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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV300-4FG456C

Name: XCV300-4FG456C
Brand: AMD
SKU: XCV300-4FG456C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV300-4FG456C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 456-BBGA

Datasheet:: XCV300-4FG456C.pdf

Description:: IC FPGA 312 I/O 456FBGA

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Product details

Overview

XCV300-4FG456C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, and 316 user I/O pins in a 456-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536 bits of block RAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV300-4FG456C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility (LVTTL, HSTL, SSTL), and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0).

Technical Context

The XCV300-4FG456C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain two slices each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and dual-port synchronous storage elements.

Each IOB supports independent input/output flip-flops with programmable polarity, synchronous/asynchronous set/reset, clock enable, and optional input delay to eliminate pad-to-pad hold time. I/O banks enforce voltage segregation: VCCO must be uniform per bank (e.g., 3.3 V for LVTTL/PCI, 1.5 V for HSTL Class IV), and VREF is required for standards like SSTL2/SSTL3 but incompatible with 5 V-tolerant modes.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	322,970 - defines total logic capacity for gate-equivalent synthesis mapping
Logic Cells	6,912 - actual count of configurable logic blocks (CLBs), each containing 4 logic cells
User I/O Pins	316 - maximum available bidirectional user I/O in FG456 package, excluding dedicated clocks
Block RAM Bits	65,536 - distributed across 16 × 4,096-bit dual-port synchronous RAM blocks for high-bandwidth data buffering
Speed Grade	-4 - guarantees worst-case performance up to 200 MHz system clock rate including I/O paths
DLL Count	4 - dedicated delay-locked loops for skew compensation on global clock nets and domain crossing
Operating Voltage	2.5 V core (VCCINT), 3.3 V / 2.5 V / 1.5 V I/O (VCCO) - requires separate power domains per I/O bank

Pinout & Package

Package: 456-ball Fine-pitch Ball Grid Array (FG456), RoHS-compliant, commercial temperature range (0°C to +85°C). Pinout follows Xilinx DS003-4 (v4.0) Module 4 - full pin function tables, bank assignments, and VCCO/VREF allocations are defined per ball position. I/O banks are organized as eight independent groups (Bank 0–7), each requiring uniform VCCO and at most one VREF voltage.

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Dedicated low-skew inputs feeding four primary global clock distribution networks
CCLK	Configuration Clock	Input used during master serial configuration mode; drives internal bitstream loading sequence
DIN / DOUT	Serial Configuration Data	Asynchronous serial interface for PROM-based bitstream loading (DIN) and readback (DOUT)
TCK / TMS / TDI / TDO	JTAG Boundary Scan	IEEE 1149.1-compliant test access port for programming, debugging, and verification
VCCINT	Core Power Supply	2.5 V supply for CLB, BRAM, and routing logic; decoupling required per Xilinx layout guidelines
VCCO_0–VCCO_7	I/O Bank Power	Bank-specific output supply pins - all VCCO pins in same bank must share identical voltage
VREF_0–VREF_7	I/O Reference Voltage	Bank-specific threshold reference for SSTL/HSTL inputs - internally tied within bank

Key Features

Feature	Design Value
SRAM-based reconfiguration	Unlimited in-system reprogramming via JTAG, SelectMAP™, or serial PROM - enables field updates and design iteration without hardware change
Dual-port block RAM	16 × 4,096-bit synchronous RAM blocks with independent address/data/control per port - supports true simultaneous read/write for FIFOs and frame buffers
SelectIO™ interface flexibility	Support for 16 I/O standards (LVTTL, SSTL3, HSTL Class IV, GTL+) with per-pin drive strength/slew control - eliminates level-shifter ICs in mixed-voltage systems
Dedicated arithmetic carry chain	Two-bit-per-CLB carry propagation per slice - enables high-speed adders, counters, and accumulators without LUT resource consumption
Configurable LUT memory	Each 4-input LUT can operate as 16×1-bit RAM, 16×2-bit RAM, 32×1-bit RAM, or 16-bit shift register - provides distributed memory for DSP taps and pipeline staging

