AMD XCV300-4FG456I

Overview

XCV300-4FG456I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells in a 32×48 CLB array, and 316 user I/O pins in a 456-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536 bits of block SelectRAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV300-4FG456I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, DLL jitter specifications, and real-world FPGA integration considerations for legacy industrial control, telecom infrastructure, and high-reliability embedded systems.

Technical Context

The XCV300-4FG456I implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain two slices each with four logic cells (LCs), 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, dual-ported RAM, or 16-bit shift registers, plus dedicated carry chains and F5/F6 multiplexers for wide-input logic synthesis.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed signaling standards only when sharing VCCO voltage (e.g., LVTTL and SSTL3 at 3.3 V), and input standards requiring VREF (e.g., HSTL Class I) must share one VREF per bank. The device includes IEEE 1149.1 boundary-scan logic and die-temperature sensor diode.

Key Specifications

Pinout & Package

Package: 456-ball Fine-pitch Ball Grid Array (FG456), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Pinout conforms to DS003-4 (v4.0) Module 4 - Pinout Tables, with eight I/O banks (Bank 0–7), four dedicated global clock inputs (GCLK0–GCLK3), and dual-purpose configuration pins (e.g., INIT, PROGRAM, CCLK).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV300-4FG456I, the XCV300-5FG456I delivers tighter timing margins without altering PCB layout, while the XCV400-4FG456I extends logic capacity within the same footprint-making both viable for lifecycle management, though neither is pin-compatible beyond shared FG456 mechanical dimensions.

Availability

XCV300-4FG456I is available at Aetrix Electronics and suitable for industrial motion control, telecom line card development, avionics data concentrators, and medical imaging interfaces requiring stable component supply across extended product lifecycles.

Supply support for XCV300-4FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered SRAM-based FPGA architectures and established industry standards for configurable logic design tools and IP ecosystems.

The Virtex family was designed for high-performance, high-capacity digital system integration - targeting applications where ASIC-level performance and flexibility are required without mask costs or long lead times, particularly in communications infrastructure and industrial automation.

FAQ

What is the maximum operating frequency supported by XCV300-4FG456I?

XCV300-4FG456I supports synchronous system clock rates up to 200 MHz, including I/O paths. This is guaranteed under worst-case industrial temperature (–40°C to +100°C) and voltage conditions per DS003-3 timing specifications. Actual achievable frequency depends on design topology, placement, and routing - representative circuits like pipelined multipliers achieve 5.1 ns propagation delay at -4 speed grade.

Does XCV300-4FG456I support hot-swap operation in Compact PCI systems?

Yes, XCV300-4FG456I is explicitly designed for hot-swappable Compact PCI applications. Its I/O structure meets PCI electrical specifications for 33 MHz and 66 MHz operation, and its configuration architecture allows safe insertion/removal while system power remains active. The device's I/O clamping and ESD protection circuitry comply with Compact PCI thermal and electrical insertion requirements.

How many block RAMs does XCV300-4FG456I contain, and what are their configurations?

XCV300-4FG456I contains 16 block SelectRAMs totaling 65,536 bits. Each block is a fully synchronous dual-ported 4096-bit RAM with independent address, data, and control buses per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible bus-width conversion and asynchronous clock domain crossing without external memory.

Can XCV300-4FG456I interface with both 3.3 V and 1.5 V I/O standards simultaneously?

Yes, XCV300-4FG456I supports simultaneous 3.3 V (e.g., LVTTL, PCI) and 1.5 V (e.g., HSTL Class I) I/O standards - but only if assigned to separate I/O banks. Each bank requires its own VCCO supply; Bank 0 may use 3.3 V for LVTTL while Bank 2 uses 1.5 V for HSTL. Mixing standards within one bank is prohibited unless they share identical VCCO and VREF requirements.

Is XCV300-4FG456I still in production, and what is its obsolescence status?

XCV300-4FG456I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, and new production shipments ceased prior to 2013. Aetrix Electronics maintains limited legacy inventory with full traceability and offers lifecycle management support, including cross-reference guidance to Virtex-II or Spartan-3 alternatives where functionally appropriate.