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AMD XCV200E-7PQ240C

Part No.:
XCV200E-7PQ240C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP
Datasheet:
AetrixXCV200E-7PQ240C.pdf
Description:
IC FPGA 158 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,821

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Product details

Overview

XCV200E-7PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 306,393 system gates and 5,292 logic cells in a 28 × 42 CLB array. It features eight digital Delay-Locked Loops (DLLs), up to 284 user I/O pins in PQ240 package, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications and embedded signal processing systems.

For engineers reviewing the XCV200E-7PQ240C datasheet, pinout, applications, or equivalent options, key selection criteria include its -7 speed grade (4.3 ns register-to-register delay), 1.8 V core voltage, 284 I/O count in PQ240 package, dual-port block RAM capability, and compatibility with Xilinx Foundation™ and Alliance Series™ design tools.

Technical Context

The XCV200E-7PQ240C implements a regular FPGA architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), and a programmable routing matrix. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice - enabling high-speed arithmetic and wide-input logic functions.

Its IOBs support SelectI/O+™ technology across 20 standards including LVTTL, LVCMOS2, SSTL, HSTL, and differential LVDS/LVPECL, with banked VCCO and VREF management. Eight fully digital DLLs provide clock multiplication, duty-cycle correction, and zero-delay conversion of high-speed differential clocks to any I/O standard.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 306,393 - indicates total logic capacity for gate-equivalent synthesis targeting.
Logic Cells 5,292 - provides fine-grained, routable logic resources with distributed RAM and carry chains.
Block RAM Bits 114,688 - enables true dual-port synchronous memory blocks (4096-bit each) for FIFOs and buffers.
Max User I/O 284 - number of configurable single-ended I/O pins in PQ240 package, supporting mixed-voltage banks.
Speed Grade -7 - guarantees ≤4.3 ns register-to-register delay under worst-case timing conditions.
Core Voltage (VCCINT) 1.8 V - reduces dynamic power vs. 2.5 V Virtex family; requires separate 3.3 V VCCO for I/O.
DLL Count 8 - enables independent clock domain control, DDR timing alignment, and jitter reduction.

Pinout & Package

PQ240 is a 240-pin Plastic Quad Flat Package (PQFP) with 0.5 mm pitch, 32.5 mm × 32.5 mm body size, and exposed thermal pad. It supports full boundary-scan (IEEE 1149.1) and includes dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), and banked VCCO/VREF pins.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Low-skew dedicated clock routing paths into DLLs; supports LVPECL/LVDS at >300 MHz.
IO_LxxN/IO_LxxP Differential I/O Pair Configurable as LVDS, BLVDS, or LVPECL input/output; requires matched trace lengths.
VCCO_0–VCCO_7 I/O Bank Supply Separate 1.5–3.3 V supplies per I/O bank; determines compatible output standards (e.g., 3.3 V → LVTTL/PCI).
VREF_0–VREF_7 Input Threshold Reference Required for SSTL/HSTL/GTL inputs; must be stable ±1% and shared across all pins in same bank.
PROGRAM_B Configuration Reset Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence.
DONE Configuration Status Open-drain output indicating successful bitstream loading; pulled high externally to enable startup.

Key Features

Feature Design Value
Eight Digital DLLs Enables precise clock deskew, 50% duty cycle correction for DDR, and 4× frequency multiplication without external PLLs.
SelectRAM+™ Memory 114,688 bits of true dual-port block RAM + 75,264 bits of distributed RAM - supports simultaneous read/write on independent ports.
SelectI/O+™ Technology Supports 20 I/O standards including LVDS (622 Mb/s), LVPECL, and PCI 66 MHz - with banked VCCO/VREF for mixed-voltage operation.
Flexible CLB Architecture Each CLB contains four logic cells with 4-LUTs, dedicated carry logic, and cascading chains - optimized for arithmetic and wide-input functions.
SRAM-Based Configuration Unlimited in-system reprogramming via JTAG, SelectMAP, or master serial mode - enables field updates and design iteration.

Applications

High-Speed Communications Backplane PCI Express Gen1 Interface Bridge

Use Scenario: Implementing protocol translation and data buffering between 622 Mb/s SerDes links and parallel bus subsystems in telecom line cards.

IC Role / Device Role / Timing Role: Configurable logic fabric with LVDS I/O and DLL-controlled clock domains manages source-synchronous timing alignment and elastic buffering.

Use Value: Achieves 622 Mb/s differential I/O performance with sub-ns setup/hold margins using on-chip DLLs and banked I/O voltage control.

Use Scenario: Bridging legacy PCI 33/66 MHz peripherals to early PCIe Gen1 endpoints in industrial control chassis.

IC Role / Device Role / Timing Role: FPGA acts as a programmable bridge with PCI-compliant I/O buffers, address decoding, and DMA controller logic.

Use Value: Leverages 3.3 V PCI-compliant I/O pins and 284-user-I/O count to implement full 32-bit/66 MHz PCI interface with local memory mapping.

