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AMD XCV300-5BG352I

Part No.:
XCV300-5BG352I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
352-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV300-5BG352I.pdf
Description:
IC FPGA 260 I/O 352MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,713

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Product details

Overview

XCV300-5BG352I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, and 316 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV300-5BG352I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility (LVTTL, HSTL, SSTL), and migration guidance from legacy Virtex devices.

Technical Context

The XCV300-5BG352I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling high place-and-route efficiency for complex synchronous designs. Its CLBs contain dual-slice structures with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for wide-function logic, and configurable storage elements with independent clock enable, set/reset polarity, and synchronous/asynchronous control.

Each IOB supports multi-standard SelectIO™ interfaces across eight voltage-referenced I/O banks, with per-bank VCCO and VREF constraints dictating compatible signaling standards (e.g., HSTL Class IV at 1.5 V, SSTL3 at 3.3 V). The device includes IEEE 1149.1 boundary-scan logic, die-temperature sensor diode, and SRAM-based in-system reprogrammability via JTAG, SelectMAP™, or serial PROM modes.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 322,970 - defines total logic capacity for gate-equivalent synthesis targeting ASIC replacement or high-complexity digital logic.
Logic Cells 6,912 - actual count of configurable logic cells (CLBs), each containing four logic cells (LCs) and supporting arithmetic, memory, and routing functions.
User I/O Pins 316 - maximum available bidirectional user I/O signals in BG352 package, distributed across eight I/O banks with VCCO/VREF constraints.
Block RAM 65,536 bits - sixteen 4,096-bit synchronous dual-ported RAM blocks, enabling on-chip FIFOs, buffers, or lookup tables without external memory.
Speed Grade -5 - guarantees worst-case performance up to 200 MHz system clock rate (including I/O paths) under industrial temperature conditions.
Operating Temperature –40°C to +100°C - industrial-grade thermal range validated for embedded control, telecom infrastructure, and industrial automation applications.
Supply Voltage 2.5 V core (VCCINT), 3.3 V / 2.5 V / 1.5 V I/O (VCCO) - requires separate regulated supplies per I/O bank; core voltage fixed, I/O voltage bank-selectable.

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant, industrial temperature grade (I).

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Dedicated Global Clock Inputs Four low-skew primary clock nets feeding DLLs; required for synchronous domain control and timing-critical I/O or logic.
PROGRAM_B Active-Low Configuration Initiate Asynchronous reset that clears configuration memory and forces reinitialization; must be held high for normal operation.
INIT_B Configuration Status Output Open-drain signal indicating configuration completion (high) or failure/reinitiation (low); used for system-level boot sequencing.
CCLK Configuration Clock Input Drives internal configuration logic during master serial mode; externally supplied clock (up to 20 MHz) controls bitstream loading rate.
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface IEEE 1149.1-compliant test access port enabling in-circuit programming, debugging, and structural verification pre- and post-configuration.
VCCINT Core Logic Supply 2.5 V supply for internal CLBs, routing, and DLLs; decoupling critical to meet timing closure and avoid voltage droop-induced setup violations.
VCCO_0–VCCO_7 I/O Bank Power Supplies Eight independent VCCO pins (one per I/O bank); each must be set to match output standard voltage (e.g., 3.3 V for LVTTL, 1.5 V for HSTL).
VREF_0–VREF_7 I/O Bank Reference Voltages Eight VREF inputs (one per bank); required for input standards like HSTL/SSTL; must be stable and matched to specified tolerance (±2%).

Key Features

Feature Design Value
Four Dedicated DLLs Enables zero-hold-time I/O timing, phase-aligned clock domain bridging, and jitter-compensated clock distribution across large designs.
Configurable LUT RAM Modes Each 4-input LUT can operate as 16×1-bit RAM, 16×2-bit RAM, 32×1-bit RAM, or 16-bit shift register - eliminating need for external FIFOs in data capture or DSP pipelines.
Synchronous Dual-Port Block RAM 65,536-bit block RAM with independent read/write clocks, addresses, and enables per port - supports true dual-clock FIFOs and memory-mapped peripherals.
SelectIO™ Multi-Standard Support 16 I/O standards including LVTTL, SSTL3, HSTL Class IV, GTL+, and PCI 3.3 V - allows mixed-voltage board design with bank-isolated signaling.
Die-Temperature Sensor Diode On-die analog diode enables real-time thermal monitoring via external ADC; supports dynamic thermal throttling or fan control in sealed enclosures.

Applications

Telecom Line Card Control Industrial Motion Controller

Use Scenario: Real-time protocol translation between T1/E1 framing and Ethernet backhaul in modular base station line cards.

IC Role / Device Role / Timing Role: FPGA acts as deterministic packet assembler/disassembler with sub-100 ns latency; uses DLL-synchronized DDR I/O and block RAM buffering.

Use Value: Enables single-chip integration of framer, mapper, and interface logic - reducing BOM cost and PCB area versus ASIC + PHY solution.

Use Scenario: Closed-loop servo control for multi-axis CNC machines requiring synchronized PWM generation, encoder feedback decoding, and safety monitoring.

IC Role / Device Role / Timing Role: Configurable logic handles 20 kHz PWM timing, quadrature decode, and ISO 13849-compliant safe torque off (STO) state machine.

