AMD XCV300-4BG432C4307
- Part No.:
- XCV300-4BG432C4307
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 432-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV300-4BG432C4307.pdf
- Description:
- IC FPGA 316 I/O 432MBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,448
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Product details
Overview
XCV300-4BG432C4307 from AMD is a Virtex FPGA device used for configurable digital control, interface adaptation, and board-level subsystem integration within the Virtex platform. This orderable option combines the family architecture with the 432-LBGA Exposed Pad, Metal package used by this orderable option, which matters when the design must preserve validated routing assumptions and keep programmable logic centralized in one known footprint.
Original Virtex devices provide older high-performance FPGA integration for legacy communications, embedded digital systems, and board-level programmable logic designs that still depend on established Xilinx high-density footprints. For engineers reviewing the XCV300-4BG432C4307 datasheet, XCV300-4BG432C4307 pinout, XCV300-4BG432C4307 application, or XCV300-4BG432C4307 equivalent, this device is widely used in embedded control hardware, communications boards, industrial subsystems, programmable interface engines, and sustaining-production digital platforms.
Technical Context
In real hardware, XCV300-4BG432C4307 is used as a programmable logic platform rather than a fixed-function controller. The selected Virtex density and speed grade 4 orderable option. matter because logic capacity, I/O concentration, and escape routing all influence whether the device can absorb the intended subsystem workload.
The exact orderable code is important here: 432-LBGA Exposed Pad, Metal affects PCB footprint compatibility and escape routing, speed grade 4 orderable option. affects timing margin, and the commercial temperature option indicated by the suffix. defines whether the device stays aligned with the deployment environment or qualification target.
Virtex density point for sustaining-production programmable logic and high-I/O legacy board integration. In practice, this means XCV300-4BG432C4307 is chosen when the board must preserve a known programmable logic footprint while keeping interface adaptation, digital control, and subsystem-specific logic inside one FPGA device.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Device Type | Virtex FPGA. |
| Series | Virtex |
| Package | 432-LBGA Exposed Pad, Metal package with bulk packing. |
| Speed Grade | Speed grade 4 orderable option. |
| Operating Range | Commercial temperature option indicated by the suffix. |
| Architecture Role | Field-programmable logic device for configurable digital control, interface adaptation, and subsystem integration. |
| Integration Focus | Used where board-specific programmable logic, timing behavior, and interface glue functions need to be consolidated. |
| Programming Model | Configuration-based FPGA platform within the referenced AMD/Xilinx family. |
Pinout & Package
The XCV300-4BG432C4307 pinout includes configurable user I/O, supply rails, configuration resources, and package-specific escape pins within 432-LBGA Exposed Pad, Metal package.
For PCB work, the main concerns are footprint continuity, power integrity, configuration access, and preserving routing around subsystem interfaces and timing-critical digital nets.
| Pin / Function | PCB Design and Circuit Role |
|---|---|
| User I/O Pins | Configurable pins used for subsystem interfaces, address/data paths, timing signals, and board-specific digital connectivity. |
| Clock / Timing Pins | Support synchronous logic behavior and clock distribution within the programmable fabric. |
| Configuration / JTAG Pins | Support device programming, configuration control, and board-level debug or bring-up access. |
| Power Rails | Support the core and I/O voltage domains required by the selected FPGA family. |
| Ground Pins | Provide the return paths needed for stable digital switching and noise control. |
Key Features
- Configurable FPGA fabric supports board-specific logic, control, and interface integration.
- Package options help preserve established PCB footprints and routing strategies.
- Orderable speed grades help align the device with validated board timing margins.
- Suitable for sustaining-production digital control and interface-consolidation functions.
- Supports long-life hardware programs that depend on programmable logic flexibility.
- Field-programmable behavior preserves updateability across maintenance revisions.
