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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV300-6BG432C

Name: XCV300-6BG432C
Brand: AMD
SKU: XCV300-6BG432C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV300-6BG432C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 432-LBGA Exposed Pad, Metal

Datasheet:: XCV300-6BG432C.pdf

Description:: IC FPGA 316 I/O 432MBGA

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Product details

Overview

XCV300-6BG432C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells in a 32×48 CLB array, and 316 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV300-6BG432C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and SelectIO™ standard compatibility - all confirmed against DS003-1 (v4.0) and DS003-4 pinout documentation.

Technical Context

The XCV300-6BG432C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight independent banks, each requiring shared VCCO and a single VREF voltage. The device supports 16 SelectIO™ standards-including LVTTL (5 V tolerant), HSTL Class IV (200 MHz), SSTL2/3, GTL+, and PCI 3.3 V-with programmable drive strength (up to 24 mA source / 48 mA sink), slew rate control, and weak-keeper circuits per pin.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	322,970 - defines total combinational logic capacity for ASIC replacement sizing
Logic Cells	6,912 - provides count of configurable logic elements (CLBs × 4.5 LCs/CLB) for place-and-route estimation
User I/O Pins	316 - maximum number of bidirectional user-configurable signals in BG432 package
Block RAM Bits	65,536 - fixed-capacity synchronous dual-ported memory blocks (16 × 4,096-bit) for data buffering
Speed Grade	-6 - guarantees worst-case register-to-register delay ≤ 5.0 ns and address decoder ≤ 4.4 ns at 2.5 V
DLL Count	4 - enables independent clock domain management, phase alignment, and jitter reduction per domain
Operating Voltage	2.5 V core (VCCINT), 3.3 V/2.5 V/1.5 V I/O (VCCO) - requires separate power domains per I/O bank

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 35 mm × 35 mm, 1.27 mm pitch, RoHS-compliant. Pinout conforms to DS003-4 (v4.0) Module 4 - full pin function mapping available in official Xilinx documentation.

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Four dedicated low-skew inputs feeding primary clock distribution networks
PROGRAM_B	Active-Low Configuration Initiate	Asynchronous reset that clears configuration memory and restarts boot sequence
INIT_B	Configuration Status Output	Open-drain signal indicating configuration completion or error during startup
CCLK	Configuration Clock	Input clock for master serial mode; output clock for slave serial mode
TCK/TMS/TDI/TDO	JTAG Boundary-Scan Interface	IEEE 1149.1-compliant test access port for programming and debug
VCCINT	Core Power Supply	2.5 V ± 3% supply for CLB, RAM, and routing logic; decoupling required per bank
VCCO_0–VCCO_7	I/O Bank Power	Eight independent VCCO supplies (one per I/O bank); each must be set to match selected I/O standard
VREF_0–VREF_7	I/O Threshold Reference	Eight independent VREF inputs (one per bank); required only for standards like HSTL/SSTL

Key Features

Feature	Design Value
Dual-Port Block RAM	16 × 4,096-bit synchronous RAM blocks with independent read/write ports and built-in bus-width conversion
SelectIO™ Flexibility	Support for 16 I/O standards across eight banks, enabling mixed-voltage interfaces on single device
Dedicated Carry Logic	Two per CLB slice - enables high-speed arithmetic (e.g., 32-bit adder in <10 ns) without LUT resource consumption
LUT-as-RAM/Shift Register	Each 4-LUT configurable as 16×1-bit RAM, 16×2-bit RAM, 32×1-bit RAM, or 16-bit shift register for burst capture
Hot-Swap Ready	Complies with Compact PCI hot-swap requirements - supports safe insertion/removal under power
Die Temperature Sensor	On-die diode enables real-time thermal monitoring via external ADC for thermal throttling or reliability management

