AMD XCV200E-7FG256C

Overview

XCV200E-7FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 5,292 logic cells, and 176 user I/O pins in a 256-ball Fine-Pitch Ball Grid Array (FG256) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 114,688 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V interfaces - deployed in high-speed communications infrastructure and test equipment requiring reconfigurable logic with deterministic timing.

For engineers reviewing the XCV200E-7FG256C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and speed-grade–specific performance metrics - all grounded in DS022-1 (v2.3) Production Specification and DS022-2 (v2.8) Functional Description.

Technical Context

The XCV200E-7FG256C implements a regular array of Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR, and 4× frequency multiplication - critical for source-synchronous interfaces like LVDS and HSTL.

I/O functionality is organized into eight banks, each supporting mixed standards only when sharing VCCO (e.g., LVTTL + PCI33_3 at 3.3 V) or VREF (e.g., SSTL3 I/II at 1.5 V). Input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO-not VCCINT-enabling 3 V tolerance without external resistors and enforcing strict bank-level voltage partitioning.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, thermal pad optional. Pinout defined in DS022-4 Module 4; ball map includes 176 user I/Os distributed across 8 banks, 8 dedicated global clock inputs (GCLK0–GCLK7), 4 VCCINT, 12 VCCO, 4 VREF, and JTAG boundary-scan pins (TCK/TMS/TDI/TDO).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV200E-6FG256C and XCV200E-8FG256C, the XCV200E-7FG256C provides the optimal balance of timing margin, power efficiency, and cost for commercial-temperature (0°C to +85°C) applications requiring 622 Mb/s LVDS and 200 MHz DDR SDRAM interfaces.

Availability

XCV200E-7FG256C is available at Aetrix Electronics and suitable for high-speed test equipment, optical line card control, industrial motion controllers, and medical imaging data pipelines requiring stable component supply and long-term obsolescence management.

Supply support for XCV200E-7FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in communications, computing, and instrumentation - emphasizing speed, I/O flexibility, and system integration over cost-optimized entry-level FPGAs.

FAQ

What is the maximum LVDS data rate supported by XCV200E-7FG256C?

The XCV200E-7FG256C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 Table 2 and validated under the -7 speed grade for source-synchronous architectures. This rate assumes proper PCB layout, matched trace lengths, and termination matching - and is achievable using dedicated LVDS I/O pairs with DLL-synchronized sampling clocks.

Does XCV200E-7FG256C support true dual-port block RAM?

Yes, the XCV200E-7FG256C contains 28 block RAMs, each configured as a true dual-port 4096-bit memory with independent address, data, and control lines per port. This allows simultaneous read and write operations - critical for applications like video frame buffers and packet FIFOs - as documented in DS022-2 Section "Block SelectRAM".

How many DLLs does XCV200E-7FG256C include, and what are their key capabilities?

The XCV200E-7FG256C integrates eight fully digital Delay-Locked Loops (DLLs), each capable of clock multiply (up to 4×), divide, duty-cycle correction (50%), and zero-delay conversion of high-speed LVPECL/LVDS inputs to any I/O standard. These DLLs are essential for DDR clocking and source-synchronous interface alignment, per DS022-1 Features section.

Is XCV200E-7FG256C pin-compatible with other Virtex-E devices in the FG256 package?

Yes, the XCV200E-7FG256C shares identical FG256 pinout with other Virtex-E devices in that package (e.g., XCV100E-7FG256C, XCV300E-7FG256C), including identical placement of VCCINT, VCCO, GCLK, and JTAG pins. However, I/O count and block RAM distribution differ - so logic utilization and routing must be re-verified per device, as noted in DS022-1 "Virtex-E Device/Package Combinations".

What I/O standards are supported by XCV200E-7FG256C, and how are they grouped?

The XCV200E-7FG256C supports 20 I/O standards including LVDS, LVPECL, SSTL3, HSTL IV, LVTTL, and PCI33_3 - grouped into eight voltage-defined banks. Each bank requires uniform VCCO (e.g., 3.3 V for LVTTL/PCI) and, where needed, shared VREF (e.g., 1.5 V for SSTL3). Mixing incompatible standards within a bank violates banking rules, per DS022-2 Table 1 and I/O Banking section.