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AMD XCV300E-6FG456C
- Part No.:
- XCV300E-6FG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XCV300E-6FG456C.pdf
- Description:
- IC FPGA 312 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,273
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Product details
Overview
XCV300E-6FG456C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 411,955 system gates, 6,912 logic cells, and 316 user I/O pins in a 456-ball Fine-Pitch Ball Grid Array (FG456) package. It integrates eight digital Delay-Locked Loops (DLLs), up to 131,072 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems.
For engineers reviewing the XCV300E-6FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (130 MHz internal performance), 1.8 V core voltage with 3.3 V I/O tolerance, dual-port block RAM configuration, DLL-based clock management, and compatibility with Xilinx Foundation™ and Alliance Series™ design tools.
Technical Context
The XCV300E-6FG456C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, set/reset, and polarity control.
Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL-organized across eight I/O banks with bank-specific VCCO and VREF requirements. The device uses eight fully digital DLLs for zero-delay clock conversion, duty-cycle correction, and frequency multiplication, enabling DDR timing and high-speed source-synchronous data capture.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 411,955 - defines total logic capacity for complex digital systems |
| Logic Cells | 6,912 - provides granular, routable logic resources for HDL synthesis | User I/O Pins | 316 - enables high-bandwidth parallel interfaces and multi-standard I/O banking |
| Block RAM Bits | 131,072 - supports true dual-port memory configurations up to 256 × 512 per block |
| Internal Performance | 130 MHz (4 LUT levels) - sets maximum synchronous register-to-register path speed |
| Core Voltage (VCCINT) | 1.8 V - reduces dynamic power vs. 2.5 V Virtex, enabling higher density at lower thermal load |
| Speed Grade | -6 - guarantees timing closure for critical paths at specified voltage/temperature conditions |
Pinout & Package
The XCV300E-6FG456C is housed in a 456-ball Fine-Pitch Ball Grid Array (FG456) package with 0.8 mm pitch, supporting high I/O count and thermal dissipation for dense FPGA applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew inputs routed to all eight DLLs for synchronized domain control |
| VCCINT | Core Power Supply | 1.8 V supply for CLBs, RAM, and routing; decoupling required per Xilinx layout guidelines |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 1.5–3.3 V supplies enabling mixed-voltage I/O standards within each bank |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-level reference for SSTL/HSTL/LVCMOS input buffers; must be externally sourced and stable |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for programming and in-system verification |
Key Features
| Feature | Design Value |
|---|---|
| Eight Digital DLLs | Enables precise clock deskew, 50% duty cycle generation for DDR, and 4× frequency multiplication without external PLL |
| SelectRAM+™ Hierarchy | Combines 131,072-bit block RAM (true dual-port, configurable depth/width) with 98,304-bit distributed RAM for flexible memory mapping |
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s) and LVPECL with bank-isolated VCCO/VREF for mixed-signal interface integration |
| SRAM-Based Configuration | Allows unlimited in-system reprogramming via JTAG, SelectMAP, or master serial mode using external PROM |
| Dedicated Carry & Multiplier Logic | Accelerates arithmetic-intensive functions (e.g., FIR filters, FFT engines) with hardware-optimized adders and wide-input cascading |
Applications
| High-Speed Data Acquisition | PCI Express Endpoint Interface |
|---|---|
Use Scenario: Capturing 16-bit parallel ADC streams at 100+ MSPS with real-time buffering and preprocessing. IC Role / Device Role / Timing Role: FPGA acts as high-throughput data concentrator and preprocessor, using LVDS inputs and block RAM for ping-pong buffering. Use Value: 622 Mb/s LVDS I/O and 131,072-bit dual-port block RAM enable sustained capture without host CPU bottleneck. | Use Scenario: Implementing a compliant 32-bit, 66 MHz PCI bus master for embedded vision processing cards. IC Role / Device Role / Timing Role: XCV300E-6FG456C serves as PCI protocol engine and DMA controller, interfacing with local SDRAM and image sensors. Use Value: Native PCI 3.3 V compliance, 316 I/O pins, and DLL-controlled setup/hold timing ensure reliable 264 MB/s burst transfers. |
| Telecom Line Card Control | Industrial Motion Controller |
Use Scenario: Managing multiple T1/E1 framers and jitter attenuation in carrier-grade line cards. IC Role / Device Role / Timing Role: FPGA provides clock domain crossing, HDLC framing, and LVPECL clock distribution using integrated DLLs. Use Value: LVPECL clock inputs (300+ MHz), eight DLLs, and 1.8 V core reduce jitter accumulation and power in timing-critical telecom PHY layers. | Use Scenario: Coordinating multi-axis servo drives with synchronized PWM generation and encoder feedback decoding. IC Role / Device Role / Timing Role: XCV300E-6FG456C executes real-time motion algorithms, generates isolated gate drive signals, and processes quadrature encoder inputs. Use Value: Dedicated carry logic, abundant registers with clock enable, and 316 I/Os support deterministic sub-microsecond loop timing and hardware-accelerated trajectory calculation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV300E-7FG456C | Same architecture and pinout, but -7 speed grade offers tighter timing margins (125 ps faster register-to-register delay) | Better suited for designs requiring >130 MHz internal clocks or marginal timing closure | Select when timing margin is critical and board layout supports same FG456 footprint |
| XCV400E-6FG456C | Higher density (569,952 system gates, 10,800 logic cells), same package and speed grade | Enables larger logic partitions, more embedded memory, or additional IP cores without PCB change | Choose for future-proofing or incremental design scaling where FG456 mechanical constraints apply |
Compared with XCV300E-6FG456C, the -7 variant improves worst-case timing closure while maintaining identical I/O and memory resources, whereas the XCV400E-6FG456C increases logic capacity by 38% and block RAM by 25% within the same package-making it suitable for feature-extended derivatives without layout revision.
