AMD XCV300-4BG432I

Overview

XCV300-4BG432I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, 316 user I/O pins, and four dedicated delay-locked loops (DLLs) for advanced clock control-designed for high-speed PCI-compliant interface implementation in industrial embedded systems.

For engineers reviewing the XCV300-4BG432I datasheet, pinout, applications, or equivalent options, key selection considerations include its 0.22 μm 5-layer metal CMOS process, 200 MHz system performance ceiling, 66-MHz PCI compliance, hot-swap capability for Compact PCI, and support for 16 SelectIO™ interface standards including HSTL Class IV and SSTL3.

Technical Context

The XCV300-4BG432I implements a hierarchical architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), and a programmable routing matrix. Each CLB contains four logic cells with 4-input LUTs, carry logic, and dual flip-flops per slice-enabling high-speed arithmetic and wide-input function synthesis via F5/F6 multiplexers.

Its IOB structure supports dual-edge-triggered D-flip-flops with independent clock enable, synchronous/asynchronous set/reset, and programmable polarity. The device features eight I/O banks with bank-specific VCCO and VREF constraints, enabling mixed-voltage signaling such as LVTTL (3.3 V), SSTL2 (2.5 V), and HSTL Class IV (1.5 V).

Key Specifications

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (FBGA), RoHS-compliant, industrial temperature range (–40°C to +100°C). Pinout conforms to DS003-4 (v4.0) Module 4 - full pin function mapping available in official Xilinx documentation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Compared with XCV300-4BG432I, the -5 speed grade offers measurable timing margin improvement without changing PCB layout, while XCV400-4BG432I provides significantly greater logic and memory resources at identical package and pinout-enabling seamless migration within the same footprint.

Availability

XCV300-4BG432I is available at Aetrix Electronics and suitable for industrial control, test instrumentation, and legacy telecom infrastructure requiring stable component supply and long-term lifecycle support.

Supply support for XCV300-4BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures widely adopted in aerospace, communications, and industrial markets.

The Virtex family was engineered for high-performance, high-density logic implementation in systems demanding 200 MHz operation, multi-standard I/O, and embedded memory-targeting PCI, CompactPCI, and high-speed memory interface applications.

FAQ

What is the operating temperature range for XCV300-4BG432I?

The XCV300-4BG432I is rated for industrial temperature operation from –40°C to +100°C (junction temperature), as indicated by the "I" suffix in its ordering code. This rating applies to both core logic (VCCINT = 2.5 V) and I/O banks (VCCO configurable per bank), and requires adherence to Xilinx thermal derating guidelines under sustained load conditions. The die-temperature sensor diode embedded in the XCV300-4BG432I enables real-time thermal monitoring in deployed systems.

Does XCV300-4BG432I support JTAG boundary scan?

Yes, XCV300-4BG432I fully implements IEEE 1149.1 boundary scan functionality via dedicated TCK, TMS, TDI, and TDO pins. This allows in-system programming, interconnect testing, and debug visibility without requiring external probes. The boundary scan chain covers all user I/Os and internal logic elements, and is accessible through standard JTAG tools compatible with Xilinx iMPACT or Vivado hardware managers.

Can XCV300-4BG432I interface directly with 3.3 V LVTTL and 1.5 V HSTL devices on the same board?

Yes, XCV300-4BG432I supports simultaneous LVTTL (3.3 V) and HSTL Class IV (1.5 V) signaling-but only when assigned to separate I/O banks. Each bank must have its own VCCO and VREF supply; mixing standards within one bank is prohibited unless they share identical VCCO and VREF requirements. Table 2 in DS003-2 confirms LVTTL and HSTL Class IV are incompatible within the same bank due to differing VCCO values.

What configuration modes does XCV300-4BG432I support?

XCV300-4BG432I supports four configuration modes: Master Serial (loading bitstream from external PROM), Slave Serial (bitstream driven by external controller), SelectMAP (8-bit parallel interface), and JTAG (boundary-scan programming). Configuration is SRAM-based and volatile-requiring reload on power-up. The PROGRAM_B pin initiates reconfiguration, and INIT_B signals successful loading or failure condition.

Is XCV300-4BG432I still in active production?

No, XCV300-4BG432I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with end-of-life status confirmed in XCN10016. However, Aetrix Electronics maintains verified legacy inventory with full traceability, conforming to original Xilinx specifications and screening. For new designs, Xilinx recommends migration paths to Spartan-6 or Artix-7 families, though XCV300-4BG432I remains supported for repair, replacement, and sustainment programs.