AMD XCV300-4BG352I

Overview

XCV300-4BG352I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells in a 32×48 CLB array, and 260 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536 bits of block RAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance and hot-swap operation for Compact PCI systems.

For engineers reviewing the XCV300-4BG352I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, SelectIO™ standard compatibility (LVTTL, HSTL, SSTL), and CLB-level timing parameters - all critical for high-speed synchronous design, PCI interface implementation, and migration from legacy gate arrays.

Technical Context

The XCV300-4BG352I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and dual-port 4k-bit block RAMs organized in two full-height columns.

Each IOB supports independent programmable drive strength (up to 24 mA source / 48 mA sink), slew rate control, weak-keeper circuitry, and IEEE 1149.1 boundary scan. I/O banks enforce strict VCCO and VREF voltage segregation: eight banks require uniform VCCO per bank, and only one VREF voltage per bank, limiting mixed-standard placement within a bank.

Key Specifications

Pinout & Package

The XCV300-4BG352I is housed in a 352-ball fine-pitch Ball Grid Array (BG352) package with 260 user I/O pins distributed across eight I/O banks. Each bank requires uniform VCCO and supports only one VREF voltage; ball assignments follow Xilinx DS003-4 Pinout Tables (v4.0).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV300-4BG352I, the -5 speed grade improves worst-case timing margin without changing layout, while the XCV400-4BG352I offers headroom for logic growth within identical mechanical and thermal constraints - both retain full backward compatibility for configuration bitstreams and JTAG programming.

Availability

XCV300-4BG352I is available at Aetrix Electronics and suitable for industrial motion controllers, PCI add-in cards, high-speed data acquisition systems, and legacy ASIC emulation requiring stable component supply and long-term lifecycle support.

Supply support for XCV300-4BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design tools used across aerospace, communications, and industrial markets.

The Virtex family - including XCV300-4BG352I - was engineered for high-performance, high-density logic replacement in systems demanding 200-MHz operation, PCI compliance, and flexible I/O interfacing, targeting applications where ASIC development cost or time-to-market was prohibitive.

FAQ

What is the operating temperature range for XCV300-4BG352I?

The "I" suffix in XCV300-4BG352I denotes Industrial temperature grade, specifying operation from –40°C to +100°C junction temperature. This rating is validated per Xilinx DS003-1 (v4.0) and applies to all functional blocks including CLBs, IOBs, DLLs, and block RAM. Thermal derating is not required within this range, and the on-die temperature sensor diode provides real-time monitoring capability for thermal management systems.

Does XCV300-4BG352I support JTAG configuration?

Yes, XCV300-4BG352I fully supports IEEE 1149.1 JTAG boundary scan for configuration, debug, and verification. In JTAG mode, the device accepts configuration bitstreams via TDI/TDO, supports readback of configuration memory, and enables in-system programming without external PROM. All JTAG pins (TCK, TMS, TDI, TDO, TRST) are dedicated and electrically compliant with JTAG specification v2.0 as documented in DS003-4 Pinout Tables.

Can XCV300-4BG352I interface directly with DDR SDRAM?

Yes, XCV300-4BG352I supports DDR SDRAM interfacing through its SelectIO™ I/O standards - specifically SSTL2 Class I/II (for 2.5 V DDR) and SSTL3 Class I/II (for 3.3 V SDR). The FPGA's programmable drive strength, slew rate control, and DLL-based clock deskew enable reliable capture of DQS-strobed data at up to 133 MHz clock rates. External termination and VREF routing must comply with I/O banking rules per DS003-2 Section "I/O Banking".

What configuration modes does XCV300-4BG352I support?

XCV300-4BG352I supports four configuration modes: Master Serial (reads bitstream from external PROM via CCLK), Slave Serial (receives bitstream from external controller), SelectMAP™ (8-bit parallel configuration), and JTAG (boundary-scan programming). Mode selection is determined by M0–M2 pin states at power-up. All modes load the same SRAM-based configuration memory, enabling unlimited reprogramming cycles without wear-out concerns.

Is XCV300-4BG352I still in active production?

No, XCV300-4BG352I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and XCN10016 obsolescence notice. Aetrix Electronics maintains limited legacy inventory and provides extended lifecycle support - including traceable sourcing, configuration bitstream archiving, and technical documentation - for customers maintaining deployed systems or fulfilling end-of-life manufacturing commitments.