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AMD XCV300-6BG352C
- Part No.:
- XCV300-6BG352C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 352-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV300-6BG352C.pdf
- Description:
- IC FPGA 260 I/O 352MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,852
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Product details
Overview
XCV300-6BG352C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, 316 user I/O pins, and four dedicated delay-locked loops (DLLs) for advanced clock control-designed for high-speed PCI-compliant embedded control, digital signal processing, and reconfigurable communication interfaces.
For engineers reviewing the XCV300-6BG352C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, block RAM configuration options, and speed-grade–specific DC/switching characteristics per DS003-3 (v4.0).
Technical Context
The XCV300-6BG352C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, or 16-bit shift registers.
I/O functionality is organized into eight independent banks supporting 16 SelectIO™ standards-including LVTTL, HSTL Class IV, SSTL2/I/II, and GTL+-with bank-specific VCCO and VREF requirements, 5 V-tolerant inputs on select standards, and programmable slew rate and drive strength up to 24 mA source / 48 mA sink.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 322,970 - defines total logic capacity for ASIC replacement sizing in complex digital systems |
| Logic Cells | 6,912 - each contains two 4-input LUTs + flip-flops + carry logic, enabling efficient arithmetic and state-machine implementation |
| User I/O Pins | 316 - available in BG352 package with banked voltage constraints (VCCO/VREF per bank) |
| Block RAM | 65,536 bits - composed of sixteen 4k-bit synchronous dual-ported RAM blocks, supporting independent read/write widths |
| Speed Grade | -6 - guarantees worst-case register-to-register delay ≤ 5.0 ns and 200 MHz system clock operation with DLL |
| Process Technology | 0.22 μm 5-layer metal CMOS - enables high density and low static power at 2.5 V core supply |
| Configuration Mode | SRAM-based with JTAG, SelectMAP™, slave serial, and master serial - supports in-system reprogramming without hardware reset |
Pinout & Package
The XCV300-6BG352C uses a 352-ball Fine-Pitch Ball Grid Array (FBGA) package with 316 user I/O pins distributed across eight I/O banks. Each bank requires dedicated VCCO and optional VREF supplies, with strict voltage compatibility rules per supported I/O standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew inputs feeding four DLLs; must connect to external clock sources with controlled impedance |
| CCLK | Configuration Clock | Drives internal configuration logic during master serial mode; output during readback; not usable as general-purpose clock |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1-compliant test access port; enables programming, debugging, and interconnect verification |
| VCCINT | Core Power Supply | 2.5 V ± 3% supply for CLBs and internal logic; requires low-noise decoupling near package corners |
| VCCO_0–VCCO_7 | Bank Output Voltage | Per-bank I/O driver supply (1.5 V, 2.5 V, or 3.3 V); all pins in same bank must share identical VCCO |
| VREF_0–VREF_7 | Input Reference Voltage | Required for SSTL/HSTL/GTL input standards; internally tied across bank; must match standard's threshold spec |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DLLs | Four independent delay-locked loops eliminate clock skew across large designs and enable phase-aligned multi-clock domains |
| Configurable LUT RAM | Each 4-input LUT can operate as 16×1-bit synchronous RAM, 16×2-bit RAM, or 16-bit shift register-enabling compact FIFOs and pipeline stages |
| Block SelectRAM | Sixteen 4k-bit dual-ported RAM blocks support true simultaneous read/write with independent address/data buses per port |
| I/O Banking | Eight isolated banks allow mixed-voltage I/O (e.g., 3.3 V LVTTL + 1.5 V HSTL) on single device-reducing level-shifter count and PCB layer count |
| Carry Chain Logic | Dedicated 2-bit-per-CLB carry chain enables high-speed adders, counters, and arithmetic units without consuming LUT resources |
Applications
| PCI Bridge Controller | DSP Co-Processor |
|---|---|
|
Use Scenario: High-bandwidth interface between x86 host CPU and custom peripheral subsystem using 66 MHz 32-bit PCI bus. IC Role / Device Role / Timing Role: FPGA implements PCI target interface, address decoding, burst transaction management, and DMA controller logic. Use Value: XCV300-6BG352C meets PCI 2.2 timing requirements with -6 speed grade and supports hot-swap via programmable I/O drive control. |
Use Scenario: Real-time filtering and FFT acceleration in radar signal chain with parallel data streams from ADCs. IC Role / Device Role / Timing Role: Configurable datapath executes multiply-accumulate operations using dedicated carry chains and block RAM for coefficient storage. Use Value: 200 MHz system clock and 65,536-bit block RAM enable 1K-point FFT completion in <10 μs with pipelined architecture. |
| Telecom Line Card | Industrial Motion Controller |
|
Use Scenario: Multi-channel T1/E1 framer and channelized HDLC processor in base station backhaul equipment. IC Role / Device Role / Timing Role: Implements time-slot assignment, CRC generation, and HDLC flag detection across 32 concurrent channels. Use Value: 316 I/O pins support full T1 framing (1.544 Mbps × 24 channels) with HSTL Class IV I/O for ECL-compatible backplane interfacing. |