Applications

PCI Bridge Controller	High-Speed Data Acquisition
Use Scenario: Implementing a 66-MHz PCI bus master interface between host CPU and custom peripherals in industrial control chassis. IC Role / Device Role / Timing Role: FPGA acts as PCI target and initiator with hard-wired timing compliance, DLL-synchronized setup/hold margins, and 32-bit/33–66 MHz transaction handling. Use Value: Eliminates ASIC development cycle; leverages XCV300-4FG456C's native PCI compliance, 316 I/O for address/data/multiplexed control, and DLL-controlled clock domain bridging.	Use Scenario: Capturing parallel 14-bit ADC samples at 100 MSPS with real-time histogramming and burst-mode DMA to SDRAM. IC Role / Device Role / Timing Role: FPGA serves as high-speed interface controller, using LUT-based shift registers for sample capture, block RAM for histogram bins, and SelectIO™ for LVDS ADC interfacing. Use Value: Achieves deterministic latency via dedicated carry logic for counter-based binning and dual-port BRAM for concurrent capture/transfer - enabled by XCV300-4FG456C's 65,536-bit block RAM and 200 MHz system clock capability.
Telecom Line Card Interface	Reconfigurable Protocol Converter
Use Scenario: Aggregating eight T1/E1 streams into a single OC-3 SONET framer with HDLC and CRC-32 offload. IC Role / Device Role / Timing Role: FPGA implements multi-channel time-division multiplexing, line coding (AMI/B8ZS), and framer logic with precise jitter tolerance managed by DLL-stabilized clocks. Use Value: Uses XCV300-4FG456C's four DLLs to independently lock to each T1 clock domain while maintaining OC-3 output phase alignment - critical for telecom synchronization standards.	Use Scenario: Translating between RS-422 serial protocol and SPI-based sensor network in avionics subsystems with EMI-hardened cabling. IC Role / Device Role / Timing Role: FPGA performs protocol state-machine translation, signal conditioning, and galvanic isolation interface management using IOB flip-flops with programmable input delay. Use Value: Leverages XCV300-4FG456C's per-IOB input delay matching to internal clock distribution - ensures zero pad-to-pad hold time across wide-temperature industrial operation (0°C to +85°C).

PCI Bridge Controller

High-Speed Data Acquisition

Use Scenario: Implementing a 66-MHz PCI bus master interface between host CPU and custom peripherals in industrial control chassis.

IC Role / Device Role / Timing Role: FPGA acts as PCI target and initiator with hard-wired timing compliance, DLL-synchronized setup/hold margins, and 32-bit/33–66 MHz transaction handling.

Use Value: Eliminates ASIC development cycle; leverages XCV300-4FG456C's native PCI compliance, 316 I/O for address/data/multiplexed control, and DLL-controlled clock domain bridging.

Use Scenario: Capturing parallel 14-bit ADC samples at 100 MSPS with real-time histogramming and burst-mode DMA to SDRAM.

IC Role / Device Role / Timing Role: FPGA serves as high-speed interface controller, using LUT-based shift registers for sample capture, block RAM for histogram bins, and SelectIO™ for LVDS ADC interfacing.

Use Value: Achieves deterministic latency via dedicated carry logic for counter-based binning and dual-port BRAM for concurrent capture/transfer - enabled by XCV300-4FG456C's 65,536-bit block RAM and 200 MHz system clock capability.

Telecom Line Card Interface

Reconfigurable Protocol Converter

Use Scenario: Aggregating eight T1/E1 streams into a single OC-3 SONET framer with HDLC and CRC-32 offload.

IC Role / Device Role / Timing Role: FPGA implements multi-channel time-division multiplexing, line coding (AMI/B8ZS), and framer logic with precise jitter tolerance managed by DLL-stabilized clocks.

Use Value: Uses XCV300-4FG456C's four DLLs to independently lock to each T1 clock domain while maintaining OC-3 output phase alignment - critical for telecom synchronization standards.

Use Scenario: Translating between RS-422 serial protocol and SPI-based sensor network in avionics subsystems with EMI-hardened cabling.

IC Role / Device Role / Timing Role: FPGA performs protocol state-machine translation, signal conditioning, and galvanic isolation interface management using IOB flip-flops with programmable input delay.

Use Value: Leverages XCV300-4FG456C's per-IOB input delay matching to internal clock distribution - ensures zero pad-to-pad hold time across wide-temperature industrial operation (0°C to +85°C).

