AMD XCV200E-6PQ240C
- Part No.:
- XCV200E-6PQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV200E-6PQ240C.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV200E-6PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 5,292 logic cells, and 284 user I/O pins in a 240-pin PQ (Plastic Quad Flat) package. It features eight digital Delay-Locked Loops (DLLs), up to 114,688 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed communication subsystems in telecom infrastructure.
For engineers reviewing the XCV200E-6PQ240C datasheet, pinout, applications, or equivalent options, this device delivers verified 130 MHz internal performance (four LUT levels), 622 Mb/s differential I/O, 240 MHz synchronous system clock capability, and full IEEE 1149.1 boundary-scan support - critical for high-reliability FPGA integration and JTAG-based validation workflows.
Technical Context
The XCV200E-6PQ240C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.
Its IOBs support 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL, with banked VCCO and VREF management. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication - enabling precise timing control across mixed-voltage I/O domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 306,393 - defines total logic capacity for ASIC replacement or complex digital system integration |
| Logic Cells | 5,292 - provides granular, routable logic resources for high-utilization designs with minimal congestion |
| User I/O Pins | 284 - enables dense board-level interconnect for multi-protocol interfaces (PCI, DDR SDRAM, ZBT SRAM) |
| Block RAM Bits | 114,688 - supports true dual-port memory configurations up to 250 MHz for buffering and data coalescing |
| DLL Count | 8 - allows independent clock domain management for multiple high-speed interfaces (e.g., LVDS + PCI + DDR) |
| Internal Performance | 130 MHz (4-LUT level) - guarantees timing closure for register-to-register paths in high-frequency control loops |
| Max Differential I/O | 119 pairs - delivers >100 Gb/s aggregate bandwidth for parallel high-speed serial links or backplane interfaces |
Pinout & Package
Package: 240-pin Plastic Quad Flat (PQ) with 0.5 mm pitch, JEDEC MS-026 compliant, thermal pad optional. Designed for surface-mount assembly and reflow compatibility in industrial PCB environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Dedicated low-skew clock inputs routed to all DLLs; required for synchronous system timing and DDR clocking |
| VCCINT | Core Supply | 1.8 V supply for CLBs, RAM, and routing; decoupling critical for noise-sensitive high-speed operation |
| VCCO_0–VCCO_7 | I/O Bank Supplies | Bank-specific 1.5–3.3 V outputs; each bank must use single VCCO voltage to enable mixed I/O standards |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference for SSTL/HSTL/LVCMOS inputs; shared internally within bank, requires external stable source |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port; enables in-system programming and post-configuration verification |
| PROGRAM_B / INIT_B / DONE | Configuration Control | Asynchronous reset, configuration status, and completion signaling for master serial or SelectMAP™ configuration modes |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVDS, LVPECL, SSTL3, HSTL, PCI) with banked VCCO/VREF - enables mixed-voltage board design without level shifters |
| SelectRAM+™ Hierarchy | 114,688-bit block RAM + 75,264-bit distributed RAM - provides true dual-port memory and 16×1/32×1 synchronous RAM per LUT for DSP pipelines |
| SelectLink™ DDR Interface | Double Data Rate link to Virtex-E fabric - enables high-bandwidth data transfer between FPGA logic and external memory controllers |
| Digital DLL Architecture | Eight DLLs with 4× frequency multiplication and duty-cycle correction - eliminates external clock synthesizers for DDR and source-synchronous interfaces |
| 0.18 μm 6-Metal Process | Reduces die size by ~30% vs. Virtex family while increasing speed and lowering power - improves thermal density for compact carrier boards |
Applications
| Telecom Line Card Processing | Industrial Protocol Gateway |
|---|---|
Use Scenario: Real-time packet classification and header modification in 10/100/1000BASE-T Ethernet line cards with TDM over IP bridging. IC Role / Device Role / Timing Role: Configurable packet processing engine with integrated LVDS SerDes interfaces and 200 MHz DDR SDRAM controller. Use Value: Enables deterministic latency under 200 ns for Layer 2 switching using distributed RAM-based lookup tables and pipelined CLB arithmetic. |
Use Scenario: Translation between Modbus RTU, CANopen, and EtherCAT protocols in factory automation edge controllers. IC Role / Device Role / Timing Role: Multi-protocol bridge core with isolated I/O banks supporting 3.3 V LVTTL (Modbus), 5 V-tolerant (with resistor) CAN, and 1.8 V LVCMOS (EtherCAT PHY interface). Use Value: Eliminates discrete level shifters and protocol ASICs by leveraging banked I/O voltage flexibility and on-chip state machines. |
| Medical Imaging Data Acquisition | Avionics Sensor Fusion Hub |
Use Scenario: High-speed digitized ultrasound beamformer data aggregation from 64-channel ADC front-ends before compression and transmission. IC Role / Device Role / Timing Role: Synchronized data capture hub using LVDS inputs (622 Mb/s), on-chip DDR2 controller, and DMA engines implemented in CLBs. Use Value: Achieves 1.66 Tb/s equivalent memory bandwidth via block RAM cascading - sufficient for real-time 16-bit × 64-channel × 40 MSPS streaming. |
