AMD XCV200E-8BG352C

Overview

XCV200E-8BG352C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 306,393 system gates and 5,292 logic cells in a 352-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 260 user I/O pins, and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed data acquisition and communication subsystems.

For engineers reviewing the XCV200E-8BG352C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-power reprogrammable logic solution for synchronous system clock rates up to 240 MHz, source-synchronous data transmission at 622 Mb/s, and embedded memory-intensive designs requiring true dual-port block RAM.

Technical Context

The XCV200E-8BG352C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IO subsystem supports 20 interface standards across eight I/O banks, with VCCO-supplied input buffers for LVTTL/LVCMOS2/PCI and VREF-dependent inputs for SSTL/HSTL. Block RAM is organized in 28 columns of 4096-bit dual-port modules, and DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication.

Key Specifications

Pinout & Package

The XCV200E-8BG352C is housed in a 352-ball fine-pitch Ball Grid Array (BG352) package with 1.27 mm pitch, designed for thermal and signal integrity in high-density PCB layouts. Pin assignments follow Xilinx's standardized Virtex-E BG352 pinout with eight I/O banks, dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), and bank-specific VCCO/VREF supply connections.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV200E-8BG352C, the -7 variant trades 3 MHz performance for lower cost while maintaining full compatibility, whereas the XCV300E-8BG352C extends logic and memory headroom within the same footprint-enabling scalable design migration without PCB revision.

Availability

XCV200E-8BG352C is available at Aetrix Electronics and suitable for radar signal processing, industrial Ethernet gateways, medical imaging interfaces, and high-speed test equipment requiring stable component supply across extended production lifecycles.

Supply support for XCV200E-8BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and development tools for high-performance digital system design.

The Virtex-E family was engineered for high-speed, high-density reconfigurable logic in communications infrastructure, defense electronics, and industrial control-emphasizing I/O flexibility, clock management, and embedded memory hierarchy.

FAQ

What is the maximum operating junction temperature for XCV200E-8BG352C?

The XCV200E-8BG352C is rated for commercial temperature range (0 °C to +85 °C junction temperature). This is indicated by the "C" suffix in the part number and confirmed in the DS022-1 datasheet Module 1 ordering information section. Operation outside this range may cause timing violations or configuration loss. Thermal design must ensure junction temperature remains within specification under worst-case power dissipation conditions.

Does XCV200E-8BG352C support JTAG boundary scan testing?

Yes, XCV200E-8BG352C includes IEEE 1149.1-compliant boundary scan logic integrated into all IOBs. This enables in-circuit testing of PCB interconnects, verification of solder joint integrity, and debugging of board-level signal routing. The TAP controller is accessible via standard TCK/TMS/TDI/TDO pins and supports instruction register programming for EXTEST, SAMPLE/PRELOAD, and BYPASS operations as defined in the Virtex-E Functional Description (DS022-2).

How many differential I/O pairs does XCV200E-8BG352C support?

XCV200E-8BG352C supports up to 119 differential I/O pairs, as specified in Table 1 of DS022-1 (v2.3). This count is fixed for the XCV200E device regardless of package; the BG352 variant realizes 260 total user I/O pins, of which 238 are usable as differential pairs (119 × 2) when configured for LVDS or LVPECL signaling. Unused pins in differential mode remain available as single-ended I/O.

Can XCV200E-8BG352C be configured via JTAG only, or are other methods supported?

XCV200E-8BG352C supports multiple configuration modes: JTAG (IEEE 1149.1), SelectMAP™ parallel interface, slave serial mode, and master serial mode using an external SPI PROM. JTAG is used for debugging and programming during development, while SelectMAP enables high-speed configuration from a microprocessor or host controller. All modes load the same SRAM-based bitstream and are functionally equivalent for final configuration.

Is XCV200E-8BG352C pin-compatible with other Virtex-E devices in the BG352 package?

Yes, all Virtex-E devices in the BG352 package-including XCV100E, XCV200E, XCV300E, and XCV400E-are pin-compatible per DS022-1 Section "Virtex-E Device/Package Combinations and Maximum I/O". Signal pin locations, power/ground ball assignments, and configuration pin positions are identical. However, unused pins in smaller devices may be designated as "No Connect" in larger variants, and I/O bank voltage requirements must be verified per device density.