AMD XCV200E-6PQ240I

Overview

XCV200E-6PQ240I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 5,292 logic cells, and 284 user I/O pins in a 240-pin PQ (Plastic Quad Flat) package. It features eight digital Delay-Locked Loops (DLLs), up to 114,688 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communication line cards and radar signal processing subsystems.

For engineers reviewing the XCV200E-6PQ240I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and industrial-grade (-40°C to +100°C) thermal validation for FPGA-based embedded systems requiring deterministic clock management and multi-standard I/O interoperability.

Technical Context

The XCV200E-6PQ240I implements a regular array architecture with configurable logic blocks (CLBs) containing four logic cells each, dual-slice organization, dedicated carry chains for arithmetic, and F5/F6 multiplexers enabling 5- to 19-input logic functions. Its IOBs support independent input/output flip-flops with programmable polarity, synchronous/asynchronous set/reset, and optional delay elements eliminating pad-to-pad hold time.

It uses eight fully digital DLLs for zero-delay clock conversion, duty-cycle correction for DDR applications, and frequency multiplication (up to 4×); all DLLs operate independently per bank and interface with LVPECL/LVDS clock inputs rated for >300 MHz. I/O banks enforce strict VCCO/VREF voltage segregation: LVTTL/LVCMOS2/PCI buffers are powered by VCCO (not VCCINT), and only standards sharing the same VCCO may coexist within one bank.

Key Specifications

Pinout & Package

PQ240 (Plastic Quad Flat, 240-pin) package with 0.5 mm pitch, 32.5 mm × 32.5 mm body size, and exposed thermal pad. Pinout conforms to DS022-4 Module 4 - full pin tables available in official Xilinx documentation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV200E-6PQ240I, the -7PQ240I offers improved timing headroom without changing logic utilization or I/O allocation, while the -6HQ240I maintains identical electrical specs but delivers superior thermal derating - making them complementary alternatives rather than drop-in replacements.

Availability

XCV200E-6PQ240I is available at Aetrix Electronics and suitable for high-speed communication infrastructure, radar signal processing, industrial Ethernet switching, and medical imaging data acquisition requiring stable component supply across extended product lifecycles.

Supply support for XCV200E-6PQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, it defined the modern FPGA market with SRAM-based reconfigurable architectures.

The Virtex-E family was designed to deliver evolutionary improvements over Virtex FPGAs - targeting high-performance embedded systems needing 1.8 V core efficiency, multi-standard I/O flexibility, and deterministic clock management for communications and signal processing.

FAQ

What is the maximum differential I/O pair count supported by XCV200E-6PQ240I?

XCV200E-6PQ240I supports up to 119 differential I/O pairs, as specified in Table 1 of DS022-1. This count is fixed for the XCV200E device regardless of package; however, actual usable differential pairs depend on I/O banking constraints - LVDS or LVPECL pairs must reside in the same bank and share compatible VCCO/VREF settings.

Does XCV200E-6PQ240I support JTAG configuration mode?

Yes, XCV200E-6PQ240I supports IEEE 1149.1 JTAG configuration mode using TCK, TMS, TDI, and TDO pins. This mode allows in-system programming, boundary scan testing, and debug access without requiring external configuration PROMs - critical for field-upgradable embedded systems.

Can XCV200E-6PQ240I interface directly with 5 V TTL logic?

No, XCV200E-6PQ240I I/O pins are not 5 V tolerant by default. They support 3.3 V LVTTL/PCI and 2.5 V/1.8 V standards. To interface with 5 V TTL, an external 100 Ω series resistor is required per pin - but even then, PCI 5 V signaling is explicitly unsupported per DS022-1 Section "Virtex-E Compared to Virtex Devices".

How many DLLs are available in XCV200E-6PQ240I and what clock frequencies do they support?

XCV200E-6PQ240I contains eight fully digital DLLs. Each supports input clock frequencies up to 300+ MHz when driven by LVPECL or LVDS sources, and provides frequency multiplication (up to 4×), division, and 50% duty cycle correction - essential for DDR memory interfaces and high-speed SerDes clock recovery.

Is XCV200E-6PQ240I pin-compatible with earlier Virtex family devices?

XCV200E-6PQ240I is not bitstream-compatible with Virtex devices, but the same package variant (e.g., PQ240) is pin-compatible with its Virtex counterpart with minor exceptions - detailed in DS022-1 pinout section. Migration requires recompilation in Xilinx tools, not PCB redesign, provided VCCO/VREF assignments comply with Virtex-E banking rules.