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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV300-4BG432C4307

Name: XCV300-4BG432C4307
Brand: AMD
SKU: XCV300-4BG432C4307
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV300-4BG432C4307

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 432-LBGA Exposed Pad, Metal

Datasheet:: XCV300-4BG432C4307.pdf

Description:: IC FPGA 316 I/O 432MBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XCV300-4BG432C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 411,955 system gates, 6,912 logic cells, and 32 block RAMs totaling 131,072 bits. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels). It is used in high-speed communication interface design requiring PCI-compliant 33/66-MHz operation.

For engineers reviewing the XCV300-4BG432C datasheet, pinout, applications, or equivalent options, key selection criteria include its 432-ball BGA package, -4 speed grade, commercial temperature range (0°C to +85°C), and compatibility with SelectI/O+ standards including SSTL3, HSTL, and LVCMOS.

Technical Context

The XCV300-4BG432C implements a flexible CLB architecture with two slices per CLB, each containing four 4-input LUTs, dedicated carry logic, and dual flip-flops with independent clock enable, synchronous/asynchronous set/reset. Its eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×.

I/O banking enforces voltage domain isolation: VCCO powers output drivers and LVTTL/LVCMOS/PCI input buffers, while VREF is required for SSTL/HSTL/GTL standards. Each of the eight I/O banks supports mixed standards only when sharing identical VCCO and VREF values - e.g., LVTTL and PCI33_3 may coexist in a 3.3 V bank, but not with SSTL3-I (1.5 V VREF).

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	411,955 - determines maximum combinational logic capacity for ASIC replacement
Logic Cells	6,912 - provides configurable logic resources for RTL implementation and place-and-route density
Block RAM Bits	131,072 - enables true dual-port memory structures up to 4096 × 32-bit per block
DLL Count	8 - supports independent clock domain management, jitter reduction, and DDR timing control
Max Differential I/O Pairs	137 - enables high-bandwidth SerDes-adjacent interfaces using LVDS/BLVDS
Package	432-ball BGA (BG432) - defines PCB footprint, thermal dissipation, and signal integrity constraints
Speed Grade	-4 - specifies worst-case timing performance at commercial temperature (Tj = 0°C to +85°C)
VCCINT	1.8 V - sets core logic supply voltage; lower than Virtex family's 2.5 V, reducing dynamic power

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 1.0 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK7	Global Clock Input	Dedicated low-skew routing to all DLLs and CLBs; supports LVPECL/LVDS inputs up to 300+ MHz
VCCINT	Core Logic Supply	1.8 V supply for CLBs, RAM, and interconnect; decoupling critical for timing closure
VCCO_0–VCCO_7	I/O Bank Power	Bank-specific 1.5/1.8/2.5/3.3 V supply for output drivers and compatible input buffers
VREF_0–VREF_7	I/O Threshold Reference	User-supplied reference for SSTL/HSTL/GTL inputs; shared across all pins in same bank
TCK/TMS/TDI/TDO	JTAG Boundary Scan	IEEE 1149.1-compliant test access port for configuration and in-system verification
PROGRAM_B	Configuration Reset	Active-low asynchronous reset that clears configuration memory and initiates reconfiguration

Key Features

Feature	Design Value
SelectI/O+ Technology	Supports 20 I/O standards (e.g., SSTL3-I, HSTL-IV, LVCMOS2) with bank-isolated VCCO/VREF control
SelectRAM+ Memory Hierarchy	131,072 bits of true dual-port block RAM + 98,304 bits distributed RAM for pipelined data buffering
SelectLink™ DDR Link	Enables high-speed bidirectional data transfer between FPGA and external DDR SDRAM at 200 Mb/s
Digital DLLs	Eight fully digital delay-locked loops eliminate analog PLL complexity and support deterministic clock deskew
SRAM-Based Configuration	Unlimited in-system reprogramming via JTAG, SelectMAP, or master serial mode using external PROM
Die Temperature Sensor	On-die diode enables real-time thermal monitoring for thermal throttling or fan control in embedded systems

