Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV200E-8FG256C

Name: XCV200E-8FG256C
Brand: AMD
SKU: XCV200E-8FG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: XCV200E-8FG256C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 256-BGA

Datasheet:: XCV200E-8FG256C.pdf

Description:: IC FPGA 176 I/O 256FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:3,981

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

XCV200E-8FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 306,393 system gates and 63,504 logic cells in a 28 × 42 CLB array. It features eight digital Delay-Locked Loops (DLLs), up to 176 user I/O pins in Fine-Pitch BGA (FG256) package, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces - deployed in high-speed communications infrastructure and embedded signal processing systems.

For engineers reviewing the XCV200E-8FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include internal 130 MHz performance (four LUT levels), 1.8 V core voltage with 3.3 V I/O tolerance, true dual-port block RAM (114,688 bits), DLL-based clock multiplication/division, and compatibility with Xilinx Foundation™ and Alliance Series™ design tools.

Technical Context

The XCV200E-8FG256C implements a regular FPGA architecture with configurable logic blocks (CLBs) containing four logic cells each - each cell integrating a 4-input LUT, dedicated carry chain, and edge-triggered D-flip-flop with independent clock enable, synchronous/asynchronous set/reset. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and up to 4× frequency multiplication.

I/O functionality is managed via SelectI/O+™ technology across eight banks, supporting 20 interface standards including LVDS, LVPECL, SSTL, HSTL, and PCI. Input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO (not VCCINT), enabling mixed-voltage I/O operation per bank, while differential signaling supports input/output/I/O directionality with 622 Mb/s data rates.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	306,393 - indicates total logic capacity equivalent to standard gate count for architectural sizing and density comparison.
Logic Cells	63,504 - fundamental programmable units, each with LUT + flip-flop + carry logic, defining realizable logic depth and register count.
CLB Array	28 × 42 - fixed grid layout determining maximum routable interconnect density and placement constraints.
User I/O Pins	176 - single-ended I/O count in FG256 package; defines maximum external interface bandwidth and board-level pin assignment scope.
Block RAM Bits	114,688 - distributed across 28 × 4096-bit true dual-port synchronous memory blocks, enabling independent read/write ports for FIFOs or buffering.
DLL Count	8 - fully digital delay-locked loops for jitter-reduced clock distribution, phase alignment, and frequency synthesis without external PLL components.
Core Voltage (VCCINT)	1.8 V - reduces dynamic power vs. 2.5 V Virtex family; requires dedicated low-noise regulation and impacts thermal design.
Speed Grade	-8 - fastest commercial-grade timing bin, guaranteeing worst-case internal register-to-register delay ≤ 4.3 ns (per DS022-1 Table 2).

Pinout & Package

Package: Fine-Pitch Ball Grid Array (FG256), 256-ball, 1.0 mm pitch, RoHS-compliant, with 176 user I/O pins distributed across eight I/O banks (Bank 0–7), plus dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), JTAG boundary-scan pins (TCK/TMS/TDI/TDO), and power/ground balls (VCCINT, VCCO, GND).

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Inputs	Dedicated low-skew routing to all DLLs and CLBs; required for synchronous system timing and clock domain crossing.
IO_LxxN/IO_LxxP	Differential I/O Pairs	LVDS/LVPECL-capable terminals; must be used in matched N/P pairs with controlled impedance routing and termination.
VCCO_0–VCCO_7	I/O Bank Power Supplies	Independent 1.5–3.3 V supplies per bank; determines compatible I/O standards within each bank (e.g., VCCO=3.3 V enables LVTTL/PCI).
VREF_0–VREF_7	Input Threshold Reference	Required for SSTL/HSTL/GTL standards; shared across all I/Os in same bank; must be externally sourced and filtered.
PROGRAM_B / INIT_B / DONE	Configuration Control	Active-low signals managing master serial SPROM loading sequence and configuration status reporting.

Key Features

Feature	Design Value
SelectRAM+™ Memory Hierarchy	114,688-bit true dual-port block RAM + 75,264-bit distributed RAM enables pipelined data buffering and on-chip memory-mapped peripherals without external SRAM.
SelectI/O+™ Technology	Support for 20 I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI) per bank allows mixed-voltage interfaces on single device - critical for bridging legacy and high-speed subsystems.
Digital DLL Clock Management	Eight DLLs provide deterministic clock deskew, 50% duty cycle correction for DDR, and integer clock multiplication - eliminating need for external clock synthesizers in timing-critical designs.
Flexible CLB Architecture	Each CLB contains four logic cells with cascaded carry chains, F5/F6 multiplexers for 5-/6-input functions, and BUFTs for internal 3-state bussing - optimizing arithmetic, wide logic, and bus arbitration.
IEEE 1149.1 Boundary Scan	Fully compliant JTAG TAP controller enables in-system test, programming, and debug without physical probe access - essential for high-density PCB validation.

