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AMD XCV200E-8PQ240C
- Part No.:
- XCV200E-8PQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV200E-8PQ240C.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,070
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Product details
Overview
XCV200E-8PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 306,393 system gates, 5,292 logic cells, and 284 user I/O pins in a 240-pin PQ (Plastic Quad Flat) package. It features eight digital Delay-Locked Loops (DLLs), up to 114,688 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces for high-speed data acquisition and telecom line-card control.
For engineers reviewing the XCV200E-8PQ240C datasheet, pinout, applications, or equivalent options, this device is selected for designs requiring 240 MHz system clock operation, 622 Mb/s differential I/O bandwidth, dual-port memory integration, and IEEE 1149.1 boundary-scan testability in commercial-temperature industrial embedded systems.
Technical Context
The XCV200E-8PQ240C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.
Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and LVDS-with banked VCCO and VREF management. Eight DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×, enabling precise timing control for source-synchronous interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 306,393 - defines total logic capacity for complex digital system integration |
| Logic Cells | 5,292 - provides granular, place-and-route-efficient logic resources for RTL synthesis |
| User I/O Pins | 284 - supports high-pin-count parallel buses and multi-standard I/O banking |
| Block RAM Bits | 114,688 - enables true dual-port memory structures for FIFOs, buffers, and data coalescing |
| DLL Count | 8 - delivers independent clock domain control, jitter reduction, and DDR timing alignment |
| Max System Clock | 240 MHz - achievable with optimized placement/routing and DLL-assisted clock distribution |
| I/O Standards | LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, LVPECL - allows mixed-voltage board-level interfacing |
Pinout & Package
The XCV200E-8PQ240C uses a 240-pin Plastic Quad Flat (PQ) package with 28 mm × 28 mm body size, 0.5 mm lead pitch, and standard JEDEC MO-179 footprint. Pin functions are organized into eight I/O banks, each with dedicated VCCO and optional VREF pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew inputs routed to all DLLs and CLBs for synchronous domain control |
| VCCINT | Core Supply | 1.8 V power for internal logic and memory-requires tight regulation and local decoupling |
| VCCO_0–VCCO_7 | I/O Bank Supply | Independent 1.5–3.3 V supplies per bank enabling mixed I/O voltage domains |
| VREF_0–VREF_7 | Input Threshold Reference | External reference for SSTL/HSTL/LVCMOS input buffers-shared within each bank |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access for configuration verification and in-system debug |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-Based In-System Reconfiguration | Enables field-upgradable logic functionality without hardware change or power cycle |
| SelectRAM+™ Memory Hierarchy | Combines 114,688-bit block RAM and distributed CLB RAM for hierarchical memory mapping |
| SelectI/O+™ Technology | Supports 20 I/O standards with programmable drive strength, slew rate, and weak-keeper control |
| Digital DLL Clock Management | Provides deterministic phase alignment, duty-cycle correction, and frequency synthesis without external PLL |
| Die-Temperature Sensor Diode | Enables on-chip thermal monitoring for dynamic thermal throttling or fan control in sealed enclosures |
Applications
| Telecom Line Card Control | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time packet classification and header parsing in 10/100/1000BASE-T switch fabric modules. IC Role / Device Role / Timing Role: FPGA acts as protocol-aware glue logic between PHYs, MACs, and packet buffer RAM with sub-5 ns register-to-register timing. Use Value: 240 MHz system clock and 8 DLLs enable deterministic latency for time-sensitive forwarding decisions. | Use Scenario: Synchronized sampling of multiple analog channels at ≥100 MSPS using external ADCs and DDR memory buffering. IC Role / Device Role / Timing Role: FPGA serves as timing controller, data formatter, and DDR SDRAM interface with LVDS capture clocks. Use Value: LVDS I/O support at 622 Mb/s and 114,688-bit block RAM allow burst-mode storage without external FIFOs. |
| Industrial Motion Controller | PCI-Based Test Equipment |
Use Scenario: Closed-loop servo control with real-time PWM generation, encoder feedback decoding, and safety interlock logic. IC Role / Device Role / Timing Role: FPGA implements deterministic finite-state machines and high-resolution counter logic synchronized to 50/60 Hz line references. Use Value: Dedicated carry chains and arithmetic logic deliver sub-microsecond position update cycles with minimal jitter. | Use Scenario: Modular instrumentation card for automated test systems requiring PCIe-like throughput over legacy 32-bit/33 MHz PCI bus. IC Role / Device Role / Timing Role: FPGA bridges host CPU to custom measurement peripherals while handling PCI transaction layer and DMA arbitration. Use Value: PCI-compliant 3.3 V I/O and 284 user pins support full 32-bit address/data multiplexing with timing margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV200E-7PQ240C | Slower speed grade (-7 vs. -8); 220 MHz max system clock vs. 240 MHz | Suitable for cost-sensitive designs where 20 MHz timing margin is acceptable | Select when design meets timing closure at -7 grade to reduce unit cost |
| XCV300E-8PQ240C | Higher density (411,955 gates, 6,912 logic cells) in identical PQ240 package | Required for designs needing >5,292 logic cells or >32 block RAMs without PCB redesign | Choose for future-proofing or incremental logic growth within same footprint |
Compared with XCV200E-7PQ240C, the XCV200E-8PQ240C delivers higher clock frequency headroom; compared with XCV300E-8PQ240C, it offers lower static power and reduced tool compile time for mid-complexity designs.
