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AMD XCV200E-7FG456C
- Part No.:
- XCV200E-7FG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XCV200E-7FG456C.pdf
- Description:
- IC FPGA 284 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,274
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Product details
Overview
XCV200E-7FG456C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 5,292 logic cells, and 284 user I/O pins in a 456-ball Fine-Pitch Ball Grid Array (FG456) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 114,688 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems.
For engineers reviewing the XCV200E-7FG456C datasheet, pinout, applications, or equivalent options, this device is selected for demanding FPGA applications requiring deterministic clock management, differential I/O bandwidth >100 Gb/s, true dual-port memory, and industrial-temperature operation (0°C to +85°C).
Technical Context
The XCV200E-7FG456C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four 4-input LUTs with dedicated carry logic, arithmetic XOR/AND gates, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.
Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and LVDS-with banked VCCO/VREF supply domains. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise timing control for source-synchronous data transfers at up to 240 MHz system clock rates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 306,393 - defines total logic capacity for ASIC replacement or complex digital system integration |
| Logic Cells | 5,292 - provides granular, routable logic resources for HDL synthesis and place-and-route efficiency |
| User I/O Pins | 284 - supports high-bandwidth parallel interfaces, multi-standard I/O banking, and board-level signal integrity planning |
| Block RAM Bits | 114,688 - enables true dual-port memory configurations for FIFOs, frame buffers, or protocol engines without external memory |
| DLL Count | 8 - delivers independent clock domain management for multiple high-speed serial or parallel interfaces |
| Max I/O Speed | 622 Mb/s (LVDS) - meets source-synchronous timing requirements for optical transport, test equipment, and high-speed ADC/DAC interfacing |
| Internal Performance | 130 MHz (4-LUT levels) - ensures predictable timing closure for pipelined datapaths and control-intensive designs |
| Supply Voltage | VCCINT = 1.8 V - reduces dynamic power vs. 2.5 V Virtex, while maintaining 3.3 V I/O tolerance for legacy system compatibility |
Pinout & Package
Package: 456-ball Fine-Pitch Ball Grid Array (FG456), 1.0 mm pitch, RoHS-compliant, industrial temperature range (0°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Four dedicated low-skew clock inputs routed to all DLLs and CLBs; required for synchronous system timing |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, RAM, and routing; decoupling critical for noise-sensitive high-speed operation |
| VCCO_0–VCCO_7 | I/O Bank Power | Eight independent VCCO supplies (one per I/O bank); enable mixed-voltage I/O (e.g., 3.3 V LVTTL + 2.5 V SSTL2) |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference voltage inputs for SSTL/HSTL/LVCMOS input buffers; must be externally sourced and stable |
| IO_LxxN/IO_LxxP | Differential I/O Pairs | LVDS/LVPECL-capable differential terminals; require matched trace lengths and 100 Ω termination for signal integrity |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port; enables in-system programming and post-configuration verification |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, LVPECL) with banked VCCO/VREF-enables heterogeneous interface integration on single FPGA |
| SelectRAM+™ Memory Hierarchy | 114,688-bit block RAM + 75,264-bit distributed RAM-provides true dual-port, bus-width conversion, and embedded memory for protocol acceleration |
| SelectLink™ DDR Interface | Double Data Rate link between Virtex-E devices-reduces inter-FPGA latency and simplifies high-throughput data aggregation topologies |
| Digital Delay-Locked Loops (DLLs) | Eight independent DLLs with 4× multiplication, duty-cycle correction, and zero-delay LVPECL/LVDS clock conversion-eliminates external clock conditioning ICs |
| SRAM-Based Configuration | Unlimited in-system reprogramming via JTAG, SelectMAP™, or master serial mode-supports field-upgradable logic and secure bitstream loading |
Applications
| High-Speed Test Equipment | Optical Transport Line Cards |
|---|---|
Use Scenario: Real-time pattern generation and error detection in bit-error-rate testers (BERTs) operating at OC-48/STM-16 rates. IC Role / Device Role / Timing Role: FPGA fabric implements PRBS generators, deserializers, and alignment logic; DLLs lock to recovered 2.488 Gbps clock and generate phase-aligned sampling clocks. Use Value: 622 Mb/s LVDS I/O and 240 MHz internal clocking meet SONET/SDH jitter and setup/hold requirements without external clock cleaners. | Use Scenario: Forward error correction (FEC) and OTU frame mapping in DWDM line interface modules. IC Role / Device Role / Timing Role: Configurable logic processes OTU1/OTU2 framing; block RAM stores interleaved parity bytes; LVPECL I/O interfaces with TIAs and laser drivers. Use Value: True dual-port block RAM enables simultaneous read/write for pipeline buffering; 114,688-bit capacity supports full OTU2 FEC codeword storage. |
| Industrial Motion Control | PCI-Based Data Acquisition |
