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AMD XCV300E-6FG256C
- Part No.:
- XCV300E-6FG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XCV300E-6FG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,209
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Product details
Overview
XCV300E-6FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 176 user I/O pins in a 256-ball Fine-Pitch Ball Grid Array (FG256) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz interfaces for high-speed communication subsystems.
For engineers reviewing the XCV300E-6FG256C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-voltage programmable logic solution for telecom line cards, video processing pipelines, and embedded control systems requiring deterministic timing, multi-standard I/O, and reconfigurable hardware acceleration.
Technical Context
The XCV300E-6FG256C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four 4-input LUTs with dedicated carry logic, dual flip-flops per slice, and F5/F6 multiplexers enabling 5- to 6-input functions.
Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL-with banked VCCO and VREF management. Eight fully digital DLLs provide clock multiply/divide, 50% duty-cycle synthesis for DDR, and zero-delay conversion of high-speed LVPECL/LVDS clocks to any I/O standard.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 411,955 - defines total logic capacity for complex digital system integration |
| Logic Cells | 6,912 - provides granular, routable logic resources for register-rich or combinatorial-heavy designs |
| User I/O Pins | 176 - enables high-bandwidth parallel interfaces such as DDR SDRAM, ZBT SRAM, or multi-lane source-synchronous links |
| Block RAM Bits | 131,072 - supports true dual-port memory configurations for FIFOs, frame buffers, or lookup tables without external memory |
| DLL Count | 8 - allows independent clock domain management for multiple high-speed interfaces (e.g., LVDS + PCI + DDR) |
| Max I/O Speed | 622 Mb/s (LVDS) - enables point-to-point serial links compliant with SONET OC-12 or Gigabit Ethernet PHY timing |
| Internal Performance | 130 MHz (4-LUT levels) - delivers predictable timing closure for synchronous datapaths in signal processing or packet forwarding |
| VCCINT | 1.8 V - reduces dynamic power consumption by ~40% vs. 2.5 V Virtex devices while maintaining performance |
Pinout & Package
Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Dedicated low-skew inputs for DLL-driven clock distribution across entire FPGA fabric |
| VCCINT | Core Power Supply | 1.8 V supply for CLBs, block RAM, and DLLs; requires tight regulation and local decoupling |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 1.5–3.3 V supplies enabling mixed-voltage I/O (e.g., LVDS + LVTTL on same device) |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/LVCMOS input receivers; must be externally sourced and stable |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for configuration, debugging, and production testing |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz-enables direct interfacing to memory, processors, and serial PHYs without level shifters |
| SelectRAM+™ Memory Hierarchy | 131,072-bit block RAM + 98,304-bit distributed RAM-provides true dual-port memory for ping-pong buffering and real-time data flow control |
| Digital Delay-Locked Loops (DLLs) | Eight independent DLLs with 4× multiplication, duty-cycle correction, and LVPECL/LVDS clock input support-eliminates external clock synthesizers in multi-clock domain systems |
| Carry Chain & Arithmetic Logic | Dedicated fast carry chain per CLB slice plus XOR/AND gates-accelerates adders, counters, and multiplier accumulation without LUT resource penalty |
| SRAM-Based In-System Configuration | Unlimited reprogramming via JTAG, SelectMAP™, or master serial mode-supports field-upgradable logic, partial reconfiguration, and secure bitstream loading |
Applications
| Telecom Line Card Interface | High-Speed Video Processing |
|---|---|
Use Scenario: Aggregating multiple T1/E1 or STM-1 streams into a single backplane interface using source-synchronous framing. IC Role / Device Role / Timing Role: FPGA acts as protocol mapper and elastic store buffer, synchronizing asynchronous tributaries to a common system clock via DLL-managed domains. Use Value: 176 I/O pins and LVDS support enable 32-channel parallel bus or 8-lane LVDS link; 131 kbit block RAM stores jitter-tolerant frame buffers. | Use Scenario: Real-time 1080p60 video scaling, color space conversion, and on-the-fly compression in broadcast equipment. IC Role / Device Role / Timing Role: Configurable pixel pipeline processor with synchronized DDR SDRAM controller and dual-port frame buffers. Use Value: 130 MHz internal performance sustains 160+ MHz pixel clocks; true dual-port block RAM enables concurrent read/write for motion estimation and display output. |
| PCI-Based Industrial Controller | Reconfigurable Test Instrumentation |
