AMD XCV300-5BG352I
- Part No.:
- XCV300-5BG352I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 352-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV300-5BG352I.pdf
- Description:
- IC FPGA 260 I/O 352MBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV300-5BG352I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, and 316 user I/O pins in a 352-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV300-5BG352I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility (LVTTL, HSTL, SSTL), and migration guidance from legacy Virtex devices.
Technical Context
The XCV300-5BG352I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling high place-and-route efficiency for complex synchronous designs. Its CLBs contain dual-slice structures with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for wide-function logic, and configurable storage elements with independent clock enable, set/reset polarity, and synchronous/asynchronous control.
Each IOB supports multi-standard SelectIO™ interfaces across eight voltage-referenced I/O banks, with per-bank VCCO and VREF constraints dictating compatible signaling standards (e.g., HSTL Class IV at 1.5 V, SSTL3 at 3.3 V). The device includes IEEE 1149.1 boundary-scan logic, die-temperature sensor diode, and SRAM-based in-system reprogrammability via JTAG, SelectMAP™, or serial PROM modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 322,970 - defines total logic capacity for gate-equivalent synthesis targeting ASIC replacement or high-complexity digital logic. |
| Logic Cells | 6,912 - actual count of configurable logic cells (CLBs), each containing four logic cells (LCs) and supporting arithmetic, memory, and routing functions. |
| User I/O Pins | 316 - maximum available bidirectional user I/O signals in BG352 package, distributed across eight I/O banks with VCCO/VREF constraints. |
| Block RAM | 65,536 bits - sixteen 4,096-bit synchronous dual-ported RAM blocks, enabling on-chip FIFOs, buffers, or lookup tables without external memory. |
| Speed Grade | -5 - guarantees worst-case performance up to 200 MHz system clock rate (including I/O paths) under industrial temperature conditions. |
| Operating Temperature | –40°C to +100°C - industrial-grade thermal range validated for embedded control, telecom infrastructure, and industrial automation applications. |
| Supply Voltage | 2.5 V core (VCCINT), 3.3 V / 2.5 V / 1.5 V I/O (VCCO) - requires separate regulated supplies per I/O bank; core voltage fixed, I/O voltage bank-selectable. |
Pinout & Package
Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant, industrial temperature grade (I).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Dedicated Global Clock Inputs | Four low-skew primary clock nets feeding DLLs; required for synchronous domain control and timing-critical I/O or logic. |
| PROGRAM_B | Active-Low Configuration Initiate | Asynchronous reset that clears configuration memory and forces reinitialization; must be held high for normal operation. |
| INIT_B | Configuration Status Output | Open-drain signal indicating configuration completion (high) or failure/reinitiation (low); used for system-level boot sequencing. |
| CCLK | Configuration Clock Input | Drives internal configuration logic during master serial mode; externally supplied clock (up to 20 MHz) controls bitstream loading rate. |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port enabling in-circuit programming, debugging, and structural verification pre- and post-configuration. |
| VCCINT | Core Logic Supply | 2.5 V supply for internal CLBs, routing, and DLLs; decoupling critical to meet timing closure and avoid voltage droop-induced setup violations. |
| VCCO_0–VCCO_7 | I/O Bank Power Supplies | Eight independent VCCO pins (one per I/O bank); each must be set to match output standard voltage (e.g., 3.3 V for LVTTL, 1.5 V for HSTL). |
| VREF_0–VREF_7 | I/O Bank Reference Voltages | Eight VREF inputs (one per bank); required for input standards like HSTL/SSTL; must be stable and matched to specified tolerance (±2%). |
Key Features
| Feature | Design Value |
|---|---|
| Four Dedicated DLLs | Enables zero-hold-time I/O timing, phase-aligned clock domain bridging, and jitter-compensated clock distribution across large designs. |
| Configurable LUT RAM Modes | Each 4-input LUT can operate as 16×1-bit RAM, 16×2-bit RAM, 32×1-bit RAM, or 16-bit shift register - eliminating need for external FIFOs in data capture or DSP pipelines. |
| Synchronous Dual-Port Block RAM | 65,536-bit block RAM with independent read/write clocks, addresses, and enables per port - supports true dual-clock FIFOs and memory-mapped peripherals. |
| SelectIO™ Multi-Standard Support | 16 I/O standards including LVTTL, SSTL3, HSTL Class IV, GTL+, and PCI 3.3 V - allows mixed-voltage board design with bank-isolated signaling. |
| Die-Temperature Sensor Diode | On-die analog diode enables real-time thermal monitoring via external ADC; supports dynamic thermal throttling or fan control in sealed enclosures. |
Applications
| Telecom Line Card Control | Industrial Motion Controller |
|---|---|
Use Scenario: Real-time protocol translation between T1/E1 framing and Ethernet backhaul in modular base station line cards. IC Role / Device Role / Timing Role: FPGA acts as deterministic packet assembler/disassembler with sub-100 ns latency; uses DLL-synchronized DDR I/O and block RAM buffering. Use Value: Enables single-chip integration of framer, mapper, and interface logic - reducing BOM cost and PCB area versus ASIC + PHY solution. |
Use Scenario: Closed-loop servo control for multi-axis CNC machines requiring synchronized PWM generation, encoder feedback decoding, and safety monitoring. IC Role / Device Role / Timing Role: Configurable logic handles 20 kHz PWM timing, quadrature decode, and ISO 13849-compliant safe torque off (STO) state machine. Use Value: Replaces discrete CPLD + microcontroller combo; eliminates firmware update delays and enables field-upgradable motion profiles. |
| PCI-Based Data Acquisition System | Legacy Bus Emulation Module |
