AMD XCV200E-7BG352C

Overview

XCV200E-7BG352C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 5,292 logic cells, and 284 user I/O pins in a 352-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 114,688 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communication subsystems in telecom line cards.

For engineers reviewing the XCV200E-7BG352C datasheet, pinout, applications, or equivalent options, this device delivers verified 130 MHz internal performance (four LUT levels), 240 MHz synchronous system clock capability, and differential I/O support critical for source-synchronous data transmission architectures.

Technical Context

The XCV200E-7BG352C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and LVDS-with banked VCCO and VREF management. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise timing control across mixed-voltage I/O banks.

Key Specifications

Pinout & Package

Package: 352-ball Ball Grid Array (BG352), 1.27 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV200E-7BG352C, the -6 variant trades 5 MHz clock headroom for lower unit cost, while the XCV300E-7BG352C adds 35% more logic and 14% more I/O-making it suitable for designs requiring expansion without PCB redesign.

Availability

XCV200E-7BG352C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and defense electronics requiring stable component supply across long-lifecycle programs.

Supply support for XCV200E-7BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in bandwidth-intensive applications such as wired/wireless infrastructure and real-time signal processing.

FAQ

What is the maximum operating junction temperature for XCV200E-7BG352C?

The XCV200E-7BG352C is rated for commercial temperature range operation, with a maximum junction temperature of +85°C. Its integrated die-temperature sensor diode enables real-time thermal monitoring, allowing system firmware to dynamically adjust clock frequencies or throttle I/O drive strength to maintain safe thermal margins during sustained high-logic utilization.

Does XCV200E-7BG352C support JTAG configuration?

Yes, XCV200E-7BG352C fully supports IEEE 1149.1 JTAG boundary-scan configuration in addition to master serial, slave serial, and SelectMAP™ modes. The TCK, TMS, TDI, and TDO pins are dedicated for this purpose and enable in-system programming, debug visibility, and production testability without requiring external configuration PROMs.

How many differential I/O pairs does XCV200E-7BG352C support?

XCV200E-7BG352C supports up to 119 differential I/O pairs, as confirmed in Table 1 of DS022-1. This capability enables implementation of multiple high-speed differential interfaces such as LVDS camera links, PCIe Gen1 x1 lanes (with external PHY), or source-synchronous memory buses without consuming additional single-ended I/O resources.

Is XCV200E-7BG352C pin-compatible with other Virtex-E devices in BG352 package?

XCV200E-7BG352C shares the same BG352 footprint with XCV100E-7BG352C and XCV300E-7BG352C, but pin assignments differ due to varying I/O counts and bank configurations. While mechanical mounting is identical, electrical connectivity and signal mapping require verification against each device's Module 4 pinout tables-no automatic drop-in replacement is guaranteed without layout review.

What memory resources are available on XCV200E-7BG352C?

XCV200E-7BG352C provides 114,688 bits of synchronous block RAM organized in 28 columns of 4096-bit dual-port blocks, plus 75,264 bits of distributed RAM implemented in LUTs. This hierarchy supports true dual-port access for concurrent read/write operations and flexible bit-width configurations (e.g., 256×4, 128×8) essential for real-time buffering and lookup table applications.