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AMD XCV200E-7FG256I
- Part No.:
- XCV200E-7FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XCV200E-7FG256I.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,516
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Product details
Overview
XCV200E-7FG256I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 5,292 logic cells, and 176 user I/O pins in a 256-ball Fine-Pitch Ball Grid Array (FG256) package. It features eight digital Delay-Locked Loops (DLLs), up to 114,688 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI-compliant 33/66 MHz interfaces for high-speed communications and embedded control applications.
For engineers reviewing the XCV200E-7FG256I datasheet, pinout, applications, or equivalent options, this device is selected for demanding FPGA implementations requiring deterministic clock management, differential I/O bandwidth >100 Gb/s, dual-port memory hierarchy, and industrial temperature operation (–40°C to +100°C).
Technical Context
The XCV200E-7FG256I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.
Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL, HSTL, LVDS, and LVPECL-organized across eight I/O banks with bank-specific VCCO and VREF requirements. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 306,393 - indicates logic capacity suitable for medium-complexity digital systems including protocol bridging and real-time signal processing. |
| Logic Cells | 5,292 - provides granular, routable resources for implementing combinational logic, state machines, and arithmetic units. |
| User I/O Pins | 176 - enables high-pin-count interface consolidation (e.g., parallel memory buses, multi-lane serial links) within FG256 footprint. |
| Block RAM Bits | 114,688 - delivers true dual-port synchronous memory for FIFOs, frame buffers, or lookup tables without external SRAM. |
| DLL Count | 8 - allows independent clock domain management for multiple high-speed peripherals (e.g., DDR SDRAM, LVDS receivers, PCI). |
| Max I/O Speed | 622 Mb/s (LVDS) - supports source-synchronous data capture at OC-12/STM-4 rates or high-resolution video timing. |
| Internal Performance | 130 MHz (4-LUT levels) - ensures sub-8 ns register-to-register delay for pipelined datapaths in compute-intensive designs. |
| Temperature Range | –40°C to +100°C (Industrial) - qualifies for deployment in base stations, industrial PLCs, and avionics subsystems. |
Pinout & Package
Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, with 8 dedicated clock pins and 176 user-configurable I/Os distributed across 8 voltage-defined I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew inputs for DLL reference clocks; each connects to one of eight on-chip DLLs. |
| VCCINT | Core Supply | 1.8 V supply for internal logic and memory; decoupling required per Xilinx layout guidelines to maintain signal integrity. |
| VCCO_0–VCCO_7 | I/O Bank Supply | Bank-specific 1.5–3.3 V outputs; each bank must use identical VCCO for mixed-standard I/O (e.g., SSTL2 + LVCMOS2 in same bank). |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/LVDS input receivers; externally supplied and shared across all pins in bank. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface for configuration, debugging, and in-system verification. |
| INIT_DONE | Configuration Status | Open-drain output indicating successful bitstream loading; used to enable downstream logic after FPGA initialization. |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI) with bank-level VCCO/VREF control-enables mixed-voltage board design without level shifters. |
| SelectRAM+™ Memory Hierarchy | 114,688-bit true dual-port block RAM + 75,264-bit distributed RAM-allows concurrent read/write access for ping-pong buffering and real-time data reordering. |
| SelectLink™ DDR Interface | Hardware-accelerated DDR link between Virtex-E devices-reduces inter-FPGA communication latency in modular system-on-chip architectures. |
| Digital Delay-Locked Loops (DLLs) | Eight independent DLLs with 4× multiplication, duty-cycle correction, and LVPECL/LVDS clock input conditioning-eliminates external clock synthesizers for DDR and SerDes clocking. |
| Configurable Logic Architecture | 5,292 logic cells with 4-LUTs, dedicated carry chains, and F5/F6 multiplexers-supports efficient implementation of wide adders, multipliers, and deep pipelines. |
| Die Temperature Sensor | On-die diode sensor-enables thermal monitoring and dynamic throttling in sealed or convection-limited enclosures. |
Applications
| High-Speed Communications | Industrial Control Systems |
|---|---|
Use Scenario: Implementing a 622 Mb/s SONET framer with embedded CRC, scrambling, and HDLC framing logic. IC Role / Device Role / Timing Role: Configurable logic fabric executing protocol stack in hardware; DLLs lock to recovered line clock and generate aligned transmit strobes. Use Value: Eliminates need for ASIC development while meeting strict jitter and latency requirements of telecom infrastructure equipment. |
Use Scenario: Real-time motion control for multi-axis CNC machine with synchronized PWM generation and encoder feedback processing. IC Role / Device Role / Timing Role: Central deterministic controller managing servo loops at 20 kHz; uses distributed RAM for coefficient storage and block RAM for trajectory buffering. Use Value: Achieves sub-microsecond I/O response and jitter-free pulse generation without CPU intervention or external timing ICs. |
| PCI-Based Data Acquisition | Video Processing Subsystem |
Use Scenario: High-throughput PCIe-to-parallel bus bridge for digitizer cards acquiring 100 MS/s ADC data into local DDR SDRAM. IC Role / Device Role / Timing Role: PCI master interface with DMA engine; block RAM buffers burst transfers before DDR write; DLLs synchronize to 66 MHz PCI clock. Use Value: Enables sustained 264 MB/s host transfer rate using standard PCI slot, avoiding custom backplane or proprietary interconnect. |
Use Scenario: Format conversion pipeline (SDI → HDMI) with deinterlacing, color space transform, and on-screen display overlay. IC Role / Device Role / Timing Role: Video processing fabric with pixel-rate logic; dual-port block RAM stores frame buffers; LVDS I/O drives panel timing signals. Use Value: Supports 1080p60 real-time processing with <1-line latency using only internal memory-no external video RAM required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV200E-6FG256I | Slower speed grade (–6 vs –7); 0.3 ns longer register-to-register delay; identical pinout, memory, and I/O count. | Suitable for non-critical timing paths or lower-frequency clock domains where 130 MHz internal performance is sufficient. | Select when cost optimization is prioritized over worst-case timing margin and system clock frequency exceeds 120 MHz. |
| XCV200E-8FG256I | Faster speed grade (–8 vs –7); 0.2 ns shorter register-to-register delay; same package, power, and feature set. | Required for designs targeting >140 MHz internal clocking or tighter setup/hold margins in LVDS source-synchronous interfaces. | Choose when maximum timing margin is needed for first-pass silicon success in high-reliability industrial deployments. |
Compared with XCV200E-7FG256I, the –6 variant trades 0.3 ns timing margin for lower unit cost, while the –8 variant adds 0.2 ns margin at higher price-both retain identical I/O banking, memory resources, and industrial temperature rating.