Video Processing Pipeline Accelerator Test Equipment Pattern Generator

Use Scenario: Real-time pixel-level filtering and frame buffering in HD video capture systems using external DDR SDRAM.

IC Role / Device Role / Timing Role: FPGA configures as video processor with dual-port block RAM for line buffers and DDR controller IP for external memory access.

Use Value: Uses 114,688-bit block RAM for multi-line FIFOs and supports 200 Mb/s DDR SDRAM interfaces via dedicated memory controller routing.

Use Scenario: Generating high-fidelity, multi-channel digital stimulus waveforms for ATE systems requiring precise timing and pattern depth.

IC Role / Device Role / Timing Role: FPGA serves as deterministic pattern generator with DLL-synchronized outputs and internal state-machine sequencer.

Use Value: Delivers <4.3 ns register-to-register delay and 8 DLLs to maintain sub-nanosecond skew across 284 I/O pins at 133+ MHz system clock.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV200E-6PQ240C Slower -6 speed grade (4.6 ns register-to-register); identical logic density, I/O count, and package. Suitable for cost-sensitive designs where 133 MHz system clock suffices instead of 150+ MHz. Select when timing margin allows relaxed speed grade to reduce unit cost without changing PCB layout.
XCV300E-7PQ240C Higher density (411,955 system gates, 6,912 logic cells); same -7 speed grade and PQ240 package footprint. Required for larger logic implementations needing >5,292 logic cells but constrained by existing PQ240 board space. Choose when design growth necessitates more CLBs while retaining identical pinout and thermal profile.

Compared with XCV200E-7PQ240C, the -6 variant trades 7% speed for lower cost in static designs, while the XCV300E-7PQ240C delivers 30% more logic cells within the same PQ240 footprint - enabling scalable migration without PCB revision.

Availability

XCV200E-7PQ240C is available at Aetrix Electronics and suitable for high-speed communications backplanes, PCI interface bridges, video processing accelerators, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XCV200E-7PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and toolchain development for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density applications demanding advanced I/O flexibility, integrated clock management, and scalable logic resources - targeting communications infrastructure and embedded computing.

FAQ

What is the maximum operating junction temperature for XCV200E-7PQ240C?

The XCV200E-7PQ240C is rated for commercial temperature range (0 °C to +85 °C junction). Its PQ240 package uses thermally enhanced plastic molding compound and an exposed pad to dissipate heat during sustained 133+ MHz operation. Thermal derating is required above 85 °C ambient.

Does XCV200E-7PQ240C support IEEE 1149.1 boundary-scan testing?

Yes, XCV200E-7PQ240C includes full IEEE 1149.1 (JTAG) boundary-scan logic with TAP controller, instruction register, and boundary-scan cell chain covering all user I/O pins. This enables in-circuit testing, programming, and debug without requiring physical probe access.

Can XCV200E-7PQ240C configure from a serial PROM?

Yes, XCV200E-7PQ240C supports master serial configuration mode using industry-standard serial PROMs (e.g., Xilinx XC18V00 series). The FPGA drives the PROM's clock and reads configuration data through the DIN pin, completing initialization in under 100 ms for full bitstream load.

What I/O standards are supported on bank 0 of XCV200E-7PQ240C?

Bank 0 of XCV200E-7PQ240C supports LVTTL, LVCMOS2, PCI33_3, and PCI66_3 standards - all powered by VCCO_0. It does not support SSTL or HSTL in this bank due to absence of VREF_0 pins; those standards require banks with dedicated VREF connections (e.g., bank 2 or 4).

Is XCV200E-7PQ240C pin-compatible with earlier Virtex devices?

No, XCV200E-7PQ240C is not pin-compatible with original Virtex devices (e.g., XCV200). While both use PQ240 packages, Virtex-E introduces revised banking rules, relocated VCCO/VREF pins, and additional DLL-related signals - requiring PCB redesign for migration from Virtex to Virtex-E.

XCV200E-7PQ240C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
240-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
114688
Number of I/O:
158
Number of Gates:
306393
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV200E-7PQ240C FAQ

1.How can I place an order for XCV200E-7PQ240C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV200E-7PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV200E-7PQ240C reliable?

The price and inventory of XCV200E-7PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200E-7PQ240C is usually 5 days.

3.What payment methods are accepted for XCV200E-7PQ240C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200E-7PQ240C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV200E-7PQ240C?

XCV200E-7PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV200E-7PQ240C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV200E-7PQ240C?

For technical support, including XCV200E-7PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200E-7PQ240C requirements.

6.How does Aetrix verify that XCV200E-7PQ240C is sourced from the original manufacturer or authorized distributors?

All XCV200E-7PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200E-7PQ240C meets industry standards.

7.What is the process for return or replacement of XCV200E-7PQ240C?

All XCV200E-7PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV200E-7PQ240C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV200E-7PQ240C part is unused and in its original packaging.

Return procedure for XCV200E-7PQ240C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV200E-7PQ240C Tags

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