AMD XCV300E-6FG256C0773

Overview

XCV300E-6FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 32 × 48 CLB array. It delivers up to 240 MHz synchronous system performance, supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops (DLLs) for clock management - used in high-speed communications and embedded signal processing systems.

For engineers reviewing the XCV300E-6FG256C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration options, and precise FG256 package mapping - all confirmed against DS022-1 (v3.0) and DS022-4 pinout documentation.

Technical Context

The XCV300E-6FG256C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice - enabling high-speed arithmetic and wide-input logic functions.

Its IOBs support 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, PCI33_3, LVDS, and LVPECL, with banked VCCO/VREF dependencies. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication - all operating independently per bank.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG256) with 1.0 mm pitch, 256-ball layout, and 16 × 16 array. Thermal pad optional; RoHS-compliant lead-free finish per DS022-4 Module 4.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV300E-6FG256C, the -7 variant offers improved timing margin without changing pinout or power delivery, while XCV400E-6FG256C provides scalable logic capacity within identical FG256 packaging - enabling PCB reuse with higher gate count.

Availability

XCV300E-6FG256C is available at Aetrix Electronics and suitable for high-reliability industrial control, legacy telecom infrastructure, and aerospace avionics programs requiring stable component supply and long-term lifecycle support.

Supply support for XCV300E-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, low-power reconfigurable computing in communications infrastructure and embedded signal processing - emphasizing I/O flexibility, clock management, and memory hierarchy.

FAQ

Is XCV300E-6FG256C still in production?

No, XCV300E-6FG256C is obsolete per Xilinx Notice XCN09001 and XCN12026 (March 2014). Aetrix Electronics maintains limited legacy inventory and supports obsolescence mitigation through cross-reference analysis, second-source qualification, and lifetime buy planning for XCV300E-6FG256C.

What are the key power supply requirements for XCV300E-6FG256C?

XCV300E-6FG256C requires two regulated supplies: VCCINT = 1.8 V ±3% for core logic and DLLs, and VCCO = 1.5–3.3 V (per I/O bank) for interface signaling. Each of the eight I/O banks needs independent VCCO filtering; VCCINT must be sequenced before VCCO during power-up.

Does XCV300E-6FG256C support JTAG boundary scan?

Yes, XCV300E-6FG256C implements full IEEE 1149.1 boundary scan with TCK, TMS, TDI, and TDO pins. It supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions - enabling board-level interconnect testing and in-system configuration via JTAG.

Can XCV300E-6FG256C interface directly with 5 V TTL devices?

No, XCV300E-6FG256C I/O pins are not 5 V tolerant. While LVTTL inputs accept 3.3 V signals, direct connection to 5 V logic requires external level-shifting circuitry - such as resistor-divider networks or dedicated translators - to avoid damage or incorrect logic thresholds.

How many DLLs does XCV300E-6FG256C include, and what are their primary functions?

XCV300E-6FG256C includes eight fully digital Delay-Locked Loops (DLLs). They provide clock deskew, zero-delay conversion of LVPECL/LVDS inputs to internal clocks, 4× frequency multiplication, and 50% duty-cycle correction - essential for DDR I/O and source-synchronous interfaces.