AMD XCV300-6PQ240C

Overview

XCV300-6PQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 322,970 system gates, 6,912 logic cells, and 316 user I/O pins in a 240-pin Plastic Quad Flat Pack (PQFP) package. It features four delay-locked loops (DLLs), hierarchical memory (including 65,536-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and data-path acceleration.

For engineers reviewing the XCV300-6PQ240C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing parameters, SelectIO™ standard compatibility (LVTTL, HSTL Class IV, SSTL2), and obsolescence-aware supply guidance for legacy system sustainment.

Technical Context

The XCV300-6PQ240C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing-enabling pin-locking and PCB layout reuse across logic revisions. Its CLB contains two slices, each with four 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and dual-port synchronous storage elements.

Each IOB supports independent input/output flip-flops with programmable set/reset polarity, clock enable, and optional input delay to eliminate pad-to-pad hold time. Eight I/O banks enforce VCCO/VREF voltage segregation: PQ240 package uses globally bonded VCCO pins, restricting all outputs to a single 3.3 V or 2.5 V supply per device, while supporting mixed standards like LVTTL and SSTL2 only within compatible voltage groups.

Key Specifications

Pinout & Package

Package: 240-pin Plastic Quad Flat Pack (PQFP), 0.5 mm pitch, 32.5 mm × 32.5 mm body size, lead-free compatible (per Xilinx DS003-1 v4.0). Thermal resistance θ_JA = 35°C/W typical.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV300-6PQ240C, XCV300-6BG352C offers superior I/O flexibility at the cost of BGA assembly complexity, while XCV400-6PQ240C delivers gate-count headroom within identical footprint and thermal profile-making it the preferred drop-in upgrade path for sustained production.

Availability

XCV300-6PQ240C is available at Aetrix Electronics and suitable for telecom infrastructure spares, industrial control system refurbishment, and medical device lifecycle extension requiring stable component supply amid obsolescence management.

Supply support for XCV300-6PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA portfolio enables customizable digital logic implementation across aerospace, communications, and industrial markets.

The Virtex family was designed for high-performance, high-density system-on-chip integration-targeting applications demanding >100 MHz clock rates, embedded memory, and multi-standard I/O without ASIC development cycles.

FAQ

Is XCV300-6PQ240C still in production or supported by Xilinx?

No, XCV300-6PQ240C is obsolete per Xilinx DS003-1 v4.0 (March 2013) and XCN10016 notice. Xilinx discontinued manufacturing and technical support. Aetrix Electronics provides last-time-buy inventory, traceable lot data, and obsolescence mitigation services-including cross-reference analysis and migration paths-to sustain legacy systems using XCV300-6PQ240C.

What are the key thermal and power requirements for XCV300-6PQ240C in a commercial application?

XCV300-6PQ240C requires a 2.5 V ±3% VCCINT supply (decoupled with ≥10 µF ceramic per 4 pins) and a single VCCO supply (3.3 V or 2.5 V) due to internal bonding in the PQ240 package. At 200 MHz operation with 50% toggle rate, typical core power is 2.1 W; junction temperature must stay below +85°C. Thermal pad on PQ240 bottom is not electrically connected but improves convection cooling.

Can XCV300-6PQ240C interface directly with DDR SDRAM using its SelectIO™ pins?

Yes, XCV300-6PQ240C supports SSTL2 Class I/II (1.25 V) and SSTL3 Class I/II (1.5 V) standards required for DDR SDRAM interfaces. However, the PQ240 package's globally bonded VCCO restricts all I/O banks to one voltage-so DDR data/address lines must use SSTL2 with 2.5 V VCCO, while control signals (CKE, CS#) may require external level translation if sourced from 3.3 V logic.

Does XCV300-6PQ240C support partial reconfiguration or dynamic function swapping?

No, XCV300-6PQ240C does not support partial reconfiguration. Its SRAM-based configuration is loaded entirely at startup via JTAG, SelectMAP™, or serial PROM. Bitstream updates require full reconfiguration, causing temporary I/O tri-state and logic reset. Dynamic function swapping must be implemented in logic (e.g., multiplexed datapaths), not at the configuration level.

What JTAG boundary-scan capabilities does XCV300-6PQ240C provide for production testing?

XCV300-6PQ240C implements IEEE 1149.1 boundary-scan with 218-bit instruction register and full pin-level visibility. It supports EXTEST (interconnect test), SAMPLE/PRELOAD (I/O state capture), and BYPASS modes. The TAP controller operates at up to 25 MHz, enabling automated PCB test fixture validation and solder-joint integrity verification without functional firmware.