Use Scenario: Closed-loop servo control for multi-axis CNC machine with analog encoder feedback and PWM motor drive outputs. IC Role / Device Role / Timing Role: FPGA runs real-time PID loop at 50 kHz, manages quadrature decoding, and generates synchronized PWM waveforms. Use Value: Deterministic 5.0 ns register-to-register delay ensures sub-microsecond jitter in PWM edge placement critical for torque ripple reduction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300-5BG352C | Slower -5 speed grade (≤5.4 ns register-to-register delay); lower maximum clock frequency (180 MHz) | Suitable for cost-sensitive designs where 200 MHz timing margin is unnecessary | Select when system timing budget allows relaxed setup/hold margins and lower power consumption is prioritized |
| XCV400-6BG432C | Higher-density device (468,252 gates, 10,800 logic cells) in larger 432-ball BG package with 316 I/O | Enables design scalability without architectural change-same toolchain and IP reuse | Choose for future-proofing or when additional logic resources are needed for feature expansion |
Compared with XCV300-6BG352C, the -5 variant trades performance for lower cost and power, while the XCV400-6BG432C offers headroom for logic growth but requires PCB redesign due to different ball count and layout.
Availability
XCV300-6BG352C is available at Aetrix Electronics and suitable for industrial motion control, telecom line cards, PCI bridge controllers, and DSP co-processor applications requiring stable component supply amid obsolescence transitions.
Supply support for XCV300-6BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures used across aerospace, communications, and industrial markets.
The Virtex family-including XCV300-6BG352C-was engineered for high-performance reconfigurable computing, targeting applications demanding >100 MHz system clocks, multi-standard I/O, and embedded memory integration without ASIC NRE costs.
FAQ
What is the maximum operating frequency of the XCV300-6BG352C?
The XCV300-6BG352C supports synchronous system clock rates up to 200 MHz when using its built-in DLLs and meeting worst-case timing constraints. This rating applies to register-to-register paths under -6 speed grade conditions per DS003-3 (v4.0), and includes I/O timing compliance with 66 MHz PCI specifications.
Does the XCV300-6BG352C support hot-swap operation?
Yes, the XCV300-6BG352C supports hot-swap functionality specifically for Compact PCI applications. Its I/O buffers and configuration circuitry are designed to tolerate live insertion/removal when implemented with proper board-level protection and power sequencing per Xilinx Application Note XAPP153.
How many block RAMs does the XCV300-6BG352C contain?
The XCV300-6BG352C contains sixteen 4k-bit block SelectRAMs, totaling 65,536 bits of dedicated dual-ported memory. Each block supports independent read/write addressing and configurable data widths from 1 to 16 bits per port, as documented in DS003-2 Table 3.
What I/O standards are supported by the XCV300-6BG352C?
The XCV300-6BG352C supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI 3.3 V/5 V, HSTL Classes I/III/IV, SSTL2/I/II, GTL, GTL+, CTT, AGP, and more. Voltage compatibility is enforced per I/O bank, with VCCO and VREF requirements strictly defined in DS003-2 Table 1 and Figure 3.
Is the XCV300-6BG352C still in active production?
No, the XCV300-6BG352C is obsolete per Xilinx Notice XCN10016 and DS003-1 (v4.0) revision history. It remains available through Aetrix Electronics' legacy component program with traceable sourcing, extended lifecycle support, and engineering assistance for migration path evaluation.
XCV300-6BG352C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 352-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 6912
- Total RAM Bits:
- 65536
- Number of I/O:
- 260
- Number of Gates:
- 322970
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 352-MBGA (35x35)
XCV300-6BG352C FAQ
1.How can I place an order for XCV300-6BG352C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV300-6BG352C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV300-6BG352C reliable?
The price and inventory of XCV300-6BG352C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-6BG352C is usually 5 days.
3.What payment methods are accepted for XCV300-6BG352C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-6BG352C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV300-6BG352C?
XCV300-6BG352C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV300-6BG352C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV300-6BG352C?
For technical support, including XCV300-6BG352C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-6BG352C requirements.
6.How does Aetrix verify that XCV300-6BG352C is sourced from the original manufacturer or authorized distributors?
All XCV300-6BG352C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-6BG352C meets industry standards.
7.What is the process for return or replacement of XCV300-6BG352C?
All XCV300-6BG352C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-6BG352C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV300-6BG352C part is unused and in its original packaging.
Return procedure for XCV300-6BG352C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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