Use Scenario: Time-synchronized fusion of inertial measurement unit (IMU), GPS PPS, and radar return signals in UAV flight control units. IC Role / Device Role / Timing Role: Deterministic time-stamping engine with eight DLLs locking to GPS 1PPS, IMU SPI clocks, and radar trigger edges. Use Value: Delivers sub-5 ns timestamp jitter across domains using DLL-mirrored clock trees and dedicated carry-chain arithmetic for delta-time computation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV200E-7PQ240C | Higher speed grade (-7 vs. -6): 10% faster internal timing (e.g., 4.3 ns adder vs. 4.8 ns), same pinout and configuration interface | Required for designs targeting >133 MHz register-to-register paths or 240 MHz system clocks with margin | Select when timing closure fails at -6 grade; no PCB change needed but may increase power consumption by ~8% |
| XCV200E-6BG352C | Different package: 352-ball BGA (vs. 240-pin PQ); 196 user I/O (vs. 284); identical logic, RAM, and DLL resources | Better thermal dissipation and higher I/O density per area; supports fine-pitch routing for compact RF modules | Choose for space-constrained designs requiring >196 I/O or improved thermal performance; requires PCB redesign |
Compared with XCV200E-6PQ240C, the -7PQ240C offers verified timing headroom for aggressive clock rates without layout changes, while the -6BG352C trades I/O count for superior thermal and routing density - making the PQ variant optimal for cost-sensitive, medium-I/O industrial control applications where rework avoidance is critical.
Availability
XCV200E-6PQ240C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, medical imaging acquisition, and avionics sensor fusion requiring stable component supply across extended product lifecycles.
Supply support for XCV200E-6PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex-E family was designed for high-performance, high-density digital systems demanding speed, flexibility, and mixed-signal I/O - targeting telecom, military, and scientific instrumentation applications where reconfigurability and silicon efficiency are critical.
FAQ
What is the maximum operating junction temperature for XCV200E-6PQ240C?
The XCV200E-6PQ240C is rated for commercial temperature range (0 °C to +85 °C junction). Its thermal design uses the PQ package's exposed thermal pad (if soldered) to maintain safe junction temperatures under full logic utilization at 1.8 V VCCINT. Derating is required above 70 °C ambient for sustained 240 MHz operation.
Does XCV200E-6PQ240C support JTAG configuration and boundary scan?
Yes, XCV200E-6PQ240C fully implements IEEE 1149.1 boundary-scan logic with dedicated TCK, TMS, TDI, and TDO pins. It supports in-system programming, configuration verification, and interconnect testing - essential for production test and field firmware updates without requiring external programmers.
Can XCV200E-6PQ240C interface directly with 5 V logic devices?
XCV200E-6PQ240C I/O pins are 3 V tolerant; 5 V tolerance requires external 100 Ω series resistors per pin. PCI 5 V signaling is not supported. For true 5 V interfacing, external level translators are recommended - especially for LVTTL inputs exceeding 3.6 V absolute maximum.
How many DLLs does XCV200E-6PQ240C include, and what are their key capabilities?
XCV200E-6PQ240C integrates eight fully digital Delay-Locked Loops (DLLs). Each supports clock multiply/divide, 50% duty cycle correction for DDR, zero-delay conversion of LVPECL/LVDS inputs to any I/O standard, and clock mirroring - enabling simultaneous multi-domain clock management without external PLLs.
Is XCV200E-6PQ240C pin-compatible with other Virtex-E devices in the PQ240 package?
Yes, all Virtex-E devices in the PQ240 package - including XCV50E, XCV100E, and XCV200E - share identical pinouts. This allows hardware reuse across density tiers. However, unused pins in smaller devices may be NC or VCCINT in larger variants; always verify pin function tables for target density.
XCV200E-6PQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 114688
- Number of I/O:
- 158
- Number of Gates:
- 306393
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV200E-6PQ240C FAQ
1.How can I place an order for XCV200E-6PQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV200E-6PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV200E-6PQ240C reliable?
The price and inventory of XCV200E-6PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200E-6PQ240C is usually 5 days.
3.What payment methods are accepted for XCV200E-6PQ240C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200E-6PQ240C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV200E-6PQ240C?
XCV200E-6PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV200E-6PQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV200E-6PQ240C?
For technical support, including XCV200E-6PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200E-6PQ240C requirements.
6.How does Aetrix verify that XCV200E-6PQ240C is sourced from the original manufacturer or authorized distributors?
All XCV200E-6PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200E-6PQ240C meets industry standards.
7.What is the process for return or replacement of XCV200E-6PQ240C?
All XCV200E-6PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV200E-6PQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV200E-6PQ240C part is unused and in its original packaging.
Return procedure for XCV200E-6PQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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