AMD XCV200E-7BG352I

Overview

XCV200E-7BG352I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 5,292 logic cells, and 260 user I/O pins in a 352-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 114,688 bits of block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V interfaces for high-speed communication subsystems in telecom infrastructure.

For engineers reviewing the XCV200E-7BG352I datasheet, pinout, applications, or equivalent options, this device is selected for high-density reconfigurable logic in systems requiring 240 MHz synchronous operation, differential I/O bandwidth >100 Gb/s, and dual-port memory integration without external RAM.

Technical Context

The XCV200E-7BG352I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and LVDS-with banked VCCO and VREF management. Eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication, enabling precise timing control across multiple voltage domains.

Key Specifications

Pinout & Package

Package: 352-ball Ball Grid Array (BG352), 1.27 mm pitch, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV200E-6BG352I, the XCV200E-7BG352I delivers verified 130 MHz internal performance and 622 Mb/s LVDS operation; versus XCV200E-8BG352I, it offers balanced timing margin and power efficiency for industrial temperature deployments.

Availability

XCV200E-7BG352I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, high-speed test instrumentation, and radar signal processing requiring stable component supply over extended production lifecycles.

Supply support for XCV200E-7BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in systems demanding 240 MHz synchronous operation, differential I/O bandwidth >100 Gb/s, and integrated dual-port memory - targeting telecom, military, and industrial applications.

FAQ

What is the maximum supported LVDS data rate for XCV200E-7BG352I?

The XCV200E-7BG352I supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Differential Signalling Support". This rate is achievable using source-synchronous architectures with proper PCB layout, 100 Ω differential termination, and DLL-synchronized capture clocks. The device's IOBs are fully compliant with ANSI TIA/EIA-644 LVDS specifications.

Does XCV200E-7BG352I support true dual-port block RAM?

Yes, XCV200E-7BG352I includes 28 block RAMs, each providing true dual-port capability with independent read and write addresses, clocks, and enables. As documented in DS022-2 (v2.8) Table 4 and Figure 6, each 4096-bit block can be configured as 2048 × 2, 1024 × 4, or other combinations with full read/write port isolation - essential for ping-pong buffering and FIFO implementations.

How many DLLs does XCV200E-7BG352I integrate, and what are their key functions?

XCV200E-7BG352I integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 Section "High-Performance Built-In Clock Management Circuitry". These DLLs provide zero-delay clock conversion, 4× frequency multiplication, 50% duty cycle correction for DDR applications, and clock mirroring - enabling precise skew control across multiple I/O banks and internal logic domains.

What I/O standards are supported by XCV200E-7BG352I, and how are they grouped?

XCV200E-7BG352I supports 20 I/O standards including LVTTL, LVCMOS2, SSTL3, HSTL I/III/IV, LVDS, LVPECL, and PCI 3.3 V, organized into eight voltage-banked I/O groups. Per DS022-2 Table 1 and I/O Banking section, each bank requires uniform VCCO and at most one VREF voltage, allowing mixing only of standards sharing the same supply (e.g., LVTTL + PCI33_3 in 3.3 V banks).

Is XCV200E-7BG352I pin-compatible with other Virtex-E devices in the BG352 package?

XCV200E-7BG352I is pin-compatible with other Virtex-E devices offered in the BG352 package (e.g., XCV100E-7BG352I, XCV300E-7BG352I), as stated in DS022-1 Section "Virtex-E Compared to Virtex Devices": "The same device in the same package for the Virtex-E and Virtex families are pin-compatible with some minor exceptions." Pinouts are validated in DS022-4 (Module 4) Pinout Tables.