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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV300-5BG432I

Name: XCV300-5BG432I
Brand: AMD
SKU: XCV300-5BG432I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV300-5BG432I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 432-LBGA Exposed Pad, Metal

Datasheet:: XCV300-5BG432I.pdf

Description:: IC FPGA 316 I/O 432MBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

XCV300-5BG432I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, 316 user I/O pins, and four dedicated delay-locked loops (DLLs) for advanced clock control. It operates across –40°C to +100°C and targets high-speed industrial control, PCI-compliant interface bridging, and reconfigurable digital signal processing subsystems.

For engineers reviewing the XCV300-5BG432I datasheet, pinout, applications, or equivalent options, key selection criteria include its 200 MHz system performance ceiling, 66-MHz PCI compliance, 65,536-bit block RAM capacity, 0.22 μm 5-layer metal process, and industrial temperature grade - all critical for legacy rework, long-lifecycle embedded upgrades, and hot-swappable CompactPCI designs.

Technical Context

The XCV300-5BG432I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and VersaRing I/O periphery routing to support pin-locking and PCB reuse. Its CLB array (32×48) integrates four logic cells per block, each with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, dual-ported RAM, or shift registers.

Each IOB supports 16 SelectIO™ standards including LVTTL, HSTL Class IV, SSTL2/3, and GTL+, with independent VCCO per I/O bank and optional weak-keeper circuits. The device includes two columns of synchronous dual-ported 4k-bit Block SelectRAMs (16 blocks total), IEEE 1149.1 boundary-scan, and die-temperature sensor diode functionality.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	322,970 - defines logic density for complex state machines and datapath implementation
Logic Cells	6,912 - provides granular, routable resources for mixed RTL and schematic design flows
User I/O Pins	316 - enables high-pin-count peripheral interfacing with banked VCCO/VREF support
Block RAM Bits	65,536 - delivers on-chip memory for FIFOs, coefficient storage, or protocol buffering without external SRAM
Max System Frequency	200 MHz - supports synchronous timing closure in high-throughput data acquisition and packet processing
Speed Grade	-5 - specifies worst-case timing performance under industrial temperature and voltage conditions
Package	432-ball BGA (BG432) - surface-mount footprint with 1.27 mm pitch, optimized for thermal dissipation and signal integrity
Operating Temperature	–40°C to +100°C - qualifies for industrial motor drives, base station radios, and transportation control systems

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 35 × 35 mm body, 1.27 mm ball pitch, RoHS-compliant lead-free finish.

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Dedicated low-skew inputs for DLL-synchronized clock domains; essential for multi-clock domain synchronization
PROGRAM_B	Configuration Initiate	Active-low asynchronous reset that clears configuration memory and forces reinitialization on next power-up or reset cycle
DONE	Configuration Status	Open-drain output indicating successful bitstream loading; must be pulled up externally to enable startup
TCK/TMS/TDI/TDO	JTAG Boundary-Scan	IEEE 1149.1-compliant test access port for in-system programming, debug, and production testing
VCCINT	Core Supply	2.5 V ± 3% supply for CLB and routing logic; requires low-noise decoupling due to dynamic switching current
VCCO_0–VCCO_7	I/O Bank Supply	Bank-specific output voltage rails (1.5 V / 2.5 V / 3.3 V); each bank must use identical VCCO for compatible signaling standards
VREF_0–VREF_7	I/O Threshold Reference	Input reference voltage for SSTL/HSTL/GTL standards; shared per bank, requiring precise external regulation

Key Features

Feature	Design Value
Dedicated DLLs	Four independent delay-locked loops eliminate clock skew across large arrays and enable phase-aligned multi-clock generation
SelectIO™ Interface	16 programmable I/O standards per bank - allows mixed-voltage interfaces (e.g., 3.3 V LVTTL + 1.5 V HSTL) on same device without level shifters
LUT-as-RAM	Each 4-input LUT configures as 16×1-bit synchronous RAM or combines into 32×1-bit/16×2-bit RAM - enables compact register files and pipeline stages
Carry Chain Logic	Dedicated fast-carry path per CLB slice - accelerates arithmetic (adders, counters) and wide-logic functions (priority encoders, comparators)
Block SelectRAM	16 × 4,096-bit dual-ported RAM blocks - supports simultaneous read/write at different addresses for ping-pong buffering and FFT twiddle storage
Hot-Swap Ready	Supports CompactPCI hot-swap protocols via controlled power sequencing and I/O clamp structures - enables field-replaceable modules