Applications

High-Speed Communications Backplane	PCI Express Gen1 Bridge Logic
Use Scenario: Line card in telecom switch handling OC-48 (2.488 Gbps) packet forwarding with SERDES-less parallel bus aggregation. IC Role / Device Role / Timing Role: FPGA implements protocol translation, header parsing, and flow control between multiple 66 MHz 64-bit PCI buses and custom backplane interface. Use Value: 176 I/O pins support full-width PCI66_3 and LVDS links simultaneously; DLLs synchronize multi-bus clock domains; 114,688-bit block RAM buffers bursty traffic.	Use Scenario: Add-in card converting legacy PCI to PCIe x1 endpoint for industrial vision acquisition system. IC Role / Device Role / Timing Role: Configurable logic bridges PCI address/data/command cycles to PCIe transaction layer, managing split transactions and memory-mapped I/O. Use Value: 1.8 V core lowers power vs. ASIC alternative; LVPECL clock inputs accept 100 MHz PCIe reference clock; true dual-port RAM handles descriptor queues.
Medical Imaging Data Acquisition	Defense Radar Signal Processing
Use Scenario: Ultrasound beamformer board digitizing 128-channel analog front-end at 40 MSPS with real-time FIR filtering. IC Role / Device Role / Timing Role: FPGA performs channel synchronization, digital down-conversion, and beamforming coefficient application using distributed LUT-based MAC units. Use Value: 63,504 logic cells implement parallel filter taps; 130 MHz internal performance sustains 40 MHz sampling rate; LVDS I/O interfaces to ADC/DACs.	Use Scenario: AESA radar front-end module performing pulse compression and Doppler FFT on 16-channel IF streams. IC Role / Device Role / Timing Role: FPGA hosts FFT engines, CFAR detection, and DMA controllers feeding DSP processors via 200 MHz ZBT SRAM interface. Use Value: Block RAM configured as 200 MHz dual-port memory matches ZBT SRAM timing; DLLs lock to 125 MHz radar clock; 622 Mb/s LVDS links feed ADC data.

High-Speed Communications Backplane

PCI Express Gen1 Bridge Logic

Use Scenario: Line card in telecom switch handling OC-48 (2.488 Gbps) packet forwarding with SERDES-less parallel bus aggregation.

IC Role / Device Role / Timing Role: FPGA implements protocol translation, header parsing, and flow control between multiple 66 MHz 64-bit PCI buses and custom backplane interface.

Use Value: 176 I/O pins support full-width PCI66_3 and LVDS links simultaneously; DLLs synchronize multi-bus clock domains; 114,688-bit block RAM buffers bursty traffic.

Use Scenario: Add-in card converting legacy PCI to PCIe x1 endpoint for industrial vision acquisition system.

IC Role / Device Role / Timing Role: Configurable logic bridges PCI address/data/command cycles to PCIe transaction layer, managing split transactions and memory-mapped I/O.

Use Value: 1.8 V core lowers power vs. ASIC alternative; LVPECL clock inputs accept 100 MHz PCIe reference clock; true dual-port RAM handles descriptor queues.

Medical Imaging Data Acquisition

Defense Radar Signal Processing

Use Scenario: Ultrasound beamformer board digitizing 128-channel analog front-end at 40 MSPS with real-time FIR filtering.

IC Role / Device Role / Timing Role: FPGA performs channel synchronization, digital down-conversion, and beamforming coefficient application using distributed LUT-based MAC units.

Use Value: 63,504 logic cells implement parallel filter taps; 130 MHz internal performance sustains 40 MHz sampling rate; LVDS I/O interfaces to ADC/DACs.

Use Scenario: AESA radar front-end module performing pulse compression and Doppler FFT on 16-channel IF streams.

IC Role / Device Role / Timing Role: FPGA hosts FFT engines, CFAR detection, and DMA controllers feeding DSP processors via 200 MHz ZBT SRAM interface.