Applications
| Embedded Digital Control | Interface Concentration |
|---|---|
|
Use Scenario: Used where one FPGA centralizes timing, state-machine, and control behavior on the board. IC Role: Acts as the configurable digital control layer. Use Value: Keeps board-specific logic updateable without redesigning multiple fixed-function ICs. |
Use Scenario: Used to absorb multiple board-level interfaces or protocol adaptation tasks inside one programmable device. IC Role: Centralizes interface translation and digital routing. Use Value: Reduces discrete logic count and preserves a cleaner subsystem partition. |
| Industrial or Communications Boards | Programmable Subsystem Integration |
|
Use Scenario: Used in long-life boards that still rely on FPGA-based control, routing, or glue logic. IC Role: Implements board-specific digital behavior and subsystem integration. Use Value: Supports sustaining-production maintenance without a full architecture change. |
Use Scenario: Used when a design must keep logic concentrated in one FPGA while preserving a known package and timing profile. IC Role: Provides the programmable core for subsystem-specific digital functions. Use Value: Improves lifecycle continuity and board-compatibility planning. |
Equivalent & Alternatives
When evaluating a XCV300-4BG432C4307 equivalent, engineers should compare family generation, package footprint, speed grade, operating range, and whether the replacement preserves subsystem compatibility.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300-4BG432C4307 | Closely related orderable option in the same or adjacent family density with a different package, speed, or qualification emphasis. | Used when the board stays in the same general FPGA family but requires a different orderable fit. | Compare package, speed grade, suffix, and validated system margins before substitution. |
| XCV400E-6BG560C | Alternative programmable logic option that can serve a similar board-level role with a different density or family emphasis. | Used in comparable embedded, industrial, or communications applications when the design tradeoff shifts. | Choose according to footprint compatibility, logic capacity, and platform continuity. |
Compared with XCV300-4BG432C4307, XCV300-4BG432C4307 selection depends on exact package, speed grade, suffix, and board-compatibility fit. XCV300-4BG432C4307 vs XCV400E-6BG560C selection depends on whether the design should remain in the same FPGA path or shift to another density with different integration tradeoffs.
Quality
XCV300-4BG432C4307 should be sourced as original AMD/Xilinx programmable logic inventory through traceable supply channels. Quality checks may include package inspection, top-mark validation, configuration access checks, and board-level bring-up verification.
Production validation should include power-sequencing review, configuration reliability, timing-margin confirmation, and signal-integrity checks around programmable I/O paths.
Availability
XCV300-4BG432C4307 is suitable for programmable subsystem integration, board-level digital control, and interface functions in embedded, industrial, and communications hardware.
Supply support may include volume procurement planning, scheduled delivery arrangements, traceable sourcing management, and long-term supply support for OEM, industrial electronics, automotive electronics, and embedded product programs. Sample and NPI supply support, as well as urgent in-stock supply support, can also be arranged for prototype builds, pilot runs, and time-critical production needs.
For production builds, confirming package option, speed grade, operating-range suffix, lifecycle status, and sourcing continuity helps reduce procurement risk for programmable logic families.
Manufacturer
AMD is a semiconductor manufacturer whose adaptive computing and programmable logic portfolio includes FPGA devices, CPLDs, configuration solutions, embedded processing platforms, and related development technologies for industrial, communication, computing, automotive, and embedded electronic systems.
Original Virtex devices provide older high-performance FPGA integration for legacy communications, embedded digital systems, and board-level programmable logic designs that still depend on established Xilinx high-density footprints. Virtex density point for sustaining-production programmable logic and high-I/O legacy board integration.
FAQ
What is XCV300-4BG432C4307 used for?
XCV300-4BG432C4307 is used for configurable digital control, interface concentration, and board-level subsystem integration in FPGA-based hardware.
Where can I find the XCV300-4BG432C4307 datasheet download?
The XCV300-4BG432C4307 datasheet can be accessed from the confirmed family source used for this repair pass.
What should be considered in XCV300-4BG432C4307 pinout design?
Designers should account for power domains, configuration access, package-driven routing, and how programmable I/O maps to board interfaces.
Is XCV300-4BG432C4307 a modern FPGA?
It belongs to a defined AMD/Xilinx programmable logic line with board-level configurable logic resources.
What are common XCV300-4BG432C4307 equivalent solutions?
Common candidates include XCV300-4BG432C4307 and XCV400E-6BG560C depending on package, family architecture, logic density, and system-level compatibility needs.
XCV300-4BG432C4307 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- *
- Package/Case:
- 432-LBGA Exposed Pad, Metal
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 6912
- Total RAM Bits:
- 65536
- Number of I/O:
- 316
- Number of Gates:
- 322970
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 432-MBGA (40x40)
XCV300-4BG432C4307 FAQ
1.How can I place an order for XCV300-4BG432C4307 through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV300-4BG432C4307 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV300-4BG432C4307 reliable?
The price and inventory of XCV300-4BG432C4307 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-4BG432C4307 is usually 5 days.
3.What payment methods are accepted for XCV300-4BG432C4307?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-4BG432C4307 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV300-4BG432C4307?
XCV300-4BG432C4307 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV300-4BG432C4307 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV300-4BG432C4307?
For technical support, including XCV300-4BG432C4307 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-4BG432C4307 requirements.
6.How does Aetrix verify that XCV300-4BG432C4307 is sourced from the original manufacturer or authorized distributors?
All XCV300-4BG432C4307 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-4BG432C4307 meets industry standards.
7.What is the process for return or replacement of XCV300-4BG432C4307?
All XCV300-4BG432C4307 units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-4BG432C4307, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV300-4BG432C4307 part is unused and in its original packaging.
Return procedure for XCV300-4BG432C4307:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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