Applications

Industrial Motor Control	PCI-to-Local Bus Bridge
Use Scenario: Real-time PWM generation, encoder feedback decoding, and safety interlock monitoring in servo drive controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing deterministic finite-state machines with sub-microsecond response latency and synchronized 200 MHz clock domains. Use Value: Eliminates need for discrete ASICs or microcontroller+FPGA combinations by integrating motion control IP, encoder interface, and fault-handling logic in one reprogrammable device.	Use Scenario: Protocol translation between 66 MHz 32-bit PCI bus and custom 100 MHz local memory-mapped peripherals in test equipment. IC Role / Device Role / Timing Role: PCI-compliant endpoint with programmable address decode, burst transaction management, and DLL-synchronized timing alignment. Use Value: Enables drop-in replacement of obsolete PCI bridge ASICs while supporting legacy driver stacks and custom DMA engines via HDL reconfiguration.
Base Station Channelizer	Reconfigurable Test Instrumentation
Use Scenario: Digital downconversion and channel filtering in multi-carrier GSM/UMTS radio units using fixed-point FIR filters and NCOs. IC Role / Device Role / Timing Role: High-speed datapath accelerator with block RAM for filter coefficients, carry chains for arithmetic, and SelectIO™ for JESD204B-like parallel ADC/DAC interfacing. Use Value: Delivers >100 MSPS real-time processing throughput with field-upgradable filter banks - avoids costly hardware redesigns during air interface standard evolution.	Use Scenario: Modular ATE platform requiring rapid adaptation to DUT pinouts, timing protocols, and stimulus/response patterns across semiconductor validation labs. IC Role / Device Role / Timing Role: Pin-flexible pattern generator and comparator core with programmable slew rates, drive strengths, and per-pin VCCO/VREF assignment. Use Value: Reduces test fixture changeover time from days to minutes via reloaded bitstreams - supports concurrent development of multiple DUT families on shared hardware.

Industrial Motor Control

PCI-to-Local Bus Bridge

Use Scenario: Real-time PWM generation, encoder feedback decoding, and safety interlock monitoring in servo drive controllers.

IC Role / Device Role / Timing Role: Configurable logic fabric implementing deterministic finite-state machines with sub-microsecond response latency and synchronized 200 MHz clock domains.

Use Value: Eliminates need for discrete ASICs or microcontroller+FPGA combinations by integrating motion control IP, encoder interface, and fault-handling logic in one reprogrammable device.

Use Scenario: Protocol translation between 66 MHz 32-bit PCI bus and custom 100 MHz local memory-mapped peripherals in test equipment.

IC Role / Device Role / Timing Role: PCI-compliant endpoint with programmable address decode, burst transaction management, and DLL-synchronized timing alignment.

Use Value: Enables drop-in replacement of obsolete PCI bridge ASICs while supporting legacy driver stacks and custom DMA engines via HDL reconfiguration.

Base Station Channelizer

Reconfigurable Test Instrumentation

Use Scenario: Digital downconversion and channel filtering in multi-carrier GSM/UMTS radio units using fixed-point FIR filters and NCOs.

IC Role / Device Role / Timing Role: High-speed datapath accelerator with block RAM for filter coefficients, carry chains for arithmetic, and SelectIO™ for JESD204B-like parallel ADC/DAC interfacing.

Use Value: Delivers >100 MSPS real-time processing throughput with field-upgradable filter banks - avoids costly hardware redesigns during air interface standard evolution.

Use Scenario: Modular ATE platform requiring rapid adaptation to DUT pinouts, timing protocols, and stimulus/response patterns across semiconductor validation labs.

IC Role / Device Role / Timing Role: Pin-flexible pattern generator and comparator core with programmable slew rates, drive strengths, and per-pin VCCO/VREF assignment.

