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AMD XCV300-4BG432C
- Part No.:
- XCV300-4BG432C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 432-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV300-4BG432C.pdf
- Description:
- IC FPGA 316 I/O 432MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,462
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Product details
Overview
XCV300-4BG432C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells in a 32×48 CLB array, and 316 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536 bits of block RAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV300-4BG432C datasheet, pinout, applications, or equivalent options, key selection considerations include its 200 MHz system performance ceiling, 4 DLLs for clock domain control, 316 I/O count in BG432, commercial temperature range (0°C to +85°C), and obsolescence status requiring lifecycle planning.
Technical Context
The XCV300-4BG432C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling high routability for complex designs. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and dual-port 4k-bit block RAMs arranged in two full-height columns.
Each IOB supports 16 SelectIO™ standards including LVTTL, LVCMOS2, HSTL Class IV, and SSTL3, with independent programmable drive strength (up to 24 mA source / 48 mA sink), slew rate control, and per-bank VCCO/VREF management across eight I/O banks. Configuration occurs via master serial, slave serial, SelectMAP™, or JTAG modes using external PROM or host controller.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 322,970 - defines total logic capacity for ASIC replacement or complex digital system integration |
| Logic Cells | 6,912 - provides granular, place-and-route-efficient resources for synchronous logic implementation |
| User I/O Pins | 316 - enables high-pin-count interface consolidation (e.g., memory buses, parallel video, multi-protocol I/O) |
| Block RAM Bits | 65,536 - delivers on-chip dual-ported memory for FIFOs, buffers, or coefficient storage without external SRAM |
| Max System Clock | 200 MHz - supports high-speed synchronous data paths including PCI 66 MHz and HSTL Class IV interfaces |
| Delay-Locked Loops | 4 - allows precise clock deskew, phase alignment, and jitter reduction across multiple clock domains |
| Operating Voltage | 2.5 V core / 3.3 V or 2.5 V I/O - requires separate core and I/O power domains with bank-specific VCCO assignment |
Pinout & Package
Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 35 mm × 35 mm, 1.27 mm pitch, commercial temperature grade (0°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew inputs feeding four primary global clock networks; essential for timing-critical synchronous design |
| IO_LxxN/IO_LxxP | User I/O Bank Pin | Differential or single-ended I/O grouped into eight voltage-isolated banks; each supports independent VCCO and shared VREF |
| CONFIG_IO | Configuration Control | Multi-function pin used for mode selection (master/slave serial, SelectMAP™, JTAG) during power-up and reconfiguration |
| CCLK | Configuration Clock | Input clock for master serial configuration; also serves as output during slave serial or SelectMAP™ programming |
| DIN/DOUT | Configuration Data | Serial data input (DIN) and bidirectional data I/O (DOUT) supporting bitstream loading and readback verification |
| VCCINT | Core Power Supply | 2.5 V supply for internal logic and CLBs; requires low-noise regulation and local decoupling |
| VCCO_0–VCCO_7 | I/O Bank Power | Eight independent VCCO supplies - each powers one I/O bank and sets output voltage level (e.g., 3.3 V for LVTTL, 1.5 V for HSTL) |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-Based In-System Reprogrammability | Enables unlimited field updates and design iteration without hardware change; supports four distinct configuration modes |
| Configurable LUT-as-RAM | Each 4-input LUT can operate as 16×1-bit synchronous RAM, 16×2-bit RAM, or 16-bit shift register - ideal for small buffers or DSP pipelines |
| Dedicated Carry Logic | Two per-slice carry chains enable high-speed arithmetic (e.g., 32-bit adders < 8 ns) without consuming LUT resources |
| IEEE 1149.1 Boundary Scan | Full JTAG TAP support for PCB-level interconnect testing, in-system debugging, and configuration verification |
| Die-Temperature Sensor Diode | On-die thermal diode allows real-time junction temperature monitoring via external circuitry - critical for thermal management in dense systems |
Applications
| PCI 66 MHz Interface Card | High-Speed Video Processing Engine |
|---|---|
Use Scenario: A Compact PCI carrier board implementing a 66 MHz PCI bus interface for data acquisition modules. IC Role / Device Role / Timing Role: FPGA acts as PCI target/master bridge with custom DMA engine and protocol logic; uses DLLs for clock deskew and GCLK nets for timing closure. Use Value: 316 I/O pins accommodate full 64-bit PCI bus plus sideband signals; 66-MHz PCI compliance and hot-swap support enable modular industrial backplane systems. | Use Scenario: Real-time HD video frame buffer and pixel pipeline in broadcast equipment with parallel RGB/YUV interfaces. IC Role / Device Role / Timing Role: FPGA implements dual-port video FIFOs using block RAM, pixel-rate timing generators, and parallel-to-serial conversion for HDMI output. Use Value: 65,536 bits of dual-ported block RAM provide ≥1-line video buffering at 74.25 MHz; SelectIO™ supports 3.3 V LVTTL and 1.5 V HSTL for mixed-voltage video I/O. |
| Communications Protocol Converter | Industrial Motion Control Hub |
