL3, CTT, GTL+).

Key Specifications

Pinout & Package

Package: 456-ball Fine-Pitch Ball Grid Array (FG456), 1.0 mm pitch, RoHS-compliant, thermal performance optimized for industrial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV200E-6FG456C, the -7 speed grade offers tighter timing margins without layout change, while XCV300E-6FG456C provides gate count headroom at the cost of I/O pin reassignment - both require recompilation but no hardware revision beyond signal routing updates.

Availability

XCV200E-6FG456C is available at Aetrix Electronics and suitable for telecom infrastructure, automated test equipment, industrial imaging, and PCI-based data acquisition requiring stable component supply and long-term lifecycle support.

Supply support for XCV200E-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered SRAM-based FPGA architectures and advanced design toolchains.

The Virtex-E family was designed for high-performance, high-density reconfigurable computing in systems demanding >200 MHz clock rates, multi-standard I/O, and integrated memory - targeting telecom, test, and imaging markets where ASIC flexibility and time-to-market are critical.

FAQ

What is the maximum differential I/O pair count supported by XCV200E-6FG456C?

XCV200E-6FG456C supports up to 119 differential I/O pairs, as specified in Table 1 of DS022-1. This count is fixed for the XCV200E device regardless of package; the FG456 variant provides 284 single-ended I/Os, which can be configured as 119 differential pairs plus remaining single-ended pins, subject to I/O banking constraints and VCCO/VREF availability per bank.

Does XCV200E-6FG456C support 5 V tolerant I/O?

XCV200E-6FG456C does not natively support 5 V tolerant I/O. Its I/O pins are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin, as documented in DS022-1 Section "Virtex-E Compared to Virtex Devices". PCI 5 V operation is explicitly unsupported; the device complies only with 3.3 V PCI specifications.

How many block RAMs are integrated into XCV200E-6FG456C?

XCV200E-6FG456C contains 28 block SelectRAM units, totaling 114,688 bits of synchronous memory. Each block is a 4096-bit true dual-port RAM with independent read/write ports and configurable data widths, positioned in columns at CLB column offsets 0, 12, 30, and 42 per DS022-2 Table 3.

Is XCV200E-6FG456C pin-compatible with earlier Virtex family devices?

XCV200E-6FG456C is not pin-compatible with original Virtex devices. While XCV200E and Virtex devices in the same package share similar ball counts, DS022-1 states "The Virtex-E family is not bitstream-compatible with the Virtex family" and notes "some minor exceptions" in pinout - confirmed by distinct GCLK pin mappings (e.g., GCLK0 = BA22 in FG456 per DS022-4) absent in Virtex PQ/BG packages.

What development tools support XCV200E-6FG456C design flow?

XCV200E-6FG456C is supported by Xilinx Foundation Series™ and Alliance Series™ development systems, as stated in DS022-1. These tools provide behavioral/schematic entry, simulation, automatic translation, place-and-route, and bitstream generation. Synthesis support includes free Synthesizable reference designs for memory interfaces and DDR links, with compile time reduced by 50% versus prior generations.