Use Value: Reduces test fixture changeover time from days to minutes via reloaded bitstreams - supports concurrent development of multiple DUT families on shared hardware.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV300-6BG432I	Faster speed grade (–6 vs –5); achieves tighter timing closure at 200 MHz with reduced setup/hold margins	Better suited for designs with critical paths exceeding –5-grade timing limits, especially in high-fanout clock trees	Select when timing analysis shows >5% slack violation with XCV300-5BG432I; requires identical PCB layout
XCV400-5BG432I	Higher density (468,252 gates, 10,800 logic cells, 404 I/O) in same BG432 package; larger block RAM (81,920 bits)	Enables integration of additional peripherals or wider datapaths without changing board footprint	Choose for future-proofing or incremental feature expansion where pin compatibility and thermal envelope allow

Compared with XCV300-5BG432I, the –6 variant improves maximum operating frequency margin for timing-critical paths, while the XCV400-5BG432I offers scalable logic and memory headroom within identical mechanical and thermal constraints - both preserve I/O banking structure and configuration interface compatibility.

Availability

XCV300-5BG432I is available at Aetrix Electronics and suitable for industrial motor control, PCI-compliant bridge modules, and reconfigurable test instrumentation requiring stable component supply across extended product lifecycles.

Supply support for XCV300-5BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGA architectures and established industry standards for reconfigurable computing.

The Virtex family was designed for high-performance, high-density applications demanding system-level flexibility - targeting communications infrastructure, industrial automation, and aerospace systems where ASIC non-recurring engineering costs and long design cycles are prohibitive.

FAQ

What is the maximum operating frequency supported by XCV300-5BG432I?

XCV300-5BG432I supports synchronous system clock rates up to 200 MHz, including I/O timing, as verified under worst-case industrial temperature (–40°C to +100°C) and voltage conditions. This rating applies to register-to-register paths and assumes proper placement, routing, and DLL usage; actual achievable frequency depends on design topology and resource utilization.

Does XCV300-5BG432I support hot-swap operation in CompactPCI systems?

Yes, XCV300-5BG432I is explicitly designed for hot-swappable CompactPCI applications. Its I/O structure includes clamping diodes, controlled power-up sequencing, and robust ESD protection aligned with PICMG 2.1 specifications - enabling safe insertion/removal while the backplane remains powered.

How many block RAMs does XCV300-5BG432I contain, and what are their configurations?

XCV300-5BG432I contains 16 synchronous dual-ported 4,096-bit Block SelectRAMs (65,536 total bits). Each block supports independent port widths (1–16 bits) and depths (4096–256), enabling flexible configurations such as 16-bit × 256-word lookup tables or 8-bit × 512-word FIFO buffers with simultaneous read/write access.

What I/O standards are supported by XCV300-5BG432I, and how are they managed per bank?

XCV300-5BG432I supports 16 SelectIO™ standards including LVTTL, HSTL Class I/III/IV, SSTL2/3, GTL/GTL+, and PCI 3.3 V. I/O standards are grouped into eight banks; each bank requires uniform VCCO voltage and permits only compatible standards (e.g., 3.3 V bank supports LVTTL, PCI, SSTL3), with VREF shared across all inputs in the bank.

Is XCV300-5BG432I still in active production, and what is its obsolescence status?

XCV300-5BG432I is classified as obsolete/under obsolescence per Xilinx documentation DS003-1 (v4.0, March 2013). While no longer manufactured, Aetrix Electronics maintains traceable inventory with full lot traceability and provides lifecycle coordination support - including cross-reference guidance and migration paths to newer Virtex or Kintex families where functionally appropriate.

XCV300-5BG432I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®

Package/Case:: 432-LBGA Exposed Pad, Metal

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 1536

Number of Logic Elements/Cells:: 6912

Total RAM Bits:: 65536

Number of I/O:: 316

Number of Gates:: 322970

Voltage - Supply:: 2.375V ~ 2.625V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 432-MBGA (40x40)

XCV300-5BG432I FAQ

1.How can I place an order for XCV300-5BG432I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300-5BG432I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300-5BG432I reliable?

The price and inventory of XCV300-5BG432I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-5BG432I is usually 5 days.

3.What payment methods are accepted for XCV300-5BG432I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-5BG432I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300-5BG432I?

XCV300-5BG432I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300-5BG432I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300-5BG432I?

For technical support, including XCV300-5BG432I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-5BG432I requirements.

6.How does Aetrix verify that XCV300-5BG432I is sourced from the original manufacturer or authorized distributors?

All XCV300-5BG432I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-5BG432I meets industry standards.

7.What is the process for return or replacement of XCV300-5BG432I?

All XCV300-5BG432I units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-5BG432I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300-5BG432I part is unused and in its original packaging.

Return procedure for XCV300-5BG432I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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