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV300-5FG456C	Higher speed grade (-5 vs. -4); guarantees 225 MHz max system clock vs. 200 MHz	Required for designs exceeding 200 MHz timing closure with worst-case process/voltage/temperature corners	Select when timing margin is insufficient with -4 grade; identical pinout, package, and configuration interface
XCV400-4FG456C	Higher density (468,252 system gates, 10,800 logic cells, 404 I/O) in same FG456 package	Needed for larger logic footprint or additional I/O count beyond XCV300-4FG456C's 316-pin limit	Choose for scalability path; shares same package footprint and I/O banking structure - enables PCB reuse

Compared with XCV300-4FG456C, the -5 speed grade offers tighter timing margins for high-frequency control loops, while the XCV400-4FG456C provides headroom for logic expansion without changing board layout - both maintain identical configuration modes, SelectIO™ support, and DLL architecture.

Availability

XCV300-4FG456C is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed data acquisition systems, telecom line card interfaces, and reconfigurable protocol converters requiring stable component supply throughout extended product lifecycles.

Supply support for XCV300-4FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design toolchains widely adopted in aerospace, communications, and industrial automation.

The Virtex family - including XCV300-4FG456C - was engineered for high-performance, high-density system integration in applications demanding 66-MHz PCI compliance, multi-standard I/O, and deterministic clock management, targeting telecom infrastructure and test equipment markets.

FAQ

What is the maximum operating frequency supported by the XCV300-4FG456C?

The XCV300-4FG456C is rated for a maximum system clock frequency of 200 MHz under worst-case conditions (speed grade -4, commercial temperature, 2.5 V core). This includes I/O timing and accounts for setup/hold margins across all supported SelectIO™ standards. Actual achievable frequency depends on design placement, routing, and logic depth - verified using Xilinx Foundation or Alliance Series tools with DS003-3 timing models.

Does the XCV300-4FG456C support hot-swap operation in Compact PCI systems?

Yes, the XCV300-4FG456C supports hot-swappable operation in Compact PCI systems as specified in DS003-1. Its I/O architecture meets the electrical and timing requirements for live insertion/removal, including controlled slew rates, bus-hold functionality via weak-keeper circuits, and robust ESD protection. Implementation requires adherence to Xilinx's recommended power sequencing and configuration state retention guidelines during slot insertion.

How many block RAM resources does the XCV300-4FG456C provide, and what configurations are supported?

The XCV300-4FG456C integrates 16 block SelectRAM™ units, totaling 65,536 bits of dedicated synchronous dual-port memory. Each block supports independent port widths (1–16 bits) and depths (256–4096), with aspect ratios defined in DS003-2 Table 4. Configurations include true dual-port operation, single-port RAM, and ROM mode - all accessible via dedicated routing to CLBs without consuming logic resources.

Can the XCV300-4FG456C be configured via JTAG, and what other modes are supported?

Yes, the XCV300-4FG456C supports IEEE 1149.1 JTAG configuration for programming, debugging, and boundary-scan testing. Additional modes include master serial (via external PROM), slave serial (host-driven), and SelectMAP™ (8- or 16-bit parallel interface). All modes use the same bitstream format and are mutually exclusive - selection is determined by configuration mode pins (M0–M2) at power-up.

Is the XCV300-4FG456C still in active production, and what is its obsolescence status?

No, the XCV300-4FG456C is obsolete. Per Xilinx DS003-1 (v4.0) revision history dated March 2013, all Virtex devices - including XCV300-4FG456C - were declared obsolete. Aetrix Electronics maintains legacy inventory with full traceability and offers engineering support for lifecycle management, including migration paths to Spartan-6 or Artix-7 families where functionally appropriate.

XCV300-4FG456C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®

Package/Case:: 456-BBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 1536

Number of Logic Elements/Cells:: 6912

Total RAM Bits:: 65536

Number of I/O:: 312

Number of Gates:: 322970

Voltage - Supply:: 2.375V ~ 2.625V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 456-FBGA (23x23)

XCV300-4FG456C FAQ

1.How can I place an order for XCV300-4FG456C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300-4FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300-4FG456C reliable?

The price and inventory of XCV300-4FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-4FG456C is usually 5 days.

3.What payment methods are accepted for XCV300-4FG456C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-4FG456C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300-4FG456C?

XCV300-4FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300-4FG456C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300-4FG456C?

For technical support, including XCV300-4FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-4FG456C requirements.

6.How does Aetrix verify that XCV300-4FG456C is sourced from the original manufacturer or authorized distributors?

All XCV300-4FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-4FG456C meets industry standards.

7.What is the process for return or replacement of XCV300-4FG456C?

All XCV300-4FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-4FG456C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300-4FG456C part is unused and in its original packaging.

Return procedure for XCV300-4FG456C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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