Use Scenario: Embedded motion control module with PCI host interface, encoder feedback capture, and PWM motor drive generation. IC Role / Device Role / Timing Role: System-on-chip integrating PCI target interface, quadrature decoder logic, and high-resolution PWM generator with deterministic latency. Use Value: PCI 33/66 MHz compliance ensures plug-and-play compatibility; 6,912 logic cells implement closed-loop PID controllers and safety monitoring state machines. | Use Scenario: Modular automated test equipment (ATE) platform supporting multiple DUT interface standards via runtime-reconfigurable I/O banks. IC Role / Device Role / Timing Role: Reconfigurable I/O adapter managing LVDS, HSTL, and LVTTL test vectors with precise timing alignment across channels. Use Value: SelectI/O+™ banking allows simultaneous use of 3.3 V LVTTL (for legacy DUTs) and 1.5 V HSTL (for DDR memory tests); DLLs align strobes to ±50 ps accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300E-7FG256C | Same architecture and pinout, but -7 speed grade offers 15% faster internal timing (e.g., 150 MHz vs. 130 MHz register-to-register) and tighter setup/hold margins | Better suited for designs pushing maximum clock frequency or requiring margin for process variation at high temperature | Select XCV300E-7FG256C when timing closure requires additional slack; otherwise XCV300E-6FG256C provides optimal cost/performance balance |
| XCV400E-6FG256C | Higher density (569,952 system gates, 10,800 logic cells), same FG256 package and I/O count, but larger die and higher static power | Enables more complex logic partitioning (e.g., integrated soft-core CPU + peripherals) without changing PCB layout | Choose XCV400E-6FG256C only if design exceeds XCV300E-6FG256C resource utilization; no performance gain per MHz over XCV300E-6FG256C |
Compared with XCV300E-6FG256C, the -7 variant improves timing margin without layout change, while the XCV400E-6FG256C adds gate count headroom at the cost of increased power and thermal load-neither is pin-compatible with newer Virtex-II or Spartan families.
Availability
XCV300E-6FG256C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial automation controllers, and test instrumentation requiring stable component supply and long-term obsolescence management.
Supply support for XCV300E-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and toolchain development for high-performance digital system design.
The Virtex-E family was designed for high-speed, high-density reconfigurable computing in communications and signal processing applications, targeting 1.8 V operation, multi-standard I/O, and integrated clock management to replace ASICs in prototyping and low-volume production.
FAQ
What is the maximum LVDS data rate supported by XCV300E-6FG256C?
XCV300E-6FG256C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Features" and validated by its differential I/O capability and DLL-assisted clock recovery. This rate enables compliance with OC-12 SONET and Gigabit Ethernet physical layer timing requirements when used with appropriate external termination and PCB layout practices.
Does XCV300E-6FG256C support true dual-port block RAM?
Yes, XCV300E-6FG256C implements true dual-port block RAM with independent read/write addresses, enables, and clocks per port. As specified in DS022-2 (v2.8) Module 2, each 4096-bit block supports simultaneous access-critical for applications like video frame buffering, FIFOs, and memory-mapped peripheral interfaces where concurrent read and write operations are required.
How many Delay-Locked Loops (DLLs) does XCV300E-6FG256C contain?
XCV300E-6FG256C contains eight fully digital Delay-Locked Loops (DLLs), as documented in DS022-1 (v2.3) "Features" and DS022-2 (v2.8) "Architectural Description". These DLLs provide clock multiplication, division, duty-cycle correction, and zero-delay clock conversion-enabling precise synchronization across multiple I/O standards and internal logic domains.
Is XCV300E-6FG256C pin-compatible with other Virtex-E devices in the FG256 package?
XCV300E-6FG256C shares the same FG256 package footprint and pin assignment with other Virtex-E devices offered in that package, including XCV200E-6FG256C and XCV400E-6FG256C. However, I/O bank voltage assignments, VREF pin usage, and internal resource mapping differ-requiring board-level verification before substitution.
What configuration modes are supported by XCV300E-6FG256C?
XCV300E-6FG256C supports master serial (via external PROM), slave serial, SelectMAP™ (parallel), and IEEE 1149.1 JTAG configuration modes. These are detailed in DS022-1 (v2.3) "General Description" and DS022-2 (v2.8) "Configurable Logic Blocks", enabling flexible programming during development, production, and field updates.
XCV300E-6FG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 6912
- Total RAM Bits:
- 131072
- Number of I/O:
- 176
- Number of Gates:
- 411955
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XCV300E-6FG256C FAQ
1.How can I place an order for XCV300E-6FG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV300E-6FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV300E-6FG256C reliable?
The price and inventory of XCV300E-6FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300E-6FG256C is usually 5 days.
3.What payment methods are accepted for XCV300E-6FG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300E-6FG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV300E-6FG256C?
XCV300E-6FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV300E-6FG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV300E-6FG256C?
For technical support, including XCV300E-6FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300E-6FG256C requirements.
6.How does Aetrix verify that XCV300E-6FG256C is sourced from the original manufacturer or authorized distributors?
All XCV300E-6FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300E-6FG256C meets industry standards.
7.What is the process for return or replacement of XCV300E-6FG256C?
All XCV300E-6FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300E-6FG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV300E-6FG256C part is unused and in its original packaging.
Return procedure for XCV300E-6FG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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