AMD XCV300-6FG456C

Overview

XCV300-6FG456C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, and 316 user I/O pins in a 456-ball fine-pitch BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536 bits of block SelectRAM), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV300-6FG456C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, high-speed programmable logic solution for legacy telecom infrastructure, industrial control systems, and reconfigurable computing platforms requiring deterministic timing, multi-standard I/O, and in-system reprogrammability.

Technical Context

The XCV300-6FG456C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling efficient place-and-route for complex synchronous designs. Its CLB structure contains two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for wide-function logic, and dual-port 4k-bit block RAMs.

It supports 16 SelectIO™ standards including LVTTL, LVCMOS2, HSTL Class IV, SSTL3, and GTL+, with banked I/O requiring shared VCCO per bank and optional VREF for threshold-sensitive inputs. Configuration occurs via master serial, slave serial, SelectMAP™, or JTAG modes using external PROM or host controller.

Key Specifications

Pinout & Package

Package: FG456 - 456-ball fine-pitch ball grid array (1.0 mm pitch), RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV300-6FG456C, the -5 variant trades 0.4 ns timing margin for lower unit cost, while the XCV400-6FG456C retains pin compatibility and timing performance but doubles logic capacity - making it ideal for scalable designs where gate count growth is anticipated.

Availability

XCV300-6FG456C is available at Aetrix Electronics and suitable for telecom infrastructure upgrades, industrial motion control systems, and avionics data concentrators requiring stable component supply and long-term lifecycle support.

Supply support for XCV300-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family - including XCV300-6FG456C - was engineered for high-performance, high-density reconfigurable systems in telecommunications, aerospace, and industrial automation where deterministic timing and multi-protocol I/O are critical.

FAQ

What is the maximum operating frequency supported by the XCV300-6FG456C?

The XCV300-6FG456C supports synchronous system clock rates up to 200 MHz, including I/O timing, as verified under worst-case conditions for the -6 speed grade. This rating applies to register-to-register paths and assumes proper PCB layout, power integrity, and timing constraints. The XCV300-6FG456C achieves this via four dedicated DLLs and low-skew global clock networks, enabling high-speed signal processing and interface bridging without external clock conditioning.

Does the XCV300-6FG456C support hot-swap functionality?

Yes, the XCV300-6FG456C is explicitly designed for hot-swappable Compact PCI applications. Its I/O architecture meets PCI electrical specifications for 33 MHz and 66 MHz operation, and its configuration logic tolerates live insertion/removal events when implemented with compliant power sequencing and bus-hold circuitry. This capability is documented in DS003-1 and validated in Xilinx reference designs for carrier-grade telecom shelves.

How much on-chip memory does the XCV300-6FG456C provide?

The XCV300-6FG456C integrates 65,536 bits of block SelectRAM organized as sixteen 4,096-bit dual-ported RAM blocks, plus distributed RAM resources from configurable LUTs (up to 16-bit depth per LUT). Each block supports independent read/write addresses and widths - enabling flexible buffer architectures such as asynchronous FIFOs, coefficient tables, or frame stores - all without external memory components.

What I/O standards are supported by the XCV300-6FG456C?

The XCV300-6FG456C supports 16 SelectIO™ standards including LVTTL (5 V tolerant), LVCMOS2, PCI 3.3 V, HSTL Class I/III/IV, SSTL3, SSTL2, GTL, GTL+, and CTT. I/O banks enforce voltage segregation: VCCO must be uniform per bank (e.g., 3.3 V for LVTTL/PCI), and VREF is required only for standards like HSTL or SSTL. This enables mixed-signaling on a single device while maintaining signal integrity.

Is the XCV300-6FG456C still in production?

No - the XCV300-6FG456C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with end-of-life status confirmed in XCN10016. However, Aetrix Electronics maintains traceable, tested inventory sourced from authorized legacy channels and supports extended lifecycle management, including obsolescence forecasting and cross-reference guidance for migration paths.