Use Scenario: High-throughput digitizer card for oscilloscopes or spectrum analyzers interfacing to host PC via 66-MHz 32-bit PCI slot. IC Role / Device Role / Timing Role: Acts as PCI target endpoint with DMA engine, front-end sample buffering (block RAM), and real-time trigger logic. Use Value: Meets PCI specification timing margins at 66 MHz; avoids external FIFOs by using on-chip dual-port RAM for ping-pong acquisition. |
Use Scenario: Retrofit module replacing obsolete 80C186 or Z80-based controllers in factory-floor PLCs while retaining original ISA or VME bus interface. IC Role / Device Role / Timing Role: Implements cycle-accurate bus protocol logic, address decoding, and register-mapped I/O with programmable wait-state insertion. Use Value: Extends life of legacy equipment without PCB redesign; supports field updates to adapt to new sensor protocols or safety requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300-6BG352I | Higher speed grade (-6 vs. -5); achieves 200 MHz worst-case system clock vs. 180 MHz for XCV300-5BG352I under identical conditions. | Required for designs with tighter timing margins, especially those using high-speed I/O standards like HSTL Class IV at full rate. | Select XCV300-6BG352I only when timing analysis fails at -5 grade; otherwise, -5 offers better power efficiency and lower cost. |
| XCV400-5BG352I | Higher density (468,252 system gates, 10,800 logic cells, 81,920 block RAM bits) in same BG352 package footprint. | Supports larger logic partitions, deeper FIFOs, or additional protocol engines (e.g., dual Ethernet MACs) without changing PCB layout. | Choose XCV400-5BG352I when future scalability or design reuse across product variants is prioritized over current gate count needs. |
Compared with XCV300-5BG352I, the -6 variant delivers higher timing margin for aggressive clocking, while the XCV400-5BG352I provides headroom for logic expansion within identical mechanical and thermal constraints - both retain identical pinout, I/O banking structure, and configuration interface.
Availability
XCV300-5BG352I is available at Aetrix Electronics and suitable for industrial motion control, telecom line card development, PCI-based instrumentation, and legacy bus emulation requiring stable component supply and long-term lifecycle support.
Supply support for XCV300-5BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex family was designed for high-performance, high-capacity logic implementation in infrastructure, aerospace, and industrial systems - emphasizing timing predictability, I/O flexibility, and silicon efficiency through hierarchical routing and dedicated resources.
FAQ
What is the maximum operating frequency supported by XCV300-5BG352I?
XCV300-5BG352I supports a worst-case synchronous system clock rate of up to 200 MHz, including I/O paths, as validated under industrial temperature conditions (–40°C to +100°C) and confirmed in DS003-1 Table 2. This assumes proper PCB layout, decoupling, and timing-constrained synthesis targeting the -5 speed grade.
Does XCV300-5BG352I support hot-swap operation in Compact PCI systems?
Yes, XCV300-5BG352I is explicitly designed for hot-swappable Compact PCI applications, as stated in the DS003-1 Features section. Its I/O structure, power sequencing behavior, and robust ESD protection meet the electrical and mechanical requirements for live insertion and removal in backplane environments.
Can XCV300-5BG352I interface directly with DDR SDRAM?
XCV300-5BG352I does not include dedicated DDR controller hard IP, but its SelectIO™ outputs support SSTL2 Class I/II standards (1.25 V) and its DLLs enable precise clock-to-out timing control - allowing implementation of a soft DDR controller with careful timing closure and board-level termination matching.
What configuration modes are supported by XCV300-5BG352I?
XCV300-5BG352I supports four configuration modes: master serial (reads bitstream from external PROM), slave serial, SelectMAP™ (parallel synchronous), and JTAG (boundary-scan). All modes are fully documented in DS003-1 Module 1 and DS003-4 Pinout Tables, with dedicated pins assigned for each interface.
Is XCV300-5BG352I still in active production?
No - XCV300-5BG352I is marked as obsolete/under obsolescence per DS003-1 v4.0 (March 2013), with discontinuation referenced in Xilinx Notice XCN10016. Aetrix Electronics maintains legacy inventory and supports lifecycle management, but new design-ins should consider migration paths such as Spartan-6 or Artix-7 families.
XCV300-5BG352I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 352-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 6912
- Total RAM Bits:
- 65536
- Number of I/O:
- 260
- Number of Gates:
- 322970
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 352-MBGA (35x35)
XCV300-5BG352I FAQ
1.How can I place an order for XCV300-5BG352I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV300-5BG352I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV300-5BG352I reliable?
The price and inventory of XCV300-5BG352I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-5BG352I is usually 5 days.
3.What payment methods are accepted for XCV300-5BG352I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-5BG352I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV300-5BG352I?
XCV300-5BG352I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV300-5BG352I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV300-5BG352I?
For technical support, including XCV300-5BG352I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-5BG352I requirements.
6.How does Aetrix verify that XCV300-5BG352I is sourced from the original manufacturer or authorized distributors?
All XCV300-5BG352I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-5BG352I meets industry standards.
7.What is the process for return or replacement of XCV300-5BG352I?
All XCV300-5BG352I units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-5BG352I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV300-5BG352I part is unused and in its original packaging.
Return procedure for XCV300-5BG352I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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