AMD XCV200E-6FG456I

Overview

XCV200E-6FG456I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 5,292 logic cells, and 284 user I/O pins in a 456-ball Fine-Pitch Ball Grid Array (FG456) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 114,688 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communication subsystems in telecom line cards.

For engineers reviewing the XCV200E-6FG456I datasheet, pinout, applications, or equivalent options, this device delivers verified 240 MHz synchronous system performance, 130 MHz internal logic speed (four LUT levels), and differential I/O bandwidth exceeding 100 Gb/s - critical for source-synchronous data transmission architectures and FPGA-based protocol bridging.

Technical Context

The XCV200E-6FG456I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL, with banked VCCO and VREF constraints. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and 4× frequency multiplication - all operating at 1.8 V core voltage with 3.3 V I/O tolerance.

Key Specifications

Pinout & Package

Package: 456-ball Fine-Pitch Ball Grid Array (FG456), 1.0 mm pitch, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV200E-6FG456I, the -7 variant improves timing headroom at higher power, while the PQ240 variant trades I/O count and temperature rating for lower cost and footprint - neither is pin-compatible due to differing ball counts and thermal specifications.

Availability

XCV200E-6FG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, broadcast video processing, and high-speed protocol bridging requiring stable component supply across extended product lifecycles.

Supply support for XCV200E-6FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-capacity logic implementation in telecom, aerospace, and industrial systems demanding 1.8 V core efficiency, differential I/O bandwidth >100 Gb/s, and robust clock management.

FAQ

What is the maximum supported LVDS data rate for XCV200E-6FG456I?

The XCV200E-6FG456I supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Differential Signalling Support". This rate aligns with SONET OC-12/SDH STM-4 line speeds and is achievable using source-synchronous architectures with DLL-managed clocking. The device's I/O banking structure and dedicated differential pin pairs (IO_LxxN/IO_LxxP) ensure signal integrity at this speed without requiring external equalization.

Does XCV200E-6FG456I support true dual-port block RAM?

Yes, XCV200E-6FG456I includes 28 block RAMs totaling 114,688 bits, each configured as a true dual-port synchronous RAM with independent address, data, and control lines per port. As documented in DS022-2 (v2.8) Section "Block SelectRAM", this enables concurrent read and write operations - essential for applications like video frame buffering or FIFO-based data streaming where deterministic latency is required.

What are the core and I/O voltage requirements for XCV200E-6FG456I?

XCV200E-6FG456I requires a 1.8 V ±3% supply on VCCINT for core logic and RAM, and bank-specific VCCO supplies ranging from 1.5 V to 3.3 V depending on I/O standard selection (e.g., 2.5 V for SSTL2, 3.3 V for LVTTL). Input thresholds for standards like SSTL3 or HSTL require externally supplied VREF voltages per bank, as specified in DS022-2 Table 1 and I/O Banking section.

Is XCV200E-6FG456I pin-compatible with earlier Virtex family FPGAs?

No, XCV200E-6FG456I is not bitstream- or pin-compatible with original Virtex devices. While DS022-1 states "the same device in the same package… are pin-compatible with some minor exceptions", the XCV200E-6FG456I belongs to the Virtex-E family, which uses different banking rules, VCCINT-powered input buffers, and revised pin assignments. Migration requires full re-compilation and layout review per Module 4 pinout tables.

How many Delay-Locked Loops (DLLs) does XCV200E-6FG456I integrate?

XCV200E-6FG456I integrates eight fully digital Delay-Locked Loops (DLLs), as stated in DS022-1 Feature list and confirmed in DS022-2 Architectural Description. These DLLs support clock multiply/divide, 50% duty-cycle synthesis for DDR, zero-delay conversion of LVPECL/LVDS clocks, and independent configuration per clock domain - enabling simultaneous high-speed interfaces such as PCI, LVDS, and DDR SDRAM within a single device.