AMD XCV300E-6BG352C

Overview

XCV300E-6BG352C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 411,955 system gates and 6,912 logic cells in a 32 × 48 CLB array. It features eight digital Delay-Locked Loops (DLLs), 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz I/O standards. It is used in high-speed communication interface design and embedded signal processing systems.

For engineers reviewing the XCV300E-6BG352C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and package-specific routing limitations - all confirmed for the BG352 package and -6 speed grade.

Technical Context

The XCV300E-6BG352C implements a regular array architecture with Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

I/O functionality is organized into eight voltage-isolated banks, each supporting mixed standards only when sharing the same VCCO (e.g., LVTTL + PCI33_3 at 3.3 V) and at most one VREF voltage. The device uses VCCINT = 1.8 V for core logic and supports 3 V–tolerant I/O pins, with external 100 Ω resistors enabling 5 V tolerance where required.

Key Specifications

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0 °C to +85 °C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Compared with XCV300E-6BG352C, the -7 variant improves maximum operating frequency by ~12% without changing power or I/O capability, while the XCV400E-6BG352C adds 38% more logic and 25% more block RAM - both retain identical BG352 mechanical fit and thermal profile.

Availability

XCV300E-6BG352C is available at Aetrix Electronics and suitable for high-speed serial interface design, PCI bridging, real-time video processing, and multi-standard memory controller applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for XCV300E-6BG352C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density logic implementation in communications infrastructure, test equipment, and military/aerospace systems - emphasizing speed, I/O flexibility, and on-chip memory integration.

FAQ

What is the maximum differential I/O pair count supported by XCV300E-6BG352C?

XCV300E-6BG352C supports up to 137 differential I/O pairs, as specified in Table 1 of DS022-1. This count is fixed for the XCV300E device regardless of package; the BG352 variant realizes 260 total user I/O pins, of which 137 may be configured as differential pairs (e.g., LVDS or LVPECL). Pin assignment must comply with I/O banking rules - differential pairs must reside entirely within the same bank and share common VCCO.

Does XCV300E-6BG352C support JTAG boundary scan for in-system programming?

Yes, XCV300E-6BG352C includes full IEEE 1149.1-compliant boundary scan logic. The TCK, TMS, TDI, and TDO pins are dedicated and documented in Module 4 (Pinout Tables) of DS022-4. This enables in-system configuration via JTAG, post-configuration testing, and visibility into I/O pin states during debug - critical for validating high-speed interface timing without physical probes.

Can XCV300E-6BG352C interface directly with 5 V logic devices?

XCV300E-6BG352C I/O pins are 3 V tolerant by default. To interface with 5 V logic, an external 100 Ω series resistor must be placed on each input line to limit current and prevent damage; this configuration is explicitly validated in DS022-1 Section "I/O pins are 3 V tolerant, and can be 5 V tolerant with an external 100 Ω resistor." PCI 5 V signaling is not supported.

What clock frequencies can the DLLs in XCV300E-6BG352C generate?

The eight DLLs in XCV300E-6BG352C support 4× frequency multiplication and division, enabling output frequencies up to 300+ MHz from LVPECL/LVDS inputs. Per DS022-1, they provide zero-delay conversion of high-speed differential clocks to any I/O standard and digitally synthesize 50% duty cycle outputs - essential for DDR source-synchronous capture at 133 MHz data rates.

Is XCV300E-6BG352C pin-compatible with other Virtex-E devices in BG352 packaging?

Yes, XCV300E-6BG352C is pin-compatible with XCV200E-6BG352C and XCV400E-6BG352C per DS022-1: "The same device in the same package for the Virtex-E and Virtex families are pin-compatible with some minor exceptions." All BG352 Virtex-E variants share identical ball map, power pin locations, and I/O bank assignments - enabling hardware reuse across density tiers with only bitstream recompilation.