Availability
XCV200E-7FG256I is available at Aetrix Electronics and suitable for high-speed communications, industrial control systems, PCI-based data acquisition, and video processing applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCV200E-7FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering programmable logic company founded in 1984, acquired by AMD in 2022, and known for FPGA, SoC, and adaptive computing solutions serving aerospace, telecom, and industrial markets.
The Virtex-E family was designed to deliver evolutionary improvements over Virtex FPGAs-higher density, faster I/O (622 Mb/s LVDS), lower 1.8 V core voltage, and enhanced DLLs-targeting high-performance embedded systems and communications infrastructure.
FAQ
What is the maximum LVDS data rate supported by XCV200E-7FG256I?
XCV200E-7FG256I supports LVDS signaling at up to 622 Mb/s, verified in source-synchronous architectures per DS022-1 (v2.3). This rate is achievable using dedicated differential I/O pairs with proper PCB layout (controlled impedance, matched length), and is commonly deployed in OC-12 framer and high-speed ADC/DAC interfaces. The device's DLLs condition LVDS clock inputs for precise sampling alignment.
Does XCV200E-7FG256I support true dual-port block RAM?
Yes, XCV200E-7FG256I includes 28 block SelectRAM modules totaling 114,688 bits, each configured as true dual-port synchronous RAM with independent read/write addresses, enables, and clocks per port. This capability is documented in DS022-2 (v2.8) and enables concurrent access for applications like FIFO buffering, video frame storage, and coefficient lookup without external memory.
What are the I/O voltage compatibility requirements for XCV200E-7FG256I?
XCV200E-7FG256I requires bank-specific VCCO supplies (1.5 V to 3.3 V) and optional VREF (0.75 V to 1.5 V) depending on I/O standard. LVTTL and PCI I/Os use 3.3 V VCCO; SSTL2 uses 2.5 V VCCO with 1.25 V VREF; LVDS uses 2.5 V VCCO with no VREF. Mixing standards within a bank is only allowed if they share the same VCCO, as defined in DS022-2 Table 2.
How many Delay-Locked Loops (DLLs) does XCV200E-7FG256I contain?
XCV200E-7FG256I integrates eight fully digital Delay-Locked Loops (DLLs), an increase from four in the original Virtex family. Each DLL supports clock multiply (up to 4×), divide, duty-cycle correction, and zero-delay conversion of high-speed LVPECL/LVDS inputs-enabling independent clock domain management for multiple high-speed peripherals without external PLLs.
Is XCV200E-7FG256I pin-compatible with other Virtex-E devices in FG256 packaging?
XCV200E-7FG256I is pin-compatible with XCV50E-7FG256I, XCV100E-7FG256I, and XCV200E variants in the same FG256 package per DS022-1 Section "Virtex-E Device/Package Combinations". All share identical ball map, power pin locations, and I/O bank assignments-allowing scalable design reuse across density tiers without PCB redesign.
XCV200E-7FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 114688
- Number of I/O:
- 176
- Number of Gates:
- 306393
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XCV200E-7FG256I FAQ
1.How can I place an order for XCV200E-7FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV200E-7FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV200E-7FG256I reliable?
The price and inventory of XCV200E-7FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200E-7FG256I is usually 5 days.
3.What payment methods are accepted for XCV200E-7FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200E-7FG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV200E-7FG256I?
XCV200E-7FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV200E-7FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV200E-7FG256I?
For technical support, including XCV200E-7FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200E-7FG256I requirements.
6.How does Aetrix verify that XCV200E-7FG256I is sourced from the original manufacturer or authorized distributors?
All XCV200E-7FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200E-7FG256I meets industry standards.
7.What is the process for return or replacement of XCV200E-7FG256I?
All XCV200E-7FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XCV200E-7FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV200E-7FG256I part is unused and in its original packaging.
Return procedure for XCV200E-7FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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