AMD XCV200E-7PQ240I
- Part No.:
- XCV200E-7PQ240I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV200E-7PQ240I.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV200E-7PQ240I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 5,292 logic cells, and 284 user I/O pins in a 240-pin PQ (Plastic Quad Flat) package. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communications infrastructure.
For engineers reviewing the XCV200E-7PQ240I datasheet, pinout, applications, or equivalent options, this device serves as a production-grade, industrial-temperature (-40°C to +100°C) FPGA optimized for PCI-compliant 33/66-MHz interfaces, DDR memory controllers, and source-synchronous data transmission architectures requiring deterministic clock management and flexible I/O banking.
Technical Context
The XCV200E-7PQ240I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.
Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and LVDS-with banked VCCO (1.5–3.3 V) and optional VREF inputs. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR, and frequency multiplication up to 4×, enabling precise timing control across multiple voltage domains and I/O standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 306,393 - defines total logic capacity for ASIC replacement or complex digital system integration |
| Logic Cells | 5,292 - provides granular, routable logic resources for high-utilization designs with minimal placement congestion |
| User I/O Pins | 284 - enables dense peripheral interfacing while supporting mixed-voltage I/O banking constraints |
| Block RAM Bits | 114,688 - delivers 28 × 4096-bit true dual-port synchronous RAM blocks for embedded buffering and FIFOs |
| DLL Count | 8 - allows independent clock domain management for multi-standard I/O, DDR interfaces, and internal timing closure |
| Max I/O Speed | 622 Mb/s (LVDS) - supports source-synchronous SerDes-like data capture without external PHY |
| Internal Performance | 130 MHz (4-LUT-level path) - ensures timing closure for pipelined arithmetic and control logic at system clock rates |
| Supply Voltage (VCCINT) | 1.8 V - reduces dynamic power vs. 2.5 V Virtex family while maintaining speed through 0.18 μm 6-metal process |
Pinout & Package
The XCV200E-7PQ240I uses a 240-pin Plastic Quad Flat (PQ) package with 284 user I/O pins distributed across eight I/O banks. Pin functions are defined by configuration bitstream and include dedicated global clocks (GCLK0–GCLK3), JTAG boundary-scan (TCK/TMS/TDI/TDO), configuration mode (M0–M2), and dual-purpose VREF/VCCO pins per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Low-skew dedicated clock inputs routed to all DLLs and CLBs; required for synchronous system timing |
| TCK, TMS, TDI, TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant testing, programming, and debug without external hardware adapters |
| M0–M2 | Configuration Mode Select | Determines boot source (master serial SPROM, slave serial, SelectMAP, or JTAG) on power-up |
| VCCO_0–VCCO_7 | I/O Bank Supply Voltage | Per-bank VCCO pins set output drive level and input threshold compatibility (e.g., 3.3 V for LVTTL, 1.5 V for HSTL) |
| VREF_0–VREF_7 | I/O Bank Reference Voltage | Required for SSTL/HSTL/GTL input standards; must be externally supplied and shared within each bank |
| PROGRAM_B | Active-Low Configuration Reset | Asynchronously clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVTTL, LVCMOS2, SSTL3, HSTL, LVDS) with per-bank VCCO/VREF control and mixed-standard routing |
| SelectRAM+™ Memory Hierarchy | 114,688 bits of true dual-port block RAM + 75,264 bits of distributed RAM - enables embedded memory subsystems without external chips |
| SelectLink™ DDR Interconnect | Hardware-accelerated DDR link between CLBs and block RAM - eliminates external glue logic for high-bandwidth memory access |
| Digital Delay-Locked Loops (DLLs) | Eight fully digital DLLs with 4× multiplication, duty-cycle correction, and LVPECL/LVDS clock input support - replaces external clock synthesizers |
| Arithmetic-Optimized CLB | Dedicated carry chains, 2-bit full adder per slice, and multiplier-optimized AND gates - improves DSP and control algorithm throughput |
| Die-Temperature Sensor Diode | On-die thermal diode accessible via analog monitoring circuitry - enables real-time thermal management in industrial environments |
Applications
| PCI 33/66-MHz Interface | DDR SDRAM Controller |
|---|---|
Use Scenario: Implementation of compliant PCI bus master/slave logic in industrial control backplanes. IC Role / Device Role / Timing Role: Configurable protocol engine with synchronized 33/66-MHz clock domains, address/data multiplexing, and parity generation. Use Value: Eliminates need for ASIC or ASSP; leverages 284 I/O and DLL-based clock deskew to meet PCI setup/hold timing across temperature. |
Use Scenario: High-bandwidth memory controller for 200 Mb/s DDR SDRAM in video processing pipelines. IC Role / Device Role / Timing Role: Dual-port block RAM buffers burst reads/writes while DLLs generate precise 100-MHz DDR clocks with 50% duty cycle. Use Value: Achieves >1.66 Tb/s equivalent memory bandwidth using on-chip SelectRAM+, reducing PCB layer count and signal integrity risk. |
| LVDS-Based Camera Link Interface | Multi-Standard Communications Transceiver |
Use Scenario: Embedded vision system receiving 622 Mb/s serialized image data from CMOS sensors. IC Role / Device Role / Timing Role: LVDS receiver front-end with source-synchronous capture, deserialization, and pixel alignment logic. Use Value: Uses native LVDS I/O and DLL-based sampling clock recovery to eliminate external SerDes ICs and reduce BOM cost. |
