AMD XCV300-5FG456C

Overview

XCV300-5FG456C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells in a 32×48 CLB array, and 316 user I/O pins in a 456-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536 bits of block SelectRAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV300-5FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (guaranteed 160 MHz system performance), 2.5 V core voltage, hot-swappable Compact PCI support, and multi-standard SelectIO™ interfaces compatible with LVTTL, LVCMOS2, HSTL, SSTL, and GTL families.

Technical Context

The XCV300-5FG456C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling efficient place-and-route for complex synchronous designs. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5-/6-input functions, and dual-port 4k-bit block RAMs with independent address/data widths.

Configuration is SRAM-based and in-system reprogrammable via JTAG, SelectMAP™, or slave serial modes. I/O banks enforce strict VCCO/VREF partitioning: eight independent banks support mixed signaling standards only when sharing the same VCCO (e.g., 3.3 V for PCI/LVTTL/SSTL3) and limit VREF usage to one voltage per bank for input threshold consistency.

Key Specifications

Pinout & Package

Package: 456-ball Fine-pitch Ball Grid Array (FG456), RoHS-compliant, 27 mm × 27 mm body, 1.0 mm ball pitch, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV300-5FG456C, the XCV300-6FG456C offers higher timing margin without resource or I/O changes, while the XCV400-5FG456C provides 45% more logic cells and 25% more block RAM in the identical FG456 package - enabling future-proofing or design reuse across product tiers.

Availability

XCV300-5FG456C is available at Aetrix Electronics and suitable for PCI bridge controllers, high-speed memory interfaces, DSP co-processors, and protocol converters requiring stable component supply throughout extended production lifecycles.

Supply support for XCV300-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as its flagship high-performance FPGA platform.

The Virtex family was designed for demanding applications requiring high logic density, multi-gigabit transceivers (in later generations), and advanced clock management - targeting telecommunications infrastructure, military/aerospace systems, and high-end test equipment.

FAQ

Is XCV300-5FG456C still in production or obsolete?

XCV300-5FG456C is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). However, Aetrix Electronics maintains legacy inventory and offers extended lifecycle support, including traceable sourcing from authorized channels and obsolescence mitigation planning for ongoing production programs.

What configuration modes does XCV300-5FG456C support?

XCV300-5FG456C supports four configuration modes: master serial (auto-reads bitstream from external PROM), slave serial, SelectMAP™ (parallel programming via CPU bus), and JTAG (boundary-scan programming/debugging). All modes load the same SRAM-based configuration, enabling field reprogramming without hardware modification.

Can XCV300-5FG456C interface directly with 3.3 V PCI slots?

Yes, XCV300-5FG456C is fully 66-MHz PCI compliant and supports 3.3 V signaling. Its SelectIO™ outputs meet PCI electrical specifications when configured with appropriate drive strength and slew rate, and its I/O banks accept 3.3 V VCCO - enabling direct connection to PCI edge connectors without level-shifting circuitry.

How many clock regions and DLLs are available in XCV300-5FG456C?

XCV300-5FG456C contains four dedicated delay-locked loops (DLLs) and four primary low-skew global clock distribution nets. These DLLs support phase alignment, duty-cycle correction, and clock multiplication/division - critical for synchronizing multi-domain designs such as video pipelines or multi-processor interfaces using XCV300-5FG456C.

Does XCV300-5FG456C support hot-swap operation in Compact PCI systems?

Yes, XCV300-5FG456C meets Compact PCI hot-swap requirements per PICMG 2.1. Its I/O structure, power sequencing behavior, and robust ESD protection (±2 kV HBM) allow safe insertion and removal while the backplane remains powered - making it suitable for telecom line cards and modular industrial controllers where uptime is critical.