AMD XCV300E-6BG432I

Overview

XCV300E-6BG432I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 432-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V/66 MHz interfaces for high-speed communication subsystems in industrial embedded systems.

For engineers reviewing the XCV300E-6BG432I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and industrial-grade (-40°C to +100°C) thermal performance data directly traceable to DS022-1 (v2.3) and DS022-2 (v2.8).

Technical Context

The XCV300E-6BG432I implements a regular array architecture with configurable logic blocks (CLBs) containing four logic cells each-each cell integrating a 4-input LUT, dedicated carry chain, and dual-mode storage element (flip-flop or latch). Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and 4× frequency multiplication, enabling precise clock domain control across mixed-signaling I/O banks.

I/O functionality is partitioned into eight voltage-isolated banks, each supporting independent VCCO (1.5–3.3 V) and optional VREF (0.75–1.5 V) supplies. Supported standards include LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL-with differential I/O pairs capable of 622 Mb/s operation and full IEEE 1149.1 boundary-scan compliance.

Key Specifications

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV300E-6BG432I, XCV300E-6FG456I offers higher I/O count in a physically larger package requiring layout change, while XCV400E-6BG432I delivers 38% more logic in identical BG432 packaging-making it the preferred upgrade path for capacity-constrained designs.

Availability

XCV300E-6BG432I is available at Aetrix Electronics and suitable for industrial motion control, high-speed communication backplanes, PCI-based data acquisition, and defense radar signal processing requiring stable component supply across extended lifecycle programs.

Supply support for XCV300E-6BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered SRAM-based FPGA architectures and advanced system-level integration tools.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in industrial, aerospace, and communications infrastructure-emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count.

FAQ

What is the maximum differential I/O pair count supported by XCV300E-6BG432I?

XCV300E-6BG432I supports up to 137 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capability enables implementation of multiple high-speed differential interfaces such as LVDS camera links or serializer/deserializer channels without external transceivers. The actual usable count depends on bank allocation and VCCO/VREF constraints per I/O standard.

Does XCV300E-6BG432I support true dual-port block RAM operation?

Yes, XCV300E-6BG432I supports true dual-port block RAM operation. Each of its 32 block RAM units (131,072 total bits) provides independent read and write ports with separate address, data, and control lines-enabling simultaneous access for applications like FIFO buffering or ping-pong memory staging. This is explicitly documented in DS022-2 (v2.8) Section "Block SelectRAM".

What clock frequencies can XCV300E-6BG432I achieve with its DLLs?

XCV300E-6BG432I's eight digital DLLs support input clock frequencies up to 300+ MHz for LVPECL and LVDS standards, with 4× multiplication capability. Synchronous system clock rates reach 240 MHz including I/O, and internal performance achieves 130 MHz across four LUT levels, as specified in DS022-1 (v2.3) Performance section and DLL timing tables.

Is XCV300E-6BG432I pin-compatible with earlier Virtex family FPGAs?

No, XCV300E-6BG432I is not bitstream- or pin-compatible with original Virtex devices. While some packages share physical footprints (e.g., BG432), banking rules differ significantly: Virtex-E uses VCCO-powered I/O buffers instead of VCCINT, and pin functions like VREF assignment and clock routing are redefined. DS022-1 explicitly states "The Virtex-E family is not bitstream-compatible with the Virtex family."

What is the role of the die-temperature sensor diode in XCV300E-6BG432I?

The die-temperature sensor diode in XCV300E-6BG432I provides calibrated on-die thermal monitoring with ±5°C accuracy across the full -40°C to +100°C industrial operating range. It enables real-time thermal throttling, fan speed control, and reliability logging in sealed or convection-cooled enclosures-documented in DS022-1 (v2.3) Features and DS022-2 (v2.8) Architectural Description.