Availability
XCV200E-8PQ240C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, high-speed data acquisition, and PCI-based test equipment requiring stable component supply across extended production lifecycles.
Supply support for XCV200E-8PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology and developer of industry-standard FPGA architectures, design tools, and IP cores since 1984.
The XCV200E-8PQ240C belongs to the Virtex-E 1.8 V FPGA family, engineered for high-speed, high-density logic implementation in commercial-temperature embedded systems demanding advanced I/O flexibility and integrated clock management.
FAQ
What is the maximum operating junction temperature for the XCV200E-8PQ240C?
The XCV200E-8PQ240C is rated for commercial temperature range operation, with a maximum junction temperature (Tj) of +85 °C. This specification applies under continuous operation with proper PCB thermal design, including adequate copper pour, thermal vias, and airflow. The device integrates a die-temperature sensor diode to support real-time thermal monitoring in deployed systems using XCV200E-8PQ240C.
Does the XCV200E-8PQ240C support JTAG boundary scan and in-system programming?
Yes, the XCV200E-8PQ240C includes full IEEE 1149.1-compliant boundary-scan logic with TCK, TMS, TDI, and TDO pins. It supports in-system configuration via JTAG, SelectMAP™, slave serial, and master serial modes. Configuration bitstreams can be loaded dynamically without power cycling, enabling remote firmware updates and partial reconfiguration workflows using the XCV200E-8PQ240C.
How many differential I/O pairs does the XCV200E-8PQ240C support?
The XCV200E-8PQ240C supports up to 119 differential I/O pairs, as confirmed in Table 1 of DS022-1. This capability enables high-bandwidth, noise-immune interfaces such as LVDS camera links, serializer/deserializer backplanes, and clock distribution networks. Each differential pair uses two adjacent pins within the same I/O bank and requires matched trace lengths and controlled impedance routing on the PCB hosting the XCV200E-8PQ240C.
Is the XCV200E-8PQ240C pin-compatible with other Virtex-E devices in the PQ240 package?
Yes, the XCV200E-8PQ240C shares the same PQ240 pinout with other Virtex-E devices offered in that package, including XCV100E-8PQ240C and XCV300E-8PQ240C. However, I/O bank assignments, VCCO/VREF pin allocations, and dedicated function pin usage (e.g., GCLK, M0–M2) must be verified against the specific device's pinout table in DS022-4 before migration. The XCV200E-8PQ240C maintains mechanical and electrical compatibility within this package family.
What memory resources are integrated into the XCV200E-8PQ240C?
The XCV200E-8PQ240C integrates 114,688 bits of synchronous block RAM organized in 28 columns of 4096-bit dual-port memory blocks, plus 75,264 bits of distributed RAM implemented in CLB LUTs. These resources support true dual-port read/write operations, asynchronous reset, and byte-enable functionality-enabling efficient FIFOs, frame buffers, and lookup tables without external memory in designs based on XCV200E-8PQ240C.
XCV200E-8PQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1176
- Number of Logic Elements/Cells:
- 5292
- Total RAM Bits:
- 114688
- Number of I/O:
- 158
- Number of Gates:
- 306393
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV200E-8PQ240C FAQ
1.How can I place an order for XCV200E-8PQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV200E-8PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV200E-8PQ240C reliable?
The price and inventory of XCV200E-8PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV200E-8PQ240C is usually 5 days.
3.What payment methods are accepted for XCV200E-8PQ240C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV200E-8PQ240C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV200E-8PQ240C?
XCV200E-8PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV200E-8PQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV200E-8PQ240C?
For technical support, including XCV200E-8PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV200E-8PQ240C requirements.
6.How does Aetrix verify that XCV200E-8PQ240C is sourced from the original manufacturer or authorized distributors?
All XCV200E-8PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV200E-8PQ240C meets industry standards.
7.What is the process for return or replacement of XCV200E-8PQ240C?
All XCV200E-8PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV200E-8PQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV200E-8PQ240C part is unused and in its original packaging.
Return procedure for XCV200E-8PQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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