Use Value: Replaces discrete CPLD + microcontroller combo; eliminates firmware update delays and enables field-upgradable motion profiles.

PCI-Based Data Acquisition System Legacy Bus Emulation Module

Use Scenario: High-throughput digitizer card for oscilloscopes or spectrum analyzers interfacing to host PC via 66-MHz 32-bit PCI slot.

IC Role / Device Role / Timing Role: Acts as PCI target endpoint with DMA engine, front-end sample buffering (block RAM), and real-time trigger logic.

Use Value: Meets PCI specification timing margins at 66 MHz; avoids external FIFOs by using on-chip dual-port RAM for ping-pong acquisition.

Use Scenario: Retrofit module replacing obsolete 80C186 or Z80-based controllers in factory-floor PLCs while retaining original ISA or VME bus interface.

IC Role / Device Role / Timing Role: Implements cycle-accurate bus protocol logic, address decoding, and register-mapped I/O with programmable wait-state insertion.

Use Value: Extends life of legacy equipment without PCB redesign; supports field updates to adapt to new sensor protocols or safety requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV300-6BG352I Higher speed grade (-6 vs. -5); achieves 200 MHz worst-case system clock vs. 180 MHz for XCV300-5BG352I under identical conditions. Required for designs with tighter timing margins, especially those using high-speed I/O standards like HSTL Class IV at full rate. Select XCV300-6BG352I only when timing analysis fails at -5 grade; otherwise, -5 offers better power efficiency and lower cost.
XCV400-5BG352I Higher density (468,252 system gates, 10,800 logic cells, 81,920 block RAM bits) in same BG352 package footprint. Supports larger logic partitions, deeper FIFOs, or additional protocol engines (e.g., dual Ethernet MACs) without changing PCB layout. Choose XCV400-5BG352I when future scalability or design reuse across product variants is prioritized over current gate count needs.

Compared with XCV300-5BG352I, the -6 variant delivers higher timing margin for aggressive clocking, while the XCV400-5BG352I provides headroom for logic expansion within identical mechanical and thermal constraints - both retain identical pinout, I/O banking structure, and configuration interface.

Availability

XCV300-5BG352I is available at Aetrix Electronics and suitable for industrial motion control, telecom line card development, PCI-based instrumentation, and legacy bus emulation requiring stable component supply and long-term lifecycle support.

Supply support for XCV300-5BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family was designed for high-performance, high-capacity logic implementation in infrastructure, aerospace, and industrial systems - emphasizing timing predictability, I/O flexibility, and silicon efficiency through hierarchical routing and dedicated resources.

FAQ

What is the maximum operating frequency supported by XCV300-5BG352I?

XCV300-5BG352I supports a worst-case synchronous system clock rate of up to 200 MHz, including I/O paths, as validated under industrial temperature conditions (–40°C to +100°C) and confirmed in DS003-1 Table 2. This assumes proper PCB layout, decoupling, and timing-constrained synthesis targeting the -5 speed grade.

Does XCV300-5BG352I support hot-swap operation in Compact PCI systems?

Yes, XCV300-5BG352I is explicitly designed for hot-swappable Compact PCI applications, as stated in the DS003-1 Features section. Its I/O structure, power sequencing behavior, and robust ESD protection meet the electrical and mechanical requirements for live insertion and removal in backplane environments.

Can XCV300-5BG352I interface directly with DDR SDRAM?

XCV300-5BG352I does not include dedicated DDR controller hard IP, but its SelectIO™ outputs support SSTL2 Class I/II standards (1.25 V) and its DLLs enable precise clock-to-out timing control - allowing implementation of a soft DDR controller with careful timing closure and board-level termination matching.

What configuration modes are supported by XCV300-5BG352I?

XCV300-5BG352I supports four configuration modes: master serial (reads bitstream from external PROM), slave serial, SelectMAP™ (parallel synchronous), and JTAG (boundary-scan). All modes are fully documented in DS003-1 Module 1 and DS003-4 Pinout Tables, with dedicated pins assigned for each interface.

Is XCV300-5BG352I still in active production?

No - XCV300-5BG352I is marked as obsolete/under obsolescence per DS003-1 v4.0 (March 2013), with discontinuation referenced in Xilinx Notice XCN10016. Aetrix Electronics maintains legacy inventory and supports lifecycle management, but new design-ins should consider migration paths such as Spartan-6 or Artix-7 families.

XCV300-5BG352I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
352-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
65536
Number of I/O:
260
Number of Gates:
322970
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
352-MBGA (35x35)

XCV300-5BG352I FAQ

1.How can I place an order for XCV300-5BG352I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300-5BG352I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300-5BG352I reliable?

The price and inventory of XCV300-5BG352I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-5BG352I is usually 5 days.

3.What payment methods are accepted for XCV300-5BG352I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-5BG352I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300-5BG352I?

XCV300-5BG352I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300-5BG352I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300-5BG352I?

For technical support, including XCV300-5BG352I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-5BG352I requirements.

6.How does Aetrix verify that XCV300-5BG352I is sourced from the original manufacturer or authorized distributors?

All XCV300-5BG352I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-5BG352I meets industry standards.

7.What is the process for return or replacement of XCV300-5BG352I?

All XCV300-5BG352I units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-5BG352I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300-5BG352I part is unused and in its original packaging.

Return procedure for XCV300-5BG352I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV300-5BG352I Tags

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