AMD XCV300-5FG456I

Overview

XCV300-5FG456I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, and 316 user I/O pins in a 456-ball fine-pitch BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536 bits of block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and signal processing applications.

For engineers reviewing the XCV300-5FG456I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, DLL jitter specifications, and industrial-temperature (-40°C to +100°C) operation context critical for legacy system sustainment and requalification.

Technical Context

The XCV300-5FG456I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock networks driven by dedicated DLLs. Its CLBs contain two slices each with four logic cells (LCs), supporting 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, dual-ported RAM, or 16-bit shift registers.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed signaling standards only if compatible with shared VCCO (e.g., LVTTL and PCI at 3.3 V), while GTL/GTL+ are supported across all VCCO voltages due to open-drain output structure.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG456) with 456 solder balls, 25 mm × 25 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-230 footprint. Pinout conforms to Xilinx DS003-4 (v4.0) Module 4 - Pinout Tables, with eight I/O banks (Bank 0–7), four dedicated global clock inputs (GCLK0–GCLK3), and dual-purpose configuration pins (e.g., INIT_B, PROGRAM_B, CCLK, DIN, DOUT, DONE).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV300-5FG456I, the XCV300-6FG456I offers improved timing margin without altering resource allocation, while the XCV400-5FG456I provides 45% more logic cells and 25% more block RAM in the same footprint - making both viable for sustaining legacy designs facing increased functional requirements or aging yield issues.

Availability

XCV300-5FG456I is available at Aetrix Electronics and suitable for industrial motion control, legacy telecom infrastructure, PCI-based data acquisition, and test equipment pattern generation requiring stable component supply and long-term obsolescence mitigation support.

Supply support for XCV300-5FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA architectures have defined industry standards for reconfigurable computing since the 1980s.

The Virtex family - including XCV300-5FG456I - was engineered for high-performance, high-density logic implementation in mission-critical systems demanding advanced clock management, flexible I/O, and robust configuration security.

FAQ

What is the maximum operating frequency supported by XCV300-5FG456I?

XCV300-5FG456I supports synchronous system clock rates up to 200 MHz, including I/O timing, as verified under worst-case conditions with the -5 speed grade. This rating applies to register-to-register paths and is achievable with proper placement, routing, and DLL usage - not guaranteed for all logic topologies or I/O standards.

Does XCV300-5FG456I support hot-swap capability for Compact PCI applications?

Yes, XCV300-5FG456I is explicitly designed for hot-swappable Compact PCI systems per its product specification. This requires correct implementation of power sequencing, I/O clamping, and configuration state retention during insertion/removal - supported by its 2.5 V core and 3.3 V I/O architecture with dedicated hot-swap control logic.

How many block RAM units does XCV300-5FG456I contain, and what are their port configurations?

XCV300-5FG456I contains 16 block SelectRAM units totaling 65,536 bits. Each unit is a fully synchronous dual-ported 4096-bit RAM with independent address, data, and control lines per port, supporting configurable data widths (1–16 bits) and depths (256–4096) as defined in Table 4 of DS003-2.

Can XCV300-5FG456I interface directly with 5 V TTL logic?

XCV300-5FG456I supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, meaning it can safely accept 5 V signals on input pins configured for those standards. However, its outputs are not 5 V capable - they drive at VCCO (typically 3.3 V), so external level-shifting is required for driving true 5 V loads.

Is XCV300-5FG456I still in active production, and what obsolescence status applies?

XCV300-5FG456I is marked Product Obsolete/Under Obsolescence per DS003-1 (v4.0) dated March 2013. It is no longer manufactured by Xilinx (now AMD), but Aetrix Electronics maintains traceable inventory and offers lifecycle management services including last-time buy coordination and cross-reference support for migration paths.