Use Value: Block RAM configured as 200 MHz dual-port memory matches ZBT SRAM timing; DLLs lock to 125 MHz radar clock; 622 Mb/s LVDS links feed ADC data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV200E-7FG256C	Slower speed grade (-7): 4.6 ns register-to-register delay vs. -8's 4.3 ns; identical logic density, I/O count, and feature set.	Suitable for cost-sensitive designs where 133 MHz system clock suffices instead of 130+ MHz worst-case timing margin.	Select when timing closure is achievable at -7 grade to reduce unit cost; no PCB or firmware changes required.
XCV300E-8FG456C	Higher density (411,955 system gates), larger package (456-ball FG), 312 user I/O, and 131,072 block RAM bits - not pin-compatible.	Required when design scales beyond XCV200E resources, e.g., adding encryption cores or multi-gigabit transceivers (via external PHY).	Choose for future-proofing or resource-constrained upgrades; requires new PCB layout and I/O constraint revalidation.

Compared with XCV200E-7FG256C, the XCV200E-8FG256C delivers tighter timing margins for high-frequency control loops; compared with XCV300E-8FG456C, it offers lower BOM cost and smaller footprint but less headroom for logic expansion or additional I/O standards.

Availability

XCV200E-8FG256C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, medical imaging data acquisition, defense radar signal processing, and industrial PCI bridge applications requiring stable component supply across extended production lifecycles.

Supply support for XCV200E-8FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design toolchains for adaptive computing.

The Virtex-E family was engineered for high-performance, low-power reconfigurable logic in telecommunications, aerospace, and test equipment - delivering 30% higher speed than prior Virtex devices using 0.18 μm CMOS process and 1.8 V core voltage.

FAQ

What is the maximum operating frequency of the XCV200E-8FG256C?

The XCV200E-8FG256C guarantees synchronous system clock rates up to 240 MHz (including I/O path) and internal logic performance exceeding 130 MHz (four LUT levels), with worst-case register-to-register delay of 4.3 ns per DS022-1 Table 2. Actual frequency depends on design complexity, placement, and routing - verified during static timing analysis in Xilinx Alliance or Foundation tools.

Does the XCV200E-8FG256C support LVDS I/O standards?

Yes, the XCV200E-8FG256C supports LVDS (622 Mb/s), BLVDS, and LVPECL signaling through its SelectI/O+™ technology. Differential I/O pairs require matching N/P pins, external 100 Ω termination, and proper VCCO/VREF settings per I/O bank - detailed in DS022-2 Module 2 Section "Input/Output Block".

How many block RAMs does the XCV200E-8FG256C contain?

The XCV200E-8FG256C contains 28 block SelectRAM™ modules, each 4096 bits, totaling 114,688 bits of true dual-port synchronous memory. These blocks are arranged in columns adjacent to CLB columns (0, 12, 30, 42) and support independent read/write widths per port - enabling efficient FIFOs, frame buffers, or descriptor tables.

Is the XCV200E-8FG256C pin-compatible with other Virtex-E devices in FG256 package?

No - only same-device variants (e.g., XCV200E-7FG256C) are pin-compatible. XCV100E-8FG256C and XCV300E-8FG256C use different FG256 pinouts per DS022-4 Module 4. The XCV200E-8FG256C has unique I/O bank assignments and CLB-to-pin mappings; migration requires full pin constraint revalidation and PCB redesign if changing density.

What configuration modes does the XCV200E-8FG256C support?

The XCV200E-8FG256C supports master serial (via external SPROM), slave serial, SelectMAP™ (8- or 16-bit parallel), and JTAG boundary-scan configuration modes. Configuration is SRAM-based and volatile - requiring re-loading at power-up. JTAG mode enables in-system programming and IEEE 1149.1 testing without interrupting system operation.

XCV200E-8FG256C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®-E

Package/Case:: 256-BGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 1176

Number of Logic Elements/Cells:: 5292

Total RAM Bits:: 114688

Number of I/O:: 176

Number of Gates:: 306393

Voltage - Supply:: 1.71V ~ 1.89V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 256-FBGA (17x17)

XCV200E-8FG256C FAQ

1.How can I place an order for XCV200E-8FG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV200E-8FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV200E-8FG256C reliable?

The price and inventory of XCV200E-8FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200E-8FG256C is usually 5 days.

3.What payment methods are accepted for XCV200E-8FG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200E-8FG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV200E-8FG256C?

XCV200E-8FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV200E-8FG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV200E-8FG256C?

For technical support, including XCV200E-8FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200E-8FG256C requirements.

6.How does Aetrix verify that XCV200E-8FG256C is sourced from the original manufacturer or authorized distributors?

All XCV200E-8FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200E-8FG256C meets industry standards.

7.What is the process for return or replacement of XCV200E-8FG256C?

All XCV200E-8FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV200E-8FG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV200E-8FG256C part is unused and in its original packaging.

Return procedure for XCV200E-8FG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…