Applications

PCI Bridge Controller	High-Speed Data Acquisition
Use Scenario: Implementing a custom PCI-to-Local Bus bridge in industrial control systems with deterministic latency. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing arbiter between 33/66 MHz PCI bus and proprietary parallel interface. Use Value: Leverages 66-MHz PCI compliance, 316 I/Os for address/data multiplexing, and DLL-controlled clock domain crossing to meet sub-20 ns setup/hold margins.	Use Scenario: Capturing 100+ MSPS analog sensor data using external ADCs with parallel LVDS or CMOS outputs. IC Role / Device Role / Timing Role: FPGA serves as high-bandwidth front-end buffer, real-time preprocessor, and DMA controller interfacing to SDRAM. Use Value: Uses LUT-based 16-bit shift registers for pipeline capture, block RAM for ping-pong buffering, and HSTL Class IV I/O for 200 MHz DDR signaling to memory.
Telecom Line Card Logic	Avionics Test Equipment
Use Scenario: Replacing ASICs in legacy telecom line cards requiring field-upgradable packet processing logic. IC Role / Device Role / Timing Role: FPGA implements HDLC framing, CRC generation, and TDM time-slot switching with precise jitter control. Use Value: Four DLLs enable independent clock cleanup for E1/T1 reference clocks, while 5 V-tolerant LVTTL I/O interfaces directly to legacy PHYs.	Use Scenario: Embedded test instrumentation for aircraft subsystem validation requiring deterministic stimulus/response timing. IC Role / Device Role / Timing Role: FPGA generates synchronized multi-channel digital waveforms and captures response with nanosecond timestamping. Use Value: Die-temperature sensor diode enables real-time derating of timing paths; -6 speed grade ensures <5 ns register-to-register delay for critical control loops.

PCI Bridge Controller

High-Speed Data Acquisition

Use Scenario: Implementing a custom PCI-to-Local Bus bridge in industrial control systems with deterministic latency.

IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing arbiter between 33/66 MHz PCI bus and proprietary parallel interface.

Use Value: Leverages 66-MHz PCI compliance, 316 I/Os for address/data multiplexing, and DLL-controlled clock domain crossing to meet sub-20 ns setup/hold margins.

Use Scenario: Capturing 100+ MSPS analog sensor data using external ADCs with parallel LVDS or CMOS outputs.

IC Role / Device Role / Timing Role: FPGA serves as high-bandwidth front-end buffer, real-time preprocessor, and DMA controller interfacing to SDRAM.

Use Value: Uses LUT-based 16-bit shift registers for pipeline capture, block RAM for ping-pong buffering, and HSTL Class IV I/O for 200 MHz DDR signaling to memory.

Telecom Line Card Logic

Avionics Test Equipment

Use Scenario: Replacing ASICs in legacy telecom line cards requiring field-upgradable packet processing logic.

IC Role / Device Role / Timing Role: FPGA implements HDLC framing, CRC generation, and TDM time-slot switching with precise jitter control.

Use Value: Four DLLs enable independent clock cleanup for E1/T1 reference clocks, while 5 V-tolerant LVTTL I/O interfaces directly to legacy PHYs.

Use Scenario: Embedded test instrumentation for aircraft subsystem validation requiring deterministic stimulus/response timing.

IC Role / Device Role / Timing Role: FPGA generates synchronized multi-channel digital waveforms and captures response with nanosecond timestamping.

Use Value: Die-temperature sensor diode enables real-time derating of timing paths; -6 speed grade ensures <5 ns register-to-register delay for critical control loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV300-5BG432C	Slower speed grade (-5): 5.4 ns register-to-register delay vs. 5.0 ns; identical logic density, I/O count, and package	Suitable for non-critical timing paths or lower-frequency PCI (33 MHz) designs where margin is acceptable	Select when cost sensitivity outweighs need for 200 MHz system clock capability
XCV400-6BG432C	Higher density: 468,252 system gates, 10,800 logic cells, 404 I/Os; same -6 speed grade and BG432 package footprint	Enables larger state machines, deeper FIFOs, or additional peripheral interfaces without PCB change	Choose for design scalability-same pinout allows drop-in upgrade if logic utilization exceeds 85%

Compared with XCV300-6BG432C, the -5 variant trades 8% timing margin for cost reduction, while the XCV400-6BG432C offers 45% more logic and 28% more I/O in identical packaging-making it a direct migration path for growing firmware complexity.