Applications

High-Speed Communication Interface	PCI Bus Acceleration
Use Scenario: Implementing a 66-MHz, 64-bit PCI-X bridge between host processor and custom peripheral ASIC. IC Role / Device Role / Timing Role: XCV300-4BG432C acts as protocol translator and timing adapter, managing setup/hold timing, parity generation, and burst transaction arbitration. Use Value: Leverages PCI-compliant 3.3 V I/O, 8 DLLs for clock domain crossing, and 137 differential pairs for clean address/data strobe signaling.	Use Scenario: Offloading packet classification and header parsing in enterprise network line cards. IC Role / Device Role / Timing Role: XCV300-4BG432C serves as programmable packet processing engine, executing TCAM-like match logic using distributed RAM and fast carry chains. Use Value: Uses 6,912 logic cells for parallel pattern matching and 131,072-bit block RAM for rule table storage with true dual-port access.
DDR SDRAM Controller	LVDS Serializer/Deserializer
Use Scenario: Driving 200 Mb/s DDR SDRAM in medical imaging subsystem for real-time frame buffering. IC Role / Device Role / Timing Role: XCV300-4BG432C implements full DDR controller with DQS capture, write leveling, and refresh scheduling. Use Value: Uses SelectLink™ methodology and DLL-synchronized outputs to meet tight DDR timing windows without external PHY.	Use Scenario: Converting parallel video data (e.g., 24-bit RGB + sync) to serialized LVDS streams for panel interface. IC Role / Device Role / Timing Role: XCV300-4BG432C functions as serializer with embedded clock recovery, aligning parallel data to LVDS clock at 622 Mb/s. Use Value: Exploits native LVDS I/O support, 137 differential pairs, and DLL-based clock multiplication for precise bit alignment.

High-Speed Communication Interface

PCI Bus Acceleration

Use Scenario: Implementing a 66-MHz, 64-bit PCI-X bridge between host processor and custom peripheral ASIC.

IC Role / Device Role / Timing Role: XCV300-4BG432C acts as protocol translator and timing adapter, managing setup/hold timing, parity generation, and burst transaction arbitration.

Use Value: Leverages PCI-compliant 3.3 V I/O, 8 DLLs for clock domain crossing, and 137 differential pairs for clean address/data strobe signaling.

Use Scenario: Offloading packet classification and header parsing in enterprise network line cards.

IC Role / Device Role / Timing Role: XCV300-4BG432C serves as programmable packet processing engine, executing TCAM-like match logic using distributed RAM and fast carry chains.

Use Value: Uses 6,912 logic cells for parallel pattern matching and 131,072-bit block RAM for rule table storage with true dual-port access.

DDR SDRAM Controller

LVDS Serializer/Deserializer

Use Scenario: Driving 200 Mb/s DDR SDRAM in medical imaging subsystem for real-time frame buffering.

IC Role / Device Role / Timing Role: XCV300-4BG432C implements full DDR controller with DQS capture, write leveling, and refresh scheduling.

Use Value: Uses SelectLink™ methodology and DLL-synchronized outputs to meet tight DDR timing windows without external PHY.

Use Scenario: Converting parallel video data (e.g., 24-bit RGB + sync) to serialized LVDS streams for panel interface.

IC Role / Device Role / Timing Role: XCV300-4BG432C functions as serializer with embedded clock recovery, aligning parallel data to LVDS clock at 622 Mb/s.

Use Value: Exploits native LVDS I/O support, 137 differential pairs, and DLL-based clock multiplication for precise bit alignment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV300E-6BG432C	Higher speed grade (-6 vs. -4); 15–20% faster register-to-register timing; identical pinout and memory resources	Suitable for designs requiring >130 MHz internal clocking or tighter I/O timing margins	Select XCV300E-6BG432C when timing closure fails at -4 grade or when migrating legacy Virtex-E designs compiled for -6
XCV400E-4BG432C	Larger device: 569,952 system gates, 10,800 logic cells, 40 block RAMs (163,840 bits); same BG432 package and -4 speed grade	Provides headroom for design expansion, additional IP integration, or multi-function consolidation	Choose XCV400E-4BG432C when logic utilization exceeds 85% on XCV300-4BG432C or when future feature upgrades are anticipated

Compared with XCV300-4BG432C, the XCV300E-6BG432C offers higher timing margin without layout change, while the XCV400E-4BG432C delivers scalable logic and memory capacity within identical mechanical and thermal constraints.