Availability
XCV300E-6FG456C is available at Aetrix Electronics and suitable for high-speed data acquisition, PCI interface design, telecom line card development, and industrial motion control requiring stable component supply and long-term obsolescence management.
Supply support for XCV300E-6FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance programmable logic solutions for demanding communications and computing applications.
The Virtex-E product line was designed specifically for high-speed, high-density digital systems requiring advanced clock management, multi-standard I/O, and scalable embedded memory-targeting telecom infrastructure, test equipment, and industrial automation.
FAQ
What is the core voltage requirement for XCV300E-6FG456C?
The XCV300E-6FG456C requires a 1.8 V ±3% supply on VCCINT for internal logic and memory operation. This lower core voltage reduces dynamic power versus earlier 2.5 V FPGAs while maintaining performance. Decoupling capacitors must be placed per Xilinx DS022 layout recommendations to ensure stable rail integrity under switching loads.
Does XCV300E-6FG456C support LVDS I/O at 622 Mb/s?
Yes, XCV300E-6FG456C supports LVDS signaling at up to 622 Mb/s as specified in DS022-1. Its SelectI/O+™ technology enables differential I/O on dedicated pairs, with matched internal delays and termination support. Full compliance requires proper PCB layout (controlled impedance, length matching) and external 100 Ω differential termination.
How many block RAMs does XCV300E-6FG456C contain?
XCV300E-6FG456C contains 32 block RAMs totaling 131,072 bits. Each block is a true dual-port 4096-bit memory with independent read/write addresses and controls, configurable for depths from 16 to 4096 and widths up to 36 bits per port. These blocks are arranged in columns aligned with CLB arrays as defined in DS022-2 Table 3.
Is XCV300E-6FG456C pin-compatible with other Virtex-E devices in FG456 packaging?
XCV300E-6FG456C shares the FG456 package footprint with XCV200E-6FG456C and XCV400E-6FG456C, but pin functions differ due to varying I/O counts and bank allocations. While mechanical mounting is identical, signal mapping is device-specific-requiring netlist and constraint file updates when migrating between densities.
What configuration modes are supported by XCV300E-6FG456C?
XCV300E-6FG456C supports JTAG (IEEE 1149.1), Master Serial (via external PROM), Slave Serial, and SelectMAP™ configuration modes. JTAG is used for programming and boundary-scan testing; Master Serial enables autonomous boot; SelectMAP allows high-speed parallel loading from microprocessors or controllers.
XCV300E-6FG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1536
- Number of Logic Elements/Cells:
- 6912
- Total RAM Bits:
- 131072
- Number of I/O:
- 312
- Number of Gates:
- 411955
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XCV300E-6FG456C FAQ
1.How can I place an order for XCV300E-6FG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV300E-6FG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV300E-6FG456C reliable?
The price and inventory of XCV300E-6FG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV300E-6FG456C is usually 5 days.
3.What payment methods are accepted for XCV300E-6FG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV300E-6FG456C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV300E-6FG456C?
XCV300E-6FG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV300E-6FG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV300E-6FG456C?
For technical support, including XCV300E-6FG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV300E-6FG456C requirements.
6.How does Aetrix verify that XCV300E-6FG456C is sourced from the original manufacturer or authorized distributors?
All XCV300E-6FG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV300E-6FG456C meets industry standards.
7.What is the process for return or replacement of XCV300E-6FG456C?
All XCV300E-6FG456C units undergo pre-shipment inspection (PSI). If there is an issue with XCV300E-6FG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV300E-6FG456C part is unused and in its original packaging.
Return procedure for XCV300E-6FG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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