AMD XCV2600E-7FG1156C

Overview

XCV2600E-7FG1156C from Xilinx is a high-density, 1.8 V SRAM-based FPGA with 3.26 million system gates, 57,132 logic cells, and 804 user I/O pins in an 1156-ball fine-pitch BGA package. It integrates eight digital Delay-Locked Loops (DLLs), up to 753.7 kb of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communication subsystems in telecom line cards.

For engineers reviewing the XCV2600E-7FG1156C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and validated alternative migration paths - all grounded in DS022-1 (v2.3) and DS022-2 (v2.8) production specifications.

Technical Context

The XCV2600E-7FG1156C implements a regular array architecture with 92 × 138 CLBs, eight fully digital DLLs for zero-delay clock conversion and 50% duty-cycle synthesis, and eight I/O banks supporting mixed-voltage signaling (VCCO = 1.5–3.3 V) with per-bank VREF constraints. Its IOBs include three independently configurable storage elements per pin with synchronous/asynchronous set/reset and programmable weak-keeper circuits.

Each CLB contains four logic cells with 4-input LUTs capable of dual-function operation (logic + 16×1 RAM or 16-bit shift register), dedicated carry chains for arithmetic, and F5/F6 multiplexers enabling 5- to 19-input logic functions. Block RAM columns are placed every 12 CLB columns, with 184 blocks totaling 753,664 bits, each supporting independent port widths and true dual-port access.

Key Specifications

Pinout & Package

Package: 1156-ball Fine-Pitch Ball Grid Array (FG1156), 1.0 mm pitch, RoHS-compliant, thermal performance optimized for industrial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV2600E-7FG1156C, the XCV3200E-7FG1156C offers headroom for feature expansion without PCB changes, while the XCV2000E-7FG1156C reduces unit cost where logic resources are underutilized - both preserve full pin compatibility, DLL behavior, and I/O standard support.

Availability

XCV2600E-7FG1156C is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed test instrumentation, medical imaging backend processing, and industrial motion control systems requiring stable component supply over extended product lifecycles.

Supply support for XCV2600E-7FG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density system integration in wireline communications and computing infrastructure, emphasizing I/O flexibility, memory bandwidth, and deterministic timing - directly addressing the needs of OC-48/STM-16 line cards and multi-gigabit test systems.

FAQ

What is the maximum LVDS data rate supported by XCV2600E-7FG1156C?

XCV2600E-7FG1156C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Table 2 and Module 2 functional description. This rate meets SONET OC-12/SDH STM-4 requirements and is achievable using dedicated differential I/O pairs (IO_LxxN/IO_LxxP) with matched PCB trace lengths and proper termination. The 622 Mb/s limit applies to single-ended clocking; source-synchronous architectures may achieve higher effective throughput.

Does XCV2600E-7FG1156C support true dual-port block RAM operation?

Yes, XCV2600E-7FG1156C includes 184 block SelectRAM units, each providing true dual-port synchronous access with independent address, data, and control lines per port, as specified in DS022-2 (v2.8) Section "Block SelectRAM". Each 4096-bit block can be configured with different data widths (e.g., 16×256 on Port A, 32×128 on Port B), enabling concurrent read/write operations essential for ping-pong buffering and FIFO implementation.

How many DLLs does XCV2600E-7FG1156C contain, and what are their key capabilities?

XCV2600E-7FG1156C contains eight fully digital Delay-Locked Loops (DLLs), as documented in DS022-1 (v2.3) Features section and Module 2 architectural description. Each DLL supports clock multiply (up to 4×), divide, duty-cycle correction (50% for DDR), and zero-delay conversion of high-speed LVPECL/LVDS inputs to any I/O standard - critical for synchronizing multi-rate interfaces in telecom and test equipment.

What I/O standards are supported by XCV2600E-7FG1156C, and how are they grouped?

XCV2600E-7FG1156C supports 20 I/O standards including LVTTL, LVCMOS18/25, SSTL3/2, HSTL I/III/IV, GTL/GTL+, CTT, AGP-2X, PCI33_3/66_3, BLVDS, LVDS, and LVPECL, per DS022-2 (v2.8) Table 1. These are grouped into eight I/O banks (two per side), each requiring uniform VCCO voltage and sharing a single VREF; mixing standards within a bank is only allowed if they share the same VCCO (e.g., LVTTL + PCI33_3 at 3.3 V).

Is XCV2600E-7FG1156C pin-compatible with other Virtex-E devices in the FG1156 package?

Yes, XCV2600E-7FG1156C is pin-compatible with XCV2000E-7FG1156C and XCV3200E-7FG1156C in the same FG1156 package, as confirmed in DS022-1 (v2.3) "Virtex-E Device/Package Combinations" table and revision history notes. All three share identical ball map, power pin locations, and I/O bank assignments - enabling drop-in migration between densities without PCB redesign, provided thermal and decoupling margins are maintained.