Availability

XCV300-4BG432C is available at Aetrix Electronics and suitable for high-speed communication interface design, PCI bus acceleration, DDR SDRAM controller implementation, and LVDS serializer/deserializer applications requiring stable component supply and long-term industrial availability.

Supply support for XCV300-4BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and AI inference accelerators for aerospace, automotive, and data center markets.

The Virtex-E product line was engineered for high-performance, low-power reconfigurable computing in communications infrastructure and test equipment, emphasizing I/O flexibility, clock management, and memory bandwidth.

FAQ

Is XCV300-4BG432C still in production?

No, XCV300-4BG432C is obsolete per Xilinx Notice XCN09001 and XCN12026 (March 2014). Aetrix Electronics maintains limited legacy inventory and supports obsolescence mitigation through cross-reference analysis, second-source qualification, and lifetime buy planning for XCV300-4BG432C.

What is the maximum differential I/O bandwidth supported by XCV300-4BG432C?

XCV300-4BG432C supports up to 137 differential I/O pairs, enabling aggregate bandwidth exceeding 100 Gb/s when operating at 622 Mb/s per LVDS channel. This is achieved using dedicated differential routing resources and DLL-synchronized output timing.

Does XCV300-4BG432C support true dual-port block RAM?

Yes, XCV300-4BG432C includes 32 block RAMs, each configured as a true dual-port 4096-bit memory with independent read/write addresses, clocks, and enables per port - enabling simultaneous access for data buffering and lookup operations without contention.

Can XCV300-4BG432C be configured via JTAG in-system?

Yes, XCV300-4BG432C supports IEEE 1149.1 JTAG boundary scan for in-system configuration, debugging, and verification. TCK/TMS/TDI/TDO pins enable programming, readback, and functional testing without requiring external PROM or dedicated configuration circuitry.

What I/O standards are supported by XCV300-4BG432C in a single I/O bank?

In any given I/O bank of XCV300-4BG432C, only standards sharing identical VCCO and VREF requirements may coexist - e.g., LVTTL and PCI33_3 (both 3.3 V VCCO, no VREF) or SSTL3-I and SSTL3-II (both 3.3 V VCCO, 1.5 V VREF). Mixing incompatible standards causes configuration failure or I/O corruption.

XCV300-4BG432C4307 Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: *

Package/Case:: 432-LBGA Exposed Pad, Metal

Packaging:: Bulk

Product Status:: Active

Programmable:: Not Verified

Number of LABs/CLBs:: 1536

Number of Logic Elements/Cells:: 6912

Total RAM Bits:: 65536

Number of I/O:: 316

Number of Gates:: 322970

Voltage - Supply:: 2.375V ~ 2.625V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 432-MBGA (40x40)

XCV300-4BG432C4307 FAQ

1.How can I place an order for XCV300-4BG432C4307 through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300-4BG432C4307 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300-4BG432C4307 reliable?

The price and inventory of XCV300-4BG432C4307 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-4BG432C4307 is usually 5 days.

3.What payment methods are accepted for XCV300-4BG432C4307?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-4BG432C4307 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300-4BG432C4307?

XCV300-4BG432C4307 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300-4BG432C4307 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300-4BG432C4307?

For technical support, including XCV300-4BG432C4307 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-4BG432C4307 requirements.

6.How does Aetrix verify that XCV300-4BG432C4307 is sourced from the original manufacturer or authorized distributors?

All XCV300-4BG432C4307 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-4BG432C4307 meets industry standards.

7.What is the process for return or replacement of XCV300-4BG432C4307?

All XCV300-4BG432C4307 units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-4BG432C4307, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300-4BG432C4307 part is unused and in its original packaging.

Return procedure for XCV300-4BG432C4307:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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