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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV300-5BG352C

Name: XCV300-5BG352C
Brand: AMD
SKU: XCV300-5BG352C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV300-5BG352C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 352-LBGA Exposed Pad, Metal

Datasheet:: XCV300-5BG352C.pdf

Description:: IC FPGA 260 I/O 352MBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XCV300-5BG352C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, and 316 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV300-5BG352C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility (LVTTL, HSTL, SSTL), and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0).

Technical Context

The XCV300-5BG352C implements a hierarchical routing architecture with General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19-input logic, and dual-port synchronous storage elements.

Each IOB supports independent input/output flip-flops with programmable set/reset polarity, clock enable, and optional input delay to eliminate pad-to-pad hold time. Eight I/O banks enforce VCCO/VREF voltage segregation: 3.3 V banks support LVTTL/PCI/SSTL3; 2.5 V banks support LVCMOS2/SSTL2; 1.5 V banks support HSTL Classes I/III/IV - all with per-bank weak-keeper, pull-up/down, and IEEE 1149.1 boundary-scan.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	322,970 - measures logic capacity using Xilinx's standardized gate-equivalent metric for place-and-route efficiency comparison
Logic Cells	6,912 - configurable logic blocks (CLBs), each containing two slices with four LUTs and associated flip-flops/latches
User I/O Pins	316 - maximum available bidirectional user I/O in BG352 package, excluding dedicated clock pins
Block RAM Bits	65,536 - distributed across 16 dual-ported 4k-bit synchronous RAM blocks, supporting independent read/write widths
Speed Grade	-5 - guarantees timing performance up to 200 MHz system clock (worst-case), including I/O paths with DLL compensation
SelectIO™ Standards	16 supported - includes LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL3, GTL+, and PCI 3.3 V - subject to bank-wise VCCO/VREF constraints
Delay-Locked Loops	4 DLLs - provide zero-delay clock distribution, phase alignment, and jitter reduction for global clock nets and I/O timing control

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 25 mm × 25 mm, 1.27 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Dedicated low-skew inputs feeding four primary global clock distribution networks; required for DLL reference and high-speed synchronous design
IO_LxxN/IO_LxxP	Configurable I/O Bank Pin	Paired differential-capable pins grouped into eight I/O banks; each bank requires shared VCCO and (if needed) single VREF voltage
M0–M2	Configuration Mode Select	Three-pin encoding determining configuration mode (Master Serial, Slave Serial, SelectMAP, JTAG); must be pulled to defined logic levels at power-up
CCLK	Configuration Clock	Output-only clock during Master Serial mode; input during Slave Serial/SelectMAP; controls bitstream loading timing and synchronization
DIN/DOUT	Configuration Data I/O	Serial data input (DIN) and optional serial data output (DOUT) used in JTAG and serial configuration modes
VCCINT	Core Supply	2.5 V ± 3% supply for internal logic and CLBs; decoupling required per Xilinx layout guidelines to maintain signal integrity
VCCO_0–VCCO_7	I/O Bank Supply	Eight independent VCCO pins - one per I/O bank - setting output voltage level (1.5 V / 2.5 V / 3.3 V) and defining compatible I/O standards
VREF_0–VREF_7	I/O Reference Voltage	Eight VREF pins - one per bank - supplying threshold voltage for input standards requiring it (e.g., HSTL, SSTL); internally tied within each bank

Key Features

Feature	Design Value
Dual-Port Block RAM	16 × 4,096-bit synchronous RAM blocks with independent address/data/control per port - enables true concurrent read/write for FIFOs, buffers, and memory-mapped peripherals
LUT-as-RAM/Shift Register	Each 4-input LUT configurable as 16×1-bit RAM, 16×2-bit RAM, 32×1-bit RAM, or 16-bit shift register - provides distributed memory without consuming block RAM resources
Dedicated Carry Chain	Two per CLB, two bits high - delivers sub-5 ns carry propagation for arithmetic-intensive designs like counters, ALUs, and DSP datapaths
Programmable I/O Delay	Input path delay matched to internal clock distribution - eliminates pad-to-pad hold time when used with DLL-synchronized clocks
IEEE 1149.1 Boundary Scan	Fully compliant TAP controller with instruction/data registers - enables board-level testability, interconnect verification, and in-system programming without external probes
Hot-Swap Support	IOB circuitry designed to tolerate live insertion/removal in Compact PCI backplanes - meets PICMG 2.1 requirements for power sequencing and bus contention avoidance

