AMD XCV300-5BG432C
- Part No.:
- XCV300-5BG432C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 432-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV300-5BG432C.pdf
- Description:
- IC FPGA 316 I/O 432MBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XCV300-5BG432C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, and 316 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536 bits of block SelectRAM and LUT-configurable RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.
For engineers reviewing the XCV300-5BG432C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-speed programmable logic solution for legacy industrial control, telecom infrastructure, and test equipment where reconfigurable logic with deterministic clock management and multi-standard I/O is required.
Technical Context
The XCV300-5BG432C implements a regular array architecture of Configurable Logic Blocks (CLBs) surrounded by Input/Output Blocks (IOBs), interconnected via a hierarchical routing matrix including general-purpose channels, local VersaBlock paths, and dedicated carry chains. Each CLB contains four logic cells with 4-input LUTs, dual flip-flops per slice, and dedicated arithmetic carry logic.
Its IO subsystem supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, PCI 3.3 V, HSTL Class IV, and SSTL2-with banked VCCO and VREF domains, IEEE 1149.1 boundary-scan, and configurable weak-keeper/pull-up/pull-down networks. Configuration is SRAM-based, supporting master serial, slave serial, SelectMAP™, and JTAG modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 322,970 - indicates logic capacity suitable for medium-complexity digital systems such as protocol bridges or real-time signal processing pipelines. |
| Logic Cells | 6,912 - provides granular, routable logic resources with distributed LUTs, flip-flops, and carry chains for arithmetic and wide-function implementation. |
| User I/O Pins | 316 - enables dense peripheral interfacing across multiple voltage domains using banked I/O with independent VCCO/VREF control. |
| Block RAM Bits | 65,536 - delivered as sixteen 4k-bit synchronous dual-ported RAM blocks, supporting independent read/write widths and on-chip data buffering. |
| Speed Grade | -5 - specifies worst-case timing performance up to 200 MHz system clock rate with guaranteed setup/hold margins for LVTTL and HSTL Class IV I/O. |
| Package | 432-ball BGA (BG432) - surface-mount footprint with 1.27 mm pitch, optimized for thermal dissipation and signal integrity in high-pin-count FPGA applications. |
| DLLs | 4 dedicated delay-locked loops - provide jitter-reduced clock deskew, phase alignment, and frequency synthesis for internal clock domain management. |
Pinout & Package
Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 1.27 mm pitch, commercial temperature range (0°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 2.5 V ± 3% supply for internal logic; requires low-noise decoupling due to high dynamic current draw during configuration and operation. |
| VCCO_0–VCCO_7 | I/O bank power supplies | Independent 3.3 V / 2.5 V / 1.5 V outputs per bank; defines signaling standard compatibility and must be isolated per bank per Table 2 in DS003-2. |
| VREF_0–VREF_7 | I/O reference voltage inputs | Required for HSTL/SSTL input thresholds; one per bank; internally tied-must be externally sourced at precise voltage (e.g., 0.75 V for HSTL Class I). |
| GCLK0–GCLK3 | Dedicated global clock inputs | Low-skew primary clock nets feeding DLLs; support differential or single-ended inputs; bypass internal routing delays for timing-critical clocks. |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test access port; used for configuration, debugging, and in-system verification without requiring external programming hardware. |
| INIT_DONE | Configuration status output | Open-drain active-low signal indicating successful bitstream loading and device readiness; used for system reset synchronization. |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero-hold-time I/O timing, clock deskew across large arrays, and programmable phase shifts-critical for source-synchronous interfaces like DDR or video capture. |
| Configurable LUT RAM | Each 4-input LUT can operate as 16×1-bit synchronous RAM, 16×2-bit or 32×1-bit RAM, or 16-bit shift register-providing flexible, area-efficient storage without consuming block RAM. |
| Banked I/O with VCCO/VREF | Eight independent I/O banks allow mixing of LVTTL, SSTL2, and HSTL on a single device while maintaining signal integrity-reducing need for level translators in mixed-voltage systems. |
| Dual-ported block RAM | 65,536 bits organized as sixteen 4k-bit dual-ported RAMs with independent address/data/control per port-enables FIFOs, ping-pong buffers, and true dual-clock memory access. |
| Carry chain & F5/F6 multiplexers | Two-bit-per-CLB carry chain plus 5- and 6-input function generators enable efficient arithmetic (adders, counters) and wide-logic functions (decoders, parity trees) with minimal LUT usage. |
Applications
| Industrial Motion Controller | PCI-Based Data Acquisition Card |
|---|---|
|
Use Scenario: Real-time servo loop execution, encoder counting, and PWM generation in CNC machines and robotic arms. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom motion profiles, position interpolation, and synchronized I/O timing via DLL-managed clocks. Use Value: Deterministic sub-microsecond latency for closed-loop control, supported by dedicated carry logic and low-skew global clock nets. |
Use Scenario: High-throughput analog-to-digital sampling with direct PCI bus streaming to host memory. IC Role / Device Role / Timing Role: Interface bridge between ADC front-end and 66-MHz PCI bus; handles handshaking, DMA arbitration, and data packing. Use Value: Native 66-MHz PCI compliance and hot-swap capability enable plug-and-play instrumentation cards without system reboot. |
| Legacy Telecom Line Card | Automated Test Equipment (ATE) Pattern Generator |
|
