AMD XCV300E-6BG432C

Overview

XCV300E-6BG432C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 432-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communications infrastructure.

For engineers reviewing the XCV300E-6BG432C datasheet, pinout, applications, or equivalent options, this device is selected for high-density, high-speed programmable logic implementations requiring deterministic clock management, differential I/O, and multi-standard interface support in telecom and test equipment.

Technical Context

The XCV300E-6BG432C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, set/reset, and polarity control.

Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×. The IOBs support 20 I/O standards-including LVDS, LVPECL, SSTL, HSTL, and PCI-with banked VCCO/VREF constraints, and each I/O pad includes programmable weak-keeper, pull-up/down, and ESD protection.

Key Specifications

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 1.0 mm pitch, RoHS-compliant, thermally enhanced for industrial temperature operation (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV300E-6BG432C, the -7 variant improves timing margin without changing power or thermal behavior, while the XCV400E-6BG432C offers scalable logic and memory headroom within identical board space-both retain full pin compatibility and I/O banking structure.

Availability

XCV300E-6BG432C is available at Aetrix Electronics and suitable for wireless infrastructure, automated test equipment, PCI-based data acquisition, and industrial protocol bridging requiring stable component supply across extended product lifecycles.

Supply support for XCV300E-6BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in telecommunications, computing, and instrumentation-emphasizing speed, I/O flexibility, and system-level integration over cost-optimized alternatives.

FAQ

What is the maximum LVDS data rate supported by XCV300E-6BG432C?

XCV300E-6BG432C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Differential Signalling Support". This rate applies to source-synchronous architectures using dedicated LVDS I/O pairs, with proper PCB layout and termination. The device's eight DLLs ensure precise clock recovery and skew control essential for reliable high-speed LVDS links.

Does XCV300E-6BG432C support true dual-port block RAM?

Yes, XCV300E-6BG432C supports true dual-port operation in its 4096-bit block RAM modules, as documented in DS022-2 (v2.8) Section "Block SelectRAM". Each block allows independent read and write access on separate ports with no contention, enabling applications such as FIFOs, ping-pong buffers, and memory-mapped peripherals without arbitration logic.

Is XCV300E-6BG432C pin-compatible with other Virtex-E devices in BG432 packaging?

XCV300E-6BG432C is pin-compatible with XCV200E-6BG432C and XCV400E-6BG432C in the same BG432 package, as stated in DS022-1 (v2.3) Section "Virtex-E Compared to Virtex Devices". However, I/O banking assignments and VCCO/VREF pin allocations differ across densities, so board-level reuse requires verification of bank-specific voltage and standard constraints.

What configuration modes does XCV300E-6BG432C support?

XCV300E-6BG432C supports master serial, slave serial, SelectMAP, and JTAG configuration modes, as specified in DS022-1 (v2.3) Section "General Description". JTAG mode enables boundary-scan testing and in-system programming; SelectMAP allows high-speed parallel loading via microprocessor bus; master serial uses an external PROM for autonomous startup.

What is the core supply voltage requirement for XCV300E-6BG432C?

XCV300E-6BG432C requires a 1.8 V ± 3% core supply (VCCINT), as defined in DS022-1 (v2.3) Section "Virtex-E Compared to Virtex Devices". This lower voltage versus prior Virtex families reduces dynamic power consumption and enables higher integration density using the 0.18 μm process. Decoupling capacitors must be placed within 1 cm of each VCCINT ball.