Use Scenario: Multi-axis servo drive coordination with synchronized PWM, encoder capture, and safety monitoring. IC Role / Device Role / Timing Role: FPGA implements real-time PID loops, 3-phase PWM generators, and quadrature decoder logic; DLLs synchronize PWM edges across axes. Use Value: Dedicated carry chains and arithmetic logic deliver sub-microsecond loop latency; 284 I/O pins route encoder A/B/Z, PWM outputs, and fault signals without glue logic. | Use Scenario: High-throughput analog-to-digital conversion with PCI 33/66 MHz host interface and on-board memory buffering. IC Role / Device Role / Timing Role: FPGA acts as PCI target interface, DMA controller, and circular buffer manager; LVTTL I/O connects to ADCs and SDRAM. Use Value: PCI-compliant 3.3 V, 32/64-bit, 33/66 MHz interface eliminates need for bridge chips; 1.8 V core reduces thermal load in compact chassis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV200E-6FG456C | Slower speed grade (-6 vs. -7): 0.3 ns longer register-to-register delay; same logic density, I/O count, and feature set | Suitable for non-critical timing paths or lower-frequency clock domains where 130 MHz internal performance suffices | Select when design timing margin allows relaxed setup/hold constraints and cost optimization is prioritized over maximum frequency |
| XCV300E-7FG456C | Higher density: 411,955 system gates, 6,912 logic cells, 316 user I/O; identical FG456 package and speed grade | Required for designs exceeding 5,292 logic cells or needing >284 I/Os while retaining same PCB footprint and thermal profile | Choose for scalability-same pinout enables drop-in upgrade path when logic utilization exceeds 90% in XCV200E-7FG456C implementations |
Compared with XCV200E-6FG456C, the XCV200E-7FG456C delivers tighter timing closure for 240 MHz system clocks; compared with XCV300E-7FG456C, it offers lower power and cost for mid-complexity designs without sacrificing I/O bandwidth or DLL count.
Availability
XCV200E-7FG456C is available at Aetrix Electronics and suitable for high-speed test equipment, optical transport line cards, industrial motion control, and PCI-based data acquisition requiring stable component supply across extended product lifecycles.
Supply support for XCV200E-7FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex-E family was designed for high-performance, high-density digital systems requiring deterministic timing, mixed-voltage I/O, and integrated memory-targeting communications infrastructure, test & measurement, and industrial automation.
FAQ
What is the maximum operating junction temperature for the XCV200E-7FG456C?
The XCV200E-7FG456C is rated for commercial temperature range operation, with a maximum junction temperature of +85°C. This specification is defined in the DS022-1 Production Product Specification (v2.3, July 17, 2002), and applies under continuous operation with appropriate PCB thermal management and airflow per Xilinx thermal guidelines.
Does the XCV200E-7FG456C support IEEE 1149.1 boundary scan?
Yes, the XCV200E-7FG456C includes full IEEE 1149.1 boundary-scan logic as a standard feature. All user I/O pins and key internal nodes are accessible via TCK/TMS/TDI/TDO pins, enabling in-circuit testing, programming, and debug during manufacturing and field service-confirmed in Module 2 of DS022-2.
Can the XCV200E-7FG456C be configured using JTAG only, or are other methods required?
The XCV200E-7FG456C supports multiple configuration modes: JTAG (boundary scan), SelectMAP™ parallel interface, slave serial, and master serial (via external SPROM). JTAG alone is sufficient for programming and debugging; no additional configuration hardware is mandatory, though SelectMAP™ is preferred for high-volume production due to faster load times.
How many differential I/O pairs does the XCV200E-7FG456C support?
The XCV200E-7FG456C supports up to 119 differential I/O pairs, as specified in Table 1 of DS022-1. This capability is implemented using dedicated IO_LxxN/IO_LxxP pin pairs in the FG456 package and enables LVDS, BLVDS, and LVPECL signaling at up to 622 Mb/s per pair.
Is the XCV200E-7FG456C pin-compatible with other Virtex-E devices in the FG456 package?
Yes, the XCV200E-7FG456C shares the same FG456 mechanical footprint and pinout with XCV100E-7FG456C and XCV300E-7FG456C, as confirmed in Table 3 of DS022-1. However, I/O bank assignments and VCCO/VREF pin usage differ across densities-PCB layout must accommodate these variations even when physical pin count matches.
XCV200E-7FG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 114688
- Number of I/O:
- 284
- Number of Gates:
- 306393
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XCV200E-7FG456C FAQ
1.How can I place an order for XCV200E-7FG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV200E-7FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV200E-7FG456C reliable?
The price and inventory of XCV200E-7FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200E-7FG456C is usually 5 days.
3.What payment methods are accepted for XCV200E-7FG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200E-7FG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV200E-7FG456C?
XCV200E-7FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV200E-7FG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV200E-7FG456C?
For technical support, including XCV200E-7FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200E-7FG456C requirements.
6.How does Aetrix verify that XCV200E-7FG456C is sourced from the original manufacturer or authorized distributors?
All XCV200E-7FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200E-7FG456C meets industry standards.
7.What is the process for return or replacement of XCV200E-7FG456C?
All XCV200E-7FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XCV200E-7FG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV200E-7FG456C part is unused and in its original packaging.
Return procedure for XCV200E-7FG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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