My Inquiry
My Account
AMD XCV2600E-8FG1156C
- Part No.:
- XCV2600E-8FG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA
- Datasheet:
-
XCV2600E-8FG1156C.pdf
- Description:
- IC FPGA 804 I/O 1156FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,493
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCV2600E-8FG1156C from Xilinx is a high-density, 1.8 V SRAM-based FPGA with 3.26 million system gates, 57,132 logic cells, and 804 user I/O pins in an 1156-ball fine-pitch BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 753.7 kb of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V interfaces - deployed in high-speed communications infrastructure and radar signal processing systems.
For engineers reviewing the XCV2600E-8FG1156C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and speed-grade –8 DC/AC electrical characteristics per DS022-3 (v2.3).
Technical Context
The XCV2600E-8FG1156C implements a regular array architecture with 92 × 138 CLBs, each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR, and 4× frequency multiplication - enabling synchronous system operation up to 240 MHz.
I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed standards only when sharing VCCO voltage (e.g., LVTTL + PCI33_3 at 3.3 V), while LVDS/LVPECL require 2.5 V or 3.3 V VCCO and no VREF. Block RAM columns are placed every 12 CLB columns starting from edges, with 184 blocks totaling 753,664 bits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 3.26 million - defines total combinational logic capacity for ASIC replacement sizing |
| Logic Cells | 57,132 - provides count of atomic programmable units with LUT + flip-flop + carry |
| User I/O Pins | 804 - maximum single-ended I/O count in FG1156 package, constrained by bank voltage rules |
| Block RAM Bits | 753,664 - distributed across 184 × 4096-bit true dual-port blocks for independent read/write addressing |
| DLL Count | 8 - enables simultaneous domain-specific clock management for multi-clock designs |
| Speed Grade | -8 - guarantees worst-case internal timing performance down to 4.3 ns register-to-register delay |
| VCCINT | 1.8 V ± 3% - core logic supply requiring tight regulation; decoupling critical for jitter control |
Pinout & Package
Package: 1156-ball Fine-Pitch Ball Grid Array (FG1156), 1.0 mm pitch, RoHS-compliant, thermal pad optional. Dimensions: 35 mm × 35 mm, 1.55 mm height. Compatible with standard reflow profiles for Pb-free assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew inputs routed to all DLLs; must connect to LVPECL/LVDS sources for >300 MHz operation |
| VCCINT | Core Logic Supply | 1.8 V power for CLBs, RAM, and routing; requires local 10 µF + 100 nF decoupling per power ball group |
| VCCO_0–VCCO_7 | I/O Bank Supply | Independent 1.5–3.3 V supplies per bank; determines compatible I/O standards (e.g., VCCO=3.3 V enables LVTTL/PCI) |
| VREF_0–VREF_7 | Input Threshold Reference | Required only for SSTL/HSTL/GTL standards; shared across all pins in same bank; precision 1% tolerance needed |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test interface; used for configuration, debug, and in-system programming |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and forces re-initialization on next power-up or pulse |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz - enables direct interfacing to SERDES, memory controllers, and backplane transceivers without level-shifting |
| SelectRAM+™ Hierarchy | 753.6 kb block RAM + 812.5 kb distributed RAM - allows embedded FIFOs, frame buffers, and coefficient tables with true dual-port access and built-in bus-width conversion |
| SelectLink™ DDR Interface | Hardened DDR link between FPGA fabric and external memory - reduces routing congestion and timing closure effort for 200 Mb/s DDR SDRAM interfaces |
| Digital DLLs | Eight independent DLLs with 4× multiplication and duty-cycle correction - eliminates external clock synthesizers for DDR, video, and telecom clocking schemes |
| Die Temperature Sensor | On-die diode calibrated to ±3°C accuracy - enables real-time thermal monitoring and dynamic throttling in sealed industrial enclosures |
Applications
| High-Speed Serial Backplane | Radar Digital Beamforming |
|---|---|
Use Scenario: 10 GbE line card with 4× 2.5 Gb/s SerDes lanes, packet classification, and TCP offload. IC Role / Device Role / Timing Role: System-level protocol processor and interface bridge; manages PCIe-to-AXI translation, DMA engines, and clock domain crossing between 125 MHz PCIe and 156.25 MHz SerDes reference clocks. Use Value: 804 I/Os support full-duplex parallel bus to PHY; DLLs lock to recovered SerDes clock and generate phase-aligned sampling clocks for ADC/DAC interfaces. |
Use Scenario: Active electronically scanned array (AESA) radar with 256-channel digital beamformer and real-time STAP processing. IC Role / Device Role / Timing Role: Real-time signal processor executing FFT, CFAR, and beam steering algorithms; synchronizes 256-channel ADC data streams using source-synchronous LVDS capture at 125 MSPS. Use Value: 57K logic cells implement pipelined FFT cores; 753 kb block RAM stores calibration coefficients and beam lookup tables; LVDS I/O handles deterministic latency ADC interface. |
| Medical Imaging Data Acquisition | Industrial Machine Vision Controller |
Use Scenario: PET/CT scanner front-end with 1024-channel time-of-flight (TOF) histogramming and coincidence detection. IC Role / Device Role / Timing Role: High-precision timestamp correlator and histogram accumulator; processes leading-edge pulses from SiPM arrays with sub-nanosecond resolution using DLL-stabilized 500 MHz sampling clocks. Use Value: Dedicated carry chains enable ultra-fast 1024-bit parallel counters; distributed RAM stores per-channel histogram bins; 1.8 V core reduces thermal noise in analog-front-end proximity. |
Use Scenario: Smart camera with 24 MP global shutter CMOS sensor, real-time defect classification, and EtherCAT master interface. IC Role / Device Role / Timing Role: Image preprocessor and protocol stack accelerator; captures raw Bayer data via 40-bit parallel LVCMOS interface at 100 MHz, runs CNN inference kernels, and manages 100 µs cycle EtherCAT timing. Use Value: 8 DLLs generate independent clocks for sensor interface (100 MHz), CNN engine (200 MHz), and EtherCAT MAC (125 MHz); 804 I/Os route sensor data, flash control, and industrial I/O expansion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV2600E-7FG1156C | Slower speed grade (-7 vs. -8); 4.6 ns register-to-register delay vs. 4.3 ns; identical pinout, RAM, and I/O count | Suitable for cost-sensitive designs where 240 MHz system clock is not required; lower static power due to relaxed timing margins | Select when design meets timing closure at -7 grade to reduce BOM cost without changing PCB layout |
| XCV3200E-8FG1156C | Higher density (4.07M gates, 73K logic cells); same FG1156 package and pinout; adds 96 kb more block RAM | Required for designs exceeding 57K logic cells or needing >753 kb block RAM; same thermal profile and board footprint | Choose for future-proofing or incremental design upgrades where additional logic/RAM is confirmed necessary |
Compared with XCV2600E-8FG1156C, the -7 variant trades 7% peak performance for lower cost and power, while the XCV3200E-8 offers 25% more logic and RAM in identical packaging - enabling seamless migration paths without PCB redesign.