Applications

PCI Bridge Controller	High-Speed Data Acquisition
Use Scenario: Implementing a custom PCI-to-local bus bridge in industrial instrumentation where fixed ASICs lack flexibility for protocol updates. IC Role / Device Role / Timing Role: XCV300-5BG352C acts as the protocol translation and arbitration engine, managing 66-MHz PCI transactions while interfacing to ADC/DAC controllers via parallel or LVDS interfaces. Use Value: Achieves deterministic 66-MHz PCI compliance with DLL-synchronized timing, supports hot-swap reconfiguration during field maintenance, and accommodates future bus protocol extensions via reprogramming.	Use Scenario: Capturing multi-channel, high-sample-rate analog signals (e.g., 100+ MS/s) in radar or medical imaging systems with real-time preprocessing. IC Role / Device Role / Timing Role: XCV300-5BG352C serves as the front-end digital processing unit - performing channel synchronization, digital down-conversion, and on-the-fly FIR filtering before streaming to DDR memory or Ethernet. Use Value: Leverages 316 I/O pins for parallel ADC interface, uses LUT-based shift registers for pipeline capture, and applies block RAM for coefficient storage and ping-pong buffering - all at <5 ns logic depth.
Communications Baseband Processor	Reconfigurable Test Equipment
Use Scenario: Building flexible LTE/WiMAX baseband modems where waveform standards evolve faster than ASIC development cycles. IC Role / Device Role / Timing Role: XCV300-5BG352C hosts OFDM symbol generation, channel estimation, and MIMO decoding logic - synchronized across multiple clock domains using four DLLs. Use Value: Enables field-upgradable PHY layers, supports mixed-voltage I/O (HSTL for memory, SSTL for SERDES links), and sustains >150 MHz sustained throughput for complex FFT/IFFT pipelines.	Use Scenario: Designing automated test equipment (ATE) that must emulate multiple DUT interfaces (SPI, I2C, JTAG, custom protocols) within a single hardware platform. IC Role / Device Role / Timing Role: XCV300-5BG352C functions as the programmable interface adapter - dynamically instantiating protocol engines, timing generators, and pattern matchers based on test script directives. Use Value: Reduces test system footprint by consolidating interface cards, supports per-pin programmable drive strength/slew rate for signal integrity tuning, and allows firmware-triggered reconfiguration between test sequences.

PCI Bridge Controller

High-Speed Data Acquisition

Use Scenario: Implementing a custom PCI-to-local bus bridge in industrial instrumentation where fixed ASICs lack flexibility for protocol updates.

IC Role / Device Role / Timing Role: XCV300-5BG352C acts as the protocol translation and arbitration engine, managing 66-MHz PCI transactions while interfacing to ADC/DAC controllers via parallel or LVDS interfaces.

Use Value: Achieves deterministic 66-MHz PCI compliance with DLL-synchronized timing, supports hot-swap reconfiguration during field maintenance, and accommodates future bus protocol extensions via reprogramming.

Use Scenario: Capturing multi-channel, high-sample-rate analog signals (e.g., 100+ MS/s) in radar or medical imaging systems with real-time preprocessing.

IC Role / Device Role / Timing Role: XCV300-5BG352C serves as the front-end digital processing unit - performing channel synchronization, digital down-conversion, and on-the-fly FIR filtering before streaming to DDR memory or Ethernet.

Use Value: Leverages 316 I/O pins for parallel ADC interface, uses LUT-based shift registers for pipeline capture, and applies block RAM for coefficient storage and ping-pong buffering - all at <5 ns logic depth.

Communications Baseband Processor

Reconfigurable Test Equipment

Use Scenario: Building flexible LTE/WiMAX baseband modems where waveform standards evolve faster than ASIC development cycles.

IC Role / Device Role / Timing Role: XCV300-5BG352C hosts OFDM symbol generation, channel estimation, and MIMO decoding logic - synchronized across multiple clock domains using four DLLs.

Use Value: Enables field-upgradable PHY layers, supports mixed-voltage I/O (HSTL for memory, SSTL for SERDES links), and sustains >150 MHz sustained throughput for complex FFT/IFFT pipelines.

Use Scenario: Designing automated test equipment (ATE) that must emulate multiple DUT interfaces (SPI, I2C, JTAG, custom protocols) within a single hardware platform.

IC Role / Device Role / Timing Role: XCV300-5BG352C functions as the programmable interface adapter - dynamically instantiating protocol engines, timing generators, and pattern matchers based on test script directives.