Use Scenario: Reconfigurable baseband processor supporting multiple wireless protocols (WiMAX, LTE-lite) in compact radios. IC Role / Device Role / Timing Role: Real-time signal conditioning, modulation/demodulation, and protocol stack acceleration across mixed-voltage I/O banks. Use Value: Leverages 20 supported I/O standards and per-bank VCCO to interface with diverse RFICs, ADCs, and PMICs on single board. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV200E-6PQ240I | Slower speed grade (-6 vs. -7); 0.3 ns longer register-to-register delay (4.6 ns vs. 4.3 ns) | Suitable for lower-frequency control logic where 130 MHz internal performance is not required | Select when timing margin exists and cost reduction is prioritized over maximum clock rate |
| XCV200E-7BG352C | Different package (352-ball BGA vs. 240-pin PQ); higher I/O count (260 vs. 284) but incompatible footprint | Better thermal dissipation and routing density for space-constrained PCBs; requires redesign | Choose only if migration to BGA is acceptable and industrial temperature rating remains mandatory |
Compared with XCV200E-6PQ240I, the XCV200E-7PQ240I delivers tighter timing closure for high-speed interfaces; compared with XCV200E-7BG352C, it retains pin-compatible PQ packaging for legacy board reuse while sacrificing some I/O scalability.
Availability
XCV200E-7PQ240I is available at Aetrix Electronics and suitable for industrial automation, communications infrastructure, and embedded vision systems requiring stable component supply and long-term lifecycle support.
Supply support for XCV200E-7PQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex-E family was designed for high-performance, high-density digital systems demanding low-power 1.8 V operation, advanced clock management, and multi-standard I/O flexibility in industrial and telecom applications.
FAQ
What is the operating temperature range for the XCV200E-7PQ240I?
The XCV200E-7PQ240I is rated for industrial temperature operation from –40°C to +100°C (junction temperature). This specification is confirmed in the Virtex-E Ordering Information section of DS022-1 (v2.3), where the "I" suffix explicitly denotes the industrial grade. The device includes an on-die temperature sensor diode for real-time thermal monitoring in harsh environments.
Does the XCV200E-7PQ240I support PCI compliance?
Yes, the XCV200E-7PQ240I is fully compliant with 3.3 V, 32/64-bit, 33/66-MHz PCI specifications. Its SelectI/O+™ technology provides native LVTTL I/O with 16 mA drive strength and fast slew rate control, meeting PCI electrical requirements without external termination resistors or level shifters.
How many DLLs does the XCV200E-7PQ240I include, and what are their key capabilities?
The XCV200E-7PQ240I integrates eight fully digital Delay-Locked Loops (DLLs). Each supports clock multiply (up to 4×), divide, 50% duty-cycle correction for DDR applications, and zero-delay conversion of high-speed LVPECL/LVDS inputs to any supported I/O standard - enabling robust clock domain crossing and jitter reduction.
What memory resources are available on the XCV200E-7PQ240I?
The XCV200E-7PQ240I provides 114,688 bits of synchronous block RAM (28 × 4096-bit true dual-port modules) and 75,264 bits of distributed RAM implemented in CLB LUTs. This hierarchy supports embedded FIFOs, frame buffers, and lookup tables without external memory chips.
Is the XCV200E-7PQ240I pin-compatible with other Virtex-E devices in the PQ240 package?
Yes, the XCV200E-7PQ240I shares identical pinout and package dimensions with other Virtex-E devices offered in the PQ240 variant (e.g., XCV100E-7PQ240I, XCV300E-7PQ240I), as confirmed in Table 3 of DS022-1. All PQ240-packaged Virtex-E FPGAs use the same 240-pin mechanical footprint and I/O bank layout.
XCV200E-7PQ240I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 114688
- Number of I/O:
- 158
- Number of Gates:
- 306393
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV200E-7PQ240I FAQ
1.How can I place an order for XCV200E-7PQ240I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV200E-7PQ240I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV200E-7PQ240I reliable?
The price and inventory of XCV200E-7PQ240I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200E-7PQ240I is usually 5 days.
3.What payment methods are accepted for XCV200E-7PQ240I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200E-7PQ240I transactions.
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4.How is shipping managed for XCV200E-7PQ240I?
XCV200E-7PQ240I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV200E-7PQ240I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV200E-7PQ240I?
For technical support, including XCV200E-7PQ240I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200E-7PQ240I requirements.
6.How does Aetrix verify that XCV200E-7PQ240I is sourced from the original manufacturer or authorized distributors?
All XCV200E-7PQ240I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200E-7PQ240I meets industry standards.
7.What is the process for return or replacement of XCV200E-7PQ240I?
All XCV200E-7PQ240I units undergo pre-shipment inspection (PSI). If there is an issue with XCV200E-7PQ240I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV200E-7PQ240I part is unused and in its original packaging.
Return procedure for XCV200E-7PQ240I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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