AMD XCV300E-6BG352I

Overview

XCV300E-6BG352I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 352-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communications infrastructure.

For engineers reviewing the XCV300E-6BG352I datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-voltage reprogrammable logic solution for telecom line cards, test equipment controllers, and embedded vision preprocessing pipelines requiring deterministic timing and multi-standard I/O flexibility.

Technical Context

The XCV300E-6BG352I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.

Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×. I/O banks support mixed voltage standards-including LVTTL, SSTL3, HSTL, LVDS, and LVPECL-with VCCO-supplied output buffers and VREF-dependent input thresholds, constrained by bank-level voltage isolation rules.

Key Specifications

Pinout & Package

Package: 352-ball Fine-Pitch Ball Grid Array (BG352), 1.27 mm pitch, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV300E-6BG352I, the –7 variant delivers higher performance within identical power and footprint constraints, while the XCV400E-6BG352I offers scalable logic and I/O headroom-both retain pin compatibility and DLL/SelectRAM architecture, simplifying migration paths for timing-critical or capacity-constrained designs.

Availability

XCV300E-6BG352I is available at Aetrix Electronics and suitable for telecom infrastructure, automated test equipment, medical imaging subsystems, and industrial motion control requiring stable component supply across extended product lifecycles.

Supply support for XCV300E-6BG352I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed specifically for high-speed, high-density reconfigurable computing in communications and instrumentation, emphasizing low-voltage operation (1.8 V core), multi-standard I/O, and deterministic clock management.

FAQ

What is the maximum differential I/O pair count supported by XCV300E-6BG352I?

XCV300E-6BG352I supports up to 137 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capability enables high-bandwidth serial links such as LVDS camera interfaces or backplane interconnects, with each pair consuming two physical balls in the BG352 package layout.

Does XCV300E-6BG352I support JTAG configuration mode?

Yes, XCV300E-6BG352I supports IEEE 1149.1 JTAG configuration via TCK, TMS, TDI, and TDO pins. This mode allows in-system programming, boundary-scan testing, and debug access without requiring external configuration PROMs or microcontrollers.

What is the purpose of the die-temperature sensor diode in XCV300E-6BG352I?

The die-temperature sensor diode in XCV300E-6BG352I provides analog voltage output proportional to junction temperature, enabling real-time thermal monitoring. This feature supports dynamic thermal throttling in fanless telecom or industrial enclosures where ambient conditions vary widely.

Can XCV300E-6BG352I operate with 5 V tolerant I/Os?

No, XCV300E-6BG352I I/Os are not 5 V tolerant by default. They support 3.3 V LVTTL/PCI and 2.5 V/1.8 V standards. With an external 100 Ω series resistor, certain pins may tolerate 5 V signals, but PCI 5 V compliance is explicitly excluded per DS022-1 Section "Virtex-E Compared to Virtex Devices".

Is XCV300E-6BG352I pin-compatible with earlier Virtex family devices?

XCV300E-6BG352I is pin-compatible with equivalent Virtex devices in the same BG352 package, with minor exceptions documented in the pinout section of DS022-4. However, it is not bitstream-compatible due to architectural differences including 1.8 V VCCINT and revised banking rules for VCCO/VREF assignment.