Use Value: Reduces test system footprint by consolidating interface cards, supports per-pin programmable drive strength/slew rate for signal integrity tuning, and allows firmware-triggered reconfiguration between test sequences.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV300-6BG352C	Higher speed grade (-6 vs. -5); guarantees 200 MHz operation under worst-case voltage/temperature conditions	Suitable for designs requiring margin-critical timing closure at full 200 MHz, especially with long routing paths or high fanout	Select XCV300-6BG352C only if timing analysis shows setup/hold violations with -5 grade; otherwise -5 offers identical functionality at lower cost
XCV400-5BG432C	Larger device (468k gates, 404 I/O, BG432 package); same -5 speed grade and architecture generation	Required when design exceeds XCV300-5BG352C resource limits - e.g., >6,912 logic cells or >316 I/O - but retains identical toolchain and IP compatibility	Choose XCV400-5BG432C for scalable designs needing headroom; note larger package requires PCB redesign and higher power delivery capability

Compared with XCV300-5BG352C, the -6 variant improves worst-case timing margin without changing logic density or I/O count, while the XCV400-5BG432C increases both capacity and pin count - making them complementary upgrades rather than drop-in replacements.

Availability

XCV300-5BG352C is available at Aetrix Electronics and suitable for industrial control systems, communications infrastructure, and test equipment requiring stable component supply despite its obsolete status - backed by extended lifecycle sourcing and legacy program support.

Supply support for XCV300-5BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, with global R&D and manufacturing partnerships.

The Virtex family - including XCV300-5BG352C - was engineered for high-performance, high-density reconfigurable computing in wired/wireless infrastructure, defense systems, and scientific instrumentation where ASIC development cycles are prohibitive.

FAQ

Is XCV300-5BG352C still in production?

No - XCV300-5BG352C is officially obsolete per Xilinx document XCN10016 (March 2013). However, Aetrix Electronics maintains legacy inventory and coordinates with authorized distributors to fulfill demand through last-time-buy programs and controlled-life sourcing channels.

What configuration modes does XCV300-5BG352C support?

XCV300-5BG352C supports four configuration modes: Master Serial (using on-chip oscillator and external PROM), Slave Serial, SelectMAP (8-bit parallel), and JTAG (IEEE 1149.1). Mode selection is controlled by M0–M2 pins at power-up, and all modes load SRAM-based configuration bitstreams.

Can XCV300-5BG352C interface directly with DDR SDRAM?

Yes - XCV300-5BG352C supports SSTL2 Class I/II (2.5 V) and SSTL3 Class I/II (3.3 V) I/O standards required for DDR SDRAM interfaces. Implementation requires careful PCB layout, proper VCCO/VREF assignment per I/O bank, and use of block RAM or distributed LUT RAM for command/address pipelines.

Does XCV300-5BG352C include on-chip analog functionality?

No - XCV300-5BG352C contains no ADCs, DACs, or PLLs beyond its four digital DLLs. It does integrate a die-temperature sensor diode (accessible via external measurement), but all signal conversion and analog conditioning must be implemented externally.

What software tools are required to develop for XCV300-5BG352C?

XCV300-5BG352C is supported exclusively by Xilinx Foundation Series and Alliance Series design tools (discontinued circa 2005). Modern Vivado or ISE WebPACK do not support Virtex-1 devices. Legacy toolchains require Windows XP or older OS versions and are distributed via Xilinx Archive CD or certified third-party resellers.

XCV300-5BG352C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®

Package/Case:: 352-LBGA Exposed Pad, Metal

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 1536

Number of Logic Elements/Cells:: 6912

Total RAM Bits:: 65536

Number of I/O:: 260

Number of Gates:: 322970

Voltage - Supply:: 2.375V ~ 2.625V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 352-MBGA (35x35)

XCV300-5BG352C FAQ

1.How can I place an order for XCV300-5BG352C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300-5BG352C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300-5BG352C reliable?

The price and inventory of XCV300-5BG352C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-5BG352C is usually 5 days.

3.What payment methods are accepted for XCV300-5BG352C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-5BG352C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300-5BG352C?

XCV300-5BG352C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300-5BG352C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300-5BG352C?

For technical support, including XCV300-5BG352C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-5BG352C requirements.

6.How does Aetrix verify that XCV300-5BG352C is sourced from the original manufacturer or authorized distributors?

All XCV300-5BG352C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-5BG352C meets industry standards.

7.What is the process for return or replacement of XCV300-5BG352C?

All XCV300-5BG352C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-5BG352C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300-5BG352C part is unused and in its original packaging.

Return procedure for XCV300-5BG352C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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