Availability
XCV2600E-8FG1156C is available at Aetrix Electronics and suitable for high-reliability communications infrastructure, defense radar subsystems, and medical imaging equipment requiring stable component supply over extended production lifecycles.
Supply support for XCV2600E-8FG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, adaptive SoC, and ACAP solutions since 1984 for aerospace, industrial, and communications markets.
The Virtex-E family was designed for high-performance, high-gate-count applications demanding advanced I/O flexibility, integrated memory, and deterministic clock management - targeting wireline telecom, radar, and scientific instrumentation.
FAQ
What is the maximum supported LVDS data rate for XCV2600E-8FG1156C?
The XCV2600E-8FG1156C supports LVDS signaling at up to 622 Mb/s per differential pair, as specified in DS022-1 (v2.3) Section "Differential Signalling Support". This rate is achievable using source-synchronous architectures with DLL-managed capture clocks, and requires proper PCB impedance control (100 Ω differential) and termination.
Does XCV2600E-8FG1156C support true dual-port block RAM operation?
Yes, the XCV2600E-8FG1156C implements 184 true dual-port block RAMs (each 4096 bits), allowing independent read and write operations on separate ports with no contention. This capability is documented in DS022-2 (v2.8) Section "Block SelectRAM" and enables applications like ping-pong buffering and real-time data streaming.
Can XCV2600E-8FG1156C operate with 5 V tolerant I/Os?
No, XCV2600E-8FG1156C I/Os are not 5 V tolerant. They support 3.3 V, 2.5 V, 1.8 V, and 1.5 V I/O standards (e.g., LVTTL, LVCMOS, SSTL, HSTL), but applying 5 V directly will damage the device. External 100 Ω series resistors may be used for limited overvoltage protection, but PCI 5 V is explicitly unsupported per DS022-1.
How many DLLs does XCV2600E-8FG1156C include, and what are their key capabilities?
The XCV2600E-8FG1156C integrates eight fully digital Delay-Locked Loops (DLLs), each supporting clock multiply (up to 4×), divide, duty-cycle correction (50%), and zero-delay conversion of high-speed LVPECL/LVDS inputs. These are detailed in DS022-1 Section "High-Performance Built-In Clock Management Circuitry" and enable multi-domain clocking without external PLLs.
Is XCV2600E-8FG1156C pin-compatible with other Virtex-E devices in the FG1156 package?
Yes, XCV2600E-8FG1156C shares identical pinout with XCV2000E-8FG1156C and XCV3200E-8FG1156C per DS022-4 (Pinout Tables). All FG1156 Virtex-E devices use the same ball map, enabling hardware reuse across density tiers - though I/O banking constraints and VCCO/VREF assignments must be verified per design.
XCV2600E-8FG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 1156-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 12696
- Number of Logic Elements/Cells:
- 57132
- Total RAM Bits:
- 753664
- Number of I/O:
- 804
- Number of Gates:
- 3263755
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FBGA (35x35)
XCV2600E-8FG1156C FAQ
1.How can I place an order for XCV2600E-8FG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV2600E-8FG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV2600E-8FG1156C reliable?
The price and inventory of XCV2600E-8FG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV2600E-8FG1156C is usually 5 days.
3.What payment methods are accepted for XCV2600E-8FG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV2600E-8FG1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV2600E-8FG1156C?
XCV2600E-8FG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV2600E-8FG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV2600E-8FG1156C?
For technical support, including XCV2600E-8FG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV2600E-8FG1156C requirements.
6.How does Aetrix verify that XCV2600E-8FG1156C is sourced from the original manufacturer or authorized distributors?
All XCV2600E-8FG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV2600E-8FG1156C meets industry standards.
7.What is the process for return or replacement of XCV2600E-8FG1156C?
All XCV2600E-8FG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XCV2600E-8FG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV2600E-8FG1156C part is unused and in its original packaging.
Return procedure for XCV2600E-8FG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV2600E-8FG1156C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