Availability

XCV300-6BG432C is available at Aetrix Electronics and suitable for industrial control, telecom infrastructure, and avionics test equipment requiring stable component supply amid long product lifecycles.

Supply support for XCV300-6BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and toolchains widely adopted in high-reliability and high-performance systems.

The Virtex family was engineered for high-speed, high-density programmable logic replacement of ASICs in wired infrastructure, military/aerospace, and compute-acceleration applications - emphasizing timing predictability, I/O flexibility, and silicon efficiency.

FAQ

Is XCV300-6BG432C still in production?

No - XCV300-6BG432C is obsolete per Xilinx Notice XCN10016 (2013). Aetrix Electronics maintains limited legacy inventory with full traceability and offers engineering support for obsolescence mitigation, including migration paths to Spartan-7 or Kintex UltraScale+ families where feasible.

What are the key power supply requirements for XCV300-6BG432C?

XCV300-6BG432C requires three distinct supplies: 2.5 V ± 3% for core logic (VCCINT), 3.3 V/2.5 V/1.5 V for I/O banks (VCCO), and optional VREF per bank for HSTL/SSTL standards. Each of the eight I/O banks needs independent VCCO regulation, and decoupling must follow Xilinx DS003-3 layout guidelines to maintain signal integrity.

Does XCV300-6BG432C support JTAG programming?

Yes - XCV300-6BG432C includes full IEEE 1149.1 boundary-scan logic with dedicated TCK, TMS, TDI, and TDO pins. It supports JTAG configuration mode for in-system programming, debugging, and verification, as documented in DS003-1 Section "Configuration Modes" and DS003-4 pinout tables.

Can XCV300-6BG432C interface directly with 5 V TTL logic?

Yes - XCV300-6BG432C IOBs support 5 V-tolerant LVTTL and PCI 5 V standards. Inputs tolerate up to 5.5 V regardless of VCCO setting, allowing safe connection to legacy 5 V systems without level shifters - but output voltage remains constrained by VCCO (e.g., 3.3 V max when VCCO = 3.3 V).

What is the maximum operating frequency of XCV300-6BG432C?

The XCV300-6BG432C achieves synchronous system clock rates up to 200 MHz, validated across I/O and internal logic paths. This includes 200 MHz HSTL Class IV I/O operation and internal register-to-register paths meeting 5.0 ns worst-case delay at -6 speed grade and 2.5 V/85°C conditions per DS003-2 timing tables.

XCV300-6BG432C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®

Package/Case:: 432-LBGA Exposed Pad, Metal

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 1536

Number of Logic Elements/Cells:: 6912

Total RAM Bits:: 65536

Number of I/O:: 316

Number of Gates:: 322970

Voltage - Supply:: 2.375V ~ 2.625V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 432-MBGA (40x40)

XCV300-6BG432C FAQ

1.How can I place an order for XCV300-6BG432C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV300-6BG432C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV300-6BG432C reliable?

The price and inventory of XCV300-6BG432C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300-6BG432C is usually 5 days.

3.What payment methods are accepted for XCV300-6BG432C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300-6BG432C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV300-6BG432C?

XCV300-6BG432C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV300-6BG432C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV300-6BG432C?

For technical support, including XCV300-6BG432C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300-6BG432C requirements.

6.How does Aetrix verify that XCV300-6BG432C is sourced from the original manufacturer or authorized distributors?

All XCV300-6BG432C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300-6BG432C meets industry standards.

7.What is the process for return or replacement of XCV300-6BG432C?

All XCV300-6BG432C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300-6BG432C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV300-6BG432C part is unused and in its original packaging.

Return procedure for XCV300-6BG432C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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