AMD XCV300E-6FG256I

Overview

XCV300E-6FG256I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 32 × 48 CLB array. It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels) for high-speed digital signal processing and communication infrastructure applications.

For engineers reviewing the XCV300E-6FG256I datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-power reprogrammable logic solution optimized for PCI-compliant 33/66-MHz interfaces, DDR memory controllers, and source-synchronous data transmission architectures requiring deterministic clock management and flexible I/O banking.

Technical Context

The XCV300E-6FG256I implements a regular FPGA architecture with configurable logic blocks (CLBs) and input/output blocks (IOBs) interconnected via a general routing matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice supporting synchronous/asynchronous set/reset.

Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×. I/O banks support mixed voltage standards (e.g., LVTTL, SSTL3, HSTL, LVDS) with bank-specific VCCO and shared VREF, enabling concurrent interface protocols on a single device.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG256) with 256 balls, 1.0 mm pitch, and industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV300E-6FG256I, XCV300E-6PQ240I trades I/O bandwidth for simpler assembly and lower cost, while XCV400E-6FG256I offers scalable logic capacity within identical mechanical and thermal constraints - both require functional verification but no pinout or layout changes.

Availability

XCV300E-6FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and embedded test equipment requiring stable component supply, long-term lifecycle support, and guaranteed industrial-temperature operation.

Supply support for XCV300E-6FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-E product line was engineered for high-speed, high-density reconfigurable computing in communications and networking applications, emphasizing I/O flexibility, clock management, and memory integration - directly addressing the needs of PCI, DDR, and source-synchronous interface designers.

FAQ

What is the maximum differential I/O pair count supported by XCV300E-6FG256I?

XCV300E-6FG256I supports up to 137 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This enables high-bandwidth LVDS or BLVDS interfaces for applications such as backplane interconnects or camera sensor links. The FG256 package allocates pins to meet this count while maintaining signal integrity through controlled impedance routing.

Does XCV300E-6FG256I support true dual-port block RAM?

Yes, XCV300E-6FG256I includes 32 block RAM units totaling 131,072 bits, each configured as true dual-port synchronous RAM with independent read/write addresses and control signals per port. This capability is documented in DS022-2 (v2.8) Section "Block SelectRAM" and enables concurrent memory access for applications like video frame buffering and protocol translation engines.

What clock management resources does XCV300E-6FG256I provide?

XCV300E-6FG256I integrates eight fully digital Delay-Locked Loops (DLLs) supporting clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of high-speed LVPECL/LVDS inputs. These DLLs are detailed in DS022-1 Section "High-Performance Built-In Clock Management Circuitry" and are essential for synchronizing multi-rate I/O interfaces without external PLLs.

Is XCV300E-6FG256I pin-compatible with other Virtex-E devices in the FG256 package?

XCV300E-6FG256I shares the FG256 package footprint with XCV200E-6FG256I and XCV400E-6FG256I, but pin assignments differ due to varying I/O counts and bank configurations. DS022-4 (Pinout Tables) confirms that while mechanical compatibility exists, electrical connectivity and bank voltage assignments are device-specific - requiring schematic and layout review before substitution.

What I/O standards are supported by XCV300E-6FG256I for PCI compliance?

XCV300E-6FG256I supports full 3.3 V PCI compliance for both 33 MHz and 66 MHz operation, as stated in DS022-1 Section "Features". Its SelectI/O+™ technology enables LVTTL I/O with 16 mA drive strength and fast slew rate, meeting PCI signaling requirements without external bus terminators or level shifters.