AMD XCV200E-8FG456C

Overview

XCV200E-8FG456C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 306,393 system gates and 5,292 logic cells in a 456-pin Fine Pitch Ball Grid Array (FG456) package. It delivers 130 MHz internal performance (four LUT levels), supports PCI 3.3 V/33–66 MHz compliance, and integrates eight digital Delay-Locked Loops (DLLs) for clock management. It is used in high-speed communication interface design, embedded signal processing, and reconfigurable computing platforms.

For engineers reviewing the XCV200E-8FG456C datasheet, pinout, applications, or equivalent options, key selection considerations include its 284-user I/O count, 114,688-bit block RAM capacity, -8 speed grade timing (e.g., 4.3 ns register-to-register delay), 1.8 V core voltage, and support for LVDS (622 Mb/s), LVPECL, and SSTL I/O standards.

Technical Context

The XCV200E-8FG456C implements a flexible CLB architecture with two slices per CLB, each containing four 4-input LUTs, dedicated carry logic, and dual flip-flops with independent clock enable, synchronous/asynchronous set/reset. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and up to 4× frequency multiplication - enabling precise clock domain control across high-speed interfaces.

I/O functionality is organized into eight banks with bank-specific VCCO and VREF constraints; LVTTL/LVCMOS2/PCI input buffers are powered by VCCO (not VCCINT), and differential standards like LVDS and LVPECL operate at up to 622 Mb/s with dedicated differential routing. The device supports true dual-port block RAM (4096-bit blocks), distributed RAM (75,264 bits), and SelectLink™ DDR interconnect technology.

Key Specifications

Pinout & Package

Package: 456-ball Fine Pitch Ball Grid Array (FG456), 1.0 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV200E-7FG456C, the XCV200E-8FG456C delivers tighter timing for high-frequency control loops; compared with XCV300E-8FG456C, it offers lower static power and reduced BOM cost while meeting mid-range gate-count requirements.

Availability

XCV200E-8FG456C is available at Aetrix Electronics and suitable for high-speed communication interface design, reconfigurable signal processing, and PCI bus controller applications requiring stable component supply across extended production lifecycles.

Supply support for XCV200E-8FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined solutions for aerospace, communications, and industrial markets.

The Virtex-E family was designed for high-performance, low-power reconfigurable computing - targeting applications demanding >200 MHz system clocks, multi-standard I/O, and integrated memory hierarchy without external DRAM.

FAQ

What is the maximum operating junction temperature for XCV200E-8FG456C?

The XCV200E-8FG456C is rated for commercial temperature range (0°C to +85°C) with maximum junction temperature of +100°C under specified thermal conditions. Its integrated die-temperature sensor diode enables real-time thermal monitoring, allowing system firmware to adjust clock frequency or throttle I/O activity before reaching critical thresholds. This feature is critical for sustained operation in enclosed industrial enclosures.

Does XCV200E-8FG456C support LVDS input and output simultaneously on the same I/O bank?

Yes, XCV200E-8FG456C supports LVDS input and output simultaneously within the same I/O bank, provided VCCO = 2.5 V and no conflicting standards (e.g., SSTL) are assigned to that bank. LVDS does not require VREF, so it coexists with other 2.5 V standards like SSTL2 or LVCMOS2. However, mixing LVDS with single-ended standards in the same bank may violate I/O banking rules due to VREF dependency conflicts.

How many block RAMs does XCV200E-8FG456C contain, and what are their dimensions?

XCV200E-8FG456C contains 28 block RAMs, each 4096 bits in size, totaling 114,688 bits. Each block supports true dual-port operation with independently configurable widths (e.g., 16×256, 32×128, or 64×64) and depths. These blocks are arranged in columns aligned with CLB arrays - specifically at columns 0, 12, 30, and 42 - enabling efficient access from adjacent logic resources without routing congestion.

Is XCV200E-8FG456C pin-compatible with earlier Virtex devices in the same FG456 package?

XCV200E-8FG456C is not bitstream-compatible with Virtex (non-E) devices, but it is physically pin-compatible with XCV200 in FG456 packages, with minor exceptions documented in DS022-4 Pinout Tables. Key differences include VCCINT = 1.8 V (vs. 2.5 V), VCCO-powered I/O buffers (not VCCINT), and relocated dedicated clock pins. PCB reuse is possible only if power delivery and I/O voltage domains are updated accordingly.

What configuration modes does XCV200E-8FG456C support, and which is recommended for production systems?

XCV200E-8FG456C supports JTAG, master serial (via external PROM), slave serial, and SelectMAP configuration modes. For production systems, JTAG is recommended for initial programming and debug; master serial mode with XCFxx Platform Flash PROM is preferred for autonomous, repeatable boot - ensuring deterministic startup without host intervention. All modes load the same SRAM configuration bitstream, enabling seamless transition between development and deployment.