Use Scenario: T1/E1 framing, HDLC processing, and jitter-tolerant clock recovery in base station backhaul modules. IC Role / Device Role / Timing Role: Protocol engine with embedded clock-data recovery using DLL-based clock clean-up and multi-standard I/O for line-side and system-side interfaces. Use Value: Simultaneous support for 3.3 V PCI and 2.5 V LVCMOS I/O allows integration of legacy and newer subsystems on one board. |
Use Scenario: Generation of high-speed, multi-channel digital stimulus waveforms with precise edge placement for IC validation. IC Role / Device Role / Timing Role: Pattern sequencer with deep on-chip RAM (block + distributed), high-speed I/O drivers, and DLL-controlled output timing alignment. Use Value: 200 MHz system clock capability and 16-bit shift register LUT mode enable >150 Mbps per pin waveform streaming with sub-nanosecond jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300-6BG432C | Faster speed grade (-6 vs. -5); achieves higher maximum clock frequencies and tighter timing margins under worst-case conditions. | Better suited for designs pushing 180+ MHz system clocks or requiring margin for future timing closure iterations. | Select when timing closure is marginal with -5 grade or when future design scalability demands headroom. |
| XCV400-5BG432C | Higher density (468,252 gates, 10,800 logic cells, 404 I/O) in same BG432 package; identical speed grade and I/O architecture. | Enables larger logic partitions, more embedded memory, or additional protocol engines without changing PCB layout. | Choose when design growth is anticipated and pin-compatible upgrade path is required within same footprint. |
Compared with XCV300-5BG432C, the -6 variant improves worst-case timing slack but offers no functional or I/O expansion, while the XCV400-5BG432C retains identical speed and packaging but adds ~45% more logic and I/O-making it a scalable migration path rather than a drop-in replacement.
Availability
XCV300-5BG432C is available at Aetrix Electronics and suitable for industrial motion control, PCI-based data acquisition, legacy telecom infrastructure, and automated test equipment requiring stable component supply and long-term obsolescence management support.
Supply support for XCV300-5BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex family-including XCV300-5BG432C-was designed for high-performance, high-capacity reconfigurable computing in telecommunications, aerospace, and industrial automation, emphasizing place-and-route efficiency and silicon-level optimization.
FAQ
Is XCV300-5BG432C still in production?
No, XCV300-5BG432C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains legacy inventory and supports lifecycle management-including cross-reference guidance, obsolescence forecasting, and last-time-buy coordination-for ongoing production of systems dependent on XCV300-5BG432C.
What configuration modes does XCV300-5BG432C support?
XCV300-5BG432C supports four configuration modes: master serial (auto-reads bitstream from external PROM), slave serial, SelectMAP™ (parallel programming via CPU bus), and JTAG (boundary-scan programming and debugging). All modes load the same SRAM-based configuration, enabling field reprogrammability without hardware changes.
Can XCV300-5BG432C interface directly with 3.3 V PCI slots?
Yes, XCV300-5BG432C is 66-MHz PCI compliant and supports 3.3 V PCI signaling natively through its SelectIO™ I/O blocks. Its IOBs meet PCI electrical specifications-including drive strength, slew rate, and input thresholds-when configured for PCI 3.3 V standard with appropriate VCCO = 3.3 V and termination.
Does XCV300-5BG432C include on-chip memory beyond LUTs?
Yes, XCV300-5BG432C integrates 65,536 bits of dedicated block SelectRAM-organized as sixteen 4k-bit dual-ported RAM blocks-as well as LUTs configurable as 16-bit RAM, 32-bit RAM, or 16-bit shift registers. This provides both deep, structured memory and flexible distributed storage for pipeline staging and buffering.
What is the role of the DLLs in XCV300-5BG432C?
The four dedicated delay-locked loops (DLLs) in XCV300-5BG432C eliminate clock skew across the device, align input/output timing to external references, and enable zero-hold-time operation for source-synchronous interfaces. They support phase shifting, duty-cycle correction, and clock multiplication-key for high-speed I/O like HSTL Class IV and DDR-like protocols.
XCV300-5BG432C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 432-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 6912
- Total RAM Bits:
- 65536
- Number of I/O:
- 316
- Number of Gates:
- 322970
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 432-MBGA (40x40)
XCV300-5BG432C FAQ
1.How can I place an order for XCV300-5BG432C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV300-5BG432C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV300-5BG432C reliable?
The price and inventory of XCV300-5BG432C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-5BG432C is usually 5 days.
3.What payment methods are accepted for XCV300-5BG432C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-5BG432C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV300-5BG432C?
XCV300-5BG432C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV300-5BG432C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV300-5BG432C?
For technical support, including XCV300-5BG432C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-5BG432C requirements.
6.How does Aetrix verify that XCV300-5BG432C is sourced from the original manufacturer or authorized distributors?
All XCV300-5BG432C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-5BG432C meets industry standards.
7.What is the process for return or replacement of XCV300-5BG432C?
All XCV300-5BG432C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-5BG432C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV300-5BG432C part is unused and in its original packaging.
Return procedure for XCV300-5BG432C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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