AMD XCV2600E-6FG1156C

Overview

XCV2600E-6FG1156C from Xilinx is a 1.8 V SRAM-based FPGA with 3.26 million system gates, 57,132 logic cells, and 804 user I/O pins in an 1156-ball fine-pitch BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 753.7 kb of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communication subsystems in telecom line cards.

For engineers reviewing the XCV2600E-6FG1156C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-voltage reprogrammable logic platform for source-synchronous data capture, DDR memory interfacing, and multi-standard I/O consolidation in fixed-function ASIC replacement designs.

Technical Context

The XCV2600E-6FG1156C implements a regular array architecture with configurable logic blocks (CLBs) containing four logic cells each, distributed across a 92 × 138 CLB grid. Each CLB includes 4-input LUTs with dual flip-flop outputs, dedicated carry chains, and F5/F6 multiplexers enabling up to 19-input logic functions.

Its I/O subsystem uses SelectI/O+™ technology organized into eight banks, supporting mixed-voltage standards (LVTTL, SSTL, HSTL, LVCMOS18/25, LVDS, LVPECL) with bank-specific VCCO and shared VREF. All IOBs include programmable delay, weak-keeper, and IEEE 1149.1 boundary-scan compliance.

Key Specifications

Pinout & Package

Package: 1156-ball Fine-Pitch Ball Grid Array (FG1156), 1.0 mm pitch, RoHS-compliant, thermal-enhanced construction with central thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCV2600E-6FG1156C, the XCV2000E-6FG1156C offers 22% fewer logic cells and 13% less block RAM at lower cost, while the XCV3200E-6FG1156C adds 28% more logic and 13% more RAM-both retain identical pinout, thermal profile, and I/O banking structure for seamless migration.

Availability

XCV2600E-6FG1156C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial test equipment, medical imaging, and high-end vision systems requiring stable component supply across extended product lifecycles.

Supply support for XCV2600E-6FG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic solutions, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-capacity reconfigurable computing in wireline and wireless infrastructure, where 1.8 V core voltage, 622 Mb/s differential I/O, and true dual-port memory were critical for ASIC replacement.

FAQ

What is the maximum differential I/O pair count supported by XCV2600E-6FG1156C?

The XCV2600E-6FG1156C supports up to 344 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This enables full utilization of LVDS, BLVDS, and LVPECL standards across all eight I/O banks while maintaining signal integrity at 622 Mb/s. Each differential pair consumes two physical balls in the FG1156 package.

Does XCV2600E-6FG1156C support PCI-X or only conventional PCI?

The XCV2600E-6FG1156C is compliant with PCI 3.3 V, 32/64-bit, 33/66 MHz specifications only - it does not support PCI-X (133 MHz) or PCIe. Its I/O architecture meets PCI SIG Class I electrical requirements, including setup/hold timing and drive strength, but lacks native PCI-X protocol logic or 133 MHz clock domain support.

Can XCV2600E-6FG1156C operate with 2.5 V VCCO for SSTL2 interfaces?

Yes - XCV2600E-6FG1156C supports 2.5 V VCCO in I/O banks configured for SSTL2 I/II, LVCMOS2, or BLVDS standards. Per DS022-2 Table 2, 2.5 V VCCO is explicitly compatible with these standards, and bank-level VCCO pins (e.g., VCCO_2, VCCO_5) must be supplied at 2.5 V ±3% for correct termination and output swing.

Is XCV2600E-6FG1156C pin-compatible with earlier Virtex devices in FG1156 package?

No - while XCV2600E-6FG1156C shares the FG1156 mechanical footprint with some Virtex devices, it is not pin-compatible due to differences in I/O banking rules, VCCINT voltage (1.8 V vs. 2.5 V), and dedicated pin assignments (e.g., GCLK routing, VREF placement). Migration requires PCB redesign and I/O constraint revalidation.

What configuration modes are supported by XCV2600E-6FG1156C?

XCV2600E-6FG1156C supports master serial (via external SPROM), slave serial, SelectMAP (parallel x8/x16), and JTAG (IEEE 1149.1) configuration modes. JTAG is used for programming, debugging, and boundary-scan testing; SelectMAP enables fast in-system reconfiguration at up to 100 MHz data rate.