Use Scenario: Protocol translation between legacy RS-422 fieldbus and modern Ethernet-based control network in factory automation. IC Role / Device Role / Timing Role: FPGA hosts UART cores, Ethernet MAC, and custom state machines; uses DLLs to synchronize asynchronous domains and manage jitter-sensitive timing. Use Value: Four DLLs enable independent clock domain bridging (e.g., 16 MHz UART, 25 MHz Ethernet, 50 MHz control logic); 16 SelectIO™ standards allow direct interfacing to diverse fieldbus voltages. | Use Scenario: Central motion controller coordinating up to 8 servo drives via parallel step/direction and encoder feedback buses. IC Role / Device Role / Timing Role: FPGA implements high-resolution PWM generators, quadrature decoder logic, and real-time safety monitoring using internal RAM and carry chains. Use Value: Dedicated carry logic achieves sub-10 ns propagation for 100 kHz PWM edge placement; 316 I/O pins support simultaneous 8-axis control with encoder inputs and analog monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300-5BG432C | Faster speed grade (-5 vs. -4); 10–15% higher timing margin for same design | Required where worst-case 200 MHz system clock must be guaranteed under full temperature/voltage variation | Select XCV300-5BG432C only if timing closure fails at -4 grade; identical pinout and configuration interface |
| XCV400-4BG432C | Higher density (468,252 gates, 10,800 logic cells, 404 I/O), same BG432 package footprint | Suitable for design scalability - retains PCB layout while adding logic capacity and I/O for future feature expansion | Choose XCV400-4BG432C when additional CLBs or block RAM (81,920 bits) are needed without changing board layout |
Compared with XCV300-4BG432C, the -5 speed grade offers tighter timing margins for demanding clock domains, while the XCV400-4BG432C provides 45% more logic and 25% more I/O in identical packaging - enabling drop-in capacity upgrades without PCB revision.
Availability
XCV300-4BG432C is available at Aetrix Electronics and suitable for industrial motion control hubs, PCI 66 MHz interface cards, and high-speed video processing engines requiring stable component supply despite its obsolete status.
Supply support for XCV300-4BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex family - including XCV300-4BG432C - was engineered for high-performance, high-density system integration in communications infrastructure, test equipment, and industrial control, emphasizing place-and-route efficiency and silicon utilization.
FAQ
Is XCV300-4BG432C still in active production?
No, XCV300-4BG432C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains verified legacy stock with full traceability and extended lifecycle support for existing designs.
What configuration modes does XCV300-4BG432C support?
XCV300-4BG432C supports four configuration modes: master serial (loads bitstream from external PROM), slave serial, SelectMAP™ (parallel programming via CPU bus), and JTAG (boundary scan and debug). Mode selection is controlled by CONFIG_IO pins at power-up.
Can XCV300-4BG432C interface directly with 5 V logic?
Yes - XCV300-4BG432C IOBs are 5 V tolerant for LVTTL, LVCMOS2, and PCI 5 V standards when VCCO = 3.3 V. However, 5 V tolerance is disabled for PCI 3.3 V, HSTL, and SSTL standards; those require strict 3.3 V or lower VCCO.
How many clock regions does XCV300-4BG432C have?
XCV300-4BG432C has four dedicated global clock networks (GCLK0–GCLK3) fed by four DLLs, plus 24 secondary local clock nets. This hierarchical clocking supports multi-domain synchronous design with low skew across large logic blocks.
What is the maximum block RAM depth/width configuration for XCV300-4BG432C?
XCV300-4BG432C contains sixteen 4,096-bit block RAMs. Each can be configured as dual-ported RAM with independent widths: 1×4096, 2×2048, 4×1024, 8×512, or 16×256 - enabling flexible data buffering, lookup tables, or FIFO implementations without external memory.
XCV300-4BG432C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 432-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 6912
- Total RAM Bits:
- 65536
- Number of I/O:
- 316
- Number of Gates:
- 322970
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 432-MBGA (40x40)
XCV300-4BG432C FAQ
1.How can I place an order for XCV300-4BG432C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV300-4BG432C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV300-4BG432C reliable?
The price and inventory of XCV300-4BG432C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-4BG432C is usually 5 days.
3.What payment methods are accepted for XCV300-4BG432C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-4BG432C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV300-4BG432C?
XCV300-4BG432C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV300-4BG432C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV300-4BG432C?
For technical support, including XCV300-4BG432C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-4BG432C requirements.
6.How does Aetrix verify that XCV300-4BG432C is sourced from the original manufacturer or authorized distributors?
All XCV300-4BG432C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-4BG432C meets industry standards.
7.What is the process for return or replacement of XCV300-4BG432C?
All XCV300-4BG432C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-4BG432C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV300-4BG432C part is unused and in its original packaging.
Return procedure for XCV300-4BG432C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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