AMD XCV300-4BG352C

Overview

XCV300-4BG352C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells in a 32×48 CLB array, and 260 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV300-4BG352C datasheet, pinout, applications, or equivalent options, key selection considerations include its -4 speed grade (200 MHz system performance), BG352 package thermal and routing constraints, SelectIO™ interface standard compatibility (LVTTL, SSTL, HSTL), and legacy Virtex architecture support for boundary-scan (IEEE 1149.1) and die-temperature sensing.

Technical Context

The XCV300-4BG352C implements a hierarchical interconnect architecture with a General Routing Matrix (GRM), local VersaBlock routing, and peripheral VersaRing I/O routing - enabling high routability for complex designs. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input logic, and dual-port 4k-bit block RAMs organized in two full-height columns.

Configuration is SRAM-based and supports master serial, slave serial, SelectMAP™, and JTAG modes. I/O banks enforce voltage domain isolation: each of eight banks requires shared VCCO (for outputs) and optionally shared VREF (for input thresholds), with strict co-location rules for compatible standards like LVTTL (3.3 V), SSTL2 (2.5 V), and HSTL Class IV (1.5 V).

Key Specifications

Pinout & Package

The XCV300-4BG352C is housed in a 352-ball fine-pitch Ball Grid Array (BG352) package with 1.27 mm ball pitch, designed for high-density PCB layouts and thermal dissipation in industrial and telecom applications. Pin functions follow Xilinx Virtex family conventions with eight I/O banks, dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), and boundary-scan test access (TCK, TMS, TDI, TDO).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV300-4BG352C, the -5 variant offers improved timing headroom without altering footprint or power envelope, while the XCV400-4BG352C provides scalable logic capacity within the same mechanical and thermal constraints - both enable incremental upgrades without PCB redesign.

Availability

XCV300-4BG352C is available at Aetrix Electronics and suitable for industrial motion control, telecom line cards, PCI bridge modules, and legacy system emulation requiring stable component supply and long-term obsolescence mitigation support.

Supply support for XCV300-4BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family - including XCV300-4BG352C - was engineered for high-performance, high-capacity digital system integration in telecommunications, aerospace, and industrial automation, emphasizing place-and-route efficiency, clock management, and multi-standard I/O flexibility.

FAQ

Is XCV300-4BG352C still in production?

No, XCV300-4BG352C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains limited legacy inventory and supports obsolescence management programs including cross-reference analysis, last-time-buy coordination, and form-fit-function alternatives for ongoing production.

What configuration modes does XCV300-4BG352C support?

XCV300-4BG352C supports four configuration modes: master serial (auto-reads bitstream from external PROM), slave serial (bitstream loaded via dedicated serial pins), SelectMAP™ (parallel synchronous loading), and JTAG (boundary-scan programming and debugging). All modes use SRAM-based configuration, requiring reinitialization on power-up.

Can XCV300-4BG352C interface directly with DDR SDRAM?

Yes, XCV300-4BG352C supports SSTL2 Class I/II and SSTL3 Class I/II I/O standards via its SelectIO™ blocks, enabling direct connection to DDR and DDR2 SDRAM. Proper bank voltage assignment (2.5 V for DDR, 3.3 V for DDR2), VREF routing, and careful timing closure using its DLLs are required for reliable operation.

Does XCV300-4BG352C include internal temperature sensing?

Yes, XCV300-4BG352C integrates a die-temperature sensor diode as a standard feature. This analog element allows external monitoring circuitry to measure junction temperature - critical for thermal management in sealed industrial enclosures or high-reliability telecom applications using the XCV300-4BG352C.

What is the maximum operating frequency of XCV300-4BG352C?

XCV300-4BG352C has a -4 speed grade specifying guaranteed 200 MHz system clock performance under worst-case conditions (including I/O timing). Benchmarked register-to-register paths achieve 5.0 ns (200 MHz), and pipelined multipliers reach 5.1 ns - actual frequency depends on design topology, placement, and routing, but the